International Conference on Radiation Effects in Insulators

AlixLabs AB today announced completing clean room hook up of R&D equipment for Atomic Layer Etch Pitch Splitting (APS)

Retrieved on: 
Thursday, June 16, 2022
46, Association, AVS, Patent, CTO, ALE, Technology, Director, CEO, International Conference on Radiation Effects in Insulators, Nanostructure, Lithography, Oxford Instruments, ICC, EUV, DSA, International Convention Centre, Board, Immersion, The, United States patent law, SADP, Conference, APS, ALD, Printed circuit board, Aluminium

AlixLabs is now pleased to announce the completed hook-up of Atomic Layer Etch (ALE) equipment in its clean room at ProNano RISE in Lund, Sweden.

Key Points: 
  • AlixLabs is now pleased to announce the completed hook-up of Atomic Layer Etch (ALE) equipment in its clean room at ProNano RISE in Lund, Sweden.
  • The equipment is the original ICP Reactive Etch tool from Oxford Instruments (UK), a Plasmalab 100 used during the original discovery of the APS method.
  • "The next opportunity to meet AlixLabs will be at The AVS 22nd International Conference on Atomic Layer Deposition (ALD 2022), featuring the 9th International Atomic Layer Etching Workshop (ALE 2022).
  • The patent covers methods to split nanostructures in half by a single process step using Atomic Layer Etching (ALE).

AlixLabs AB today announced completing clean room hook up of R&D equipment for Atomic Layer Etch Pitch Splitting (APS)

Retrieved on: 
Thursday, June 16, 2022
46, Association, AVS, Patent, CTO, ALE, Technology, Director, CEO, International Conference on Radiation Effects in Insulators, Nanostructure, Lithography, Oxford Instruments, ICC, EUV, DSA, International Convention Centre, Board, Immersion, The, United States patent law, SADP, Conference, APS, ALD, Printed circuit board, Aluminium

AlixLabs is now pleased to announce the completed hook-up of Atomic Layer Etch (ALE) equipment in its clean room at ProNano RISE in Lund, Sweden.

Key Points: 
  • AlixLabs is now pleased to announce the completed hook-up of Atomic Layer Etch (ALE) equipment in its clean room at ProNano RISE in Lund, Sweden.
  • The equipment is the original ICP Reactive Etch tool from Oxford Instruments (UK), a Plasmalab 100 used during the original discovery of the APS method.
  • "The next opportunity to meet AlixLabs will be at The AVS 22nd International Conference on Atomic Layer Deposition (ALD 2022), featuring the 9th International Atomic Layer Etching Workshop (ALE 2022).
  • The patent covers methods to split nanostructures in half by a single process step using Atomic Layer Etching (ALE).

II-VI Incorporated Extends Ion Implanter Disk Refurbishing Services to Asia With New Multimillion-Dollar Expansion in Taiwan

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Wednesday, May 4, 2022
II-VI Incorporated, II-VI, CS, Maintenance, GLOBE, OEM, Company, IIVI, International Conference on Radiation Effects in Insulators, Silicon, Band gap, Conference, Research, Ownership, Mobile phone, Ceramic

PITTSBURGH, May 04, 2022 (GLOBE NEWSWIRE) -- IIVI Incorporated (Nasdaq: IIVI), the worlds largest ion implant foundry with disk refurbishing services, today announced that it will extend its ion implanter disk refurbishing services to Asia, with a multimillion-dollar expansion in Hsinchu City, Taiwan, which is expected to come online in July 2022.

Key Points: 
  • PITTSBURGH, May 04, 2022 (GLOBE NEWSWIRE) -- IIVI Incorporated (Nasdaq: IIVI), the worlds largest ion implant foundry with disk refurbishing services, today announced that it will extend its ion implanter disk refurbishing services to Asia, with a multimillion-dollar expansion in Hsinchu City, Taiwan, which is expected to come online in July 2022.
  • The expansion in Taiwan will effectively double II-VIs global disk refurbishing capacity.
  • II-VI provides ion implantation services for silicon and compound semiconductor wafers, including heated ion implantation for silicon carbide wafers.
  • II-VI has the full capability to repair, refurbish, and remanufacture any ion implanter disk or heat sink.

Media Alert: Atomera Presenting at the International Conference on Simulation of Semiconductor Processes and Devices 2021 (SISPAD)

Retrieved on: 
Thursday, September 23, 2021
Semiconductor, Hardware, Electronic Design Automation, Other Technology, Technology, Conference, OI, MST, Device, CDT, Parasitic extraction, International Conference on Radiation Effects in Insulators, Boron, Atomera, P, 3D, Printed circuit board

The Conference begins at 9:30 a.m. CDT

Key Points: 
  • The Conference begins at 9:30 a.m. CDT
    Atomera Incorporated will present at the 2021 annual International Conference on Simulation of Semiconductor Processes and Devices.
  • The presentation focuses on a novel technique for improving partially depleted RFSOI MOSFETs.
  • To facilitate the detailed simulation of these, devices a novel quasi-3D process model has been developed and tested against a full 3D simulation.
  • To learn more about the session presented by Daniel Connelly at SISPAD 2021, visit the conference program at https://sispad2021.org/technical-program/#S10 .