PCIE

ZOTAC GAMING Unleashes Invincible Savings During Amazon Prime Big Deal Days

Retrieved on: 
Tuesday, October 10, 2023
GPU, Data-rate units, Wi-Fi, GB, Zener diode, Amazon, PCIE, Lighting, GeForce 40 series, Data East USA, Inc. v. Epyx, Inc., MEK, GDDR6X, Memory, Ice storm, Graphics card, ZOTAC, AMP, AMD, DDR4, V3 Gaming PC, CPU, GeForce, Backplate and wing, Ryzen, EKWB, Video game

IRWINDALE, Calif., Oct. 10, 2023 /PRNewswire-PRWeb/ -- ZOTAC USA Inc., a leading manufacturer of innovative gaming hardware solutions, unveils its exceptional lineup of deals and participation in the Amazon Prime Big Deal Days. Taking place from October 10th to 11th, this two-day shopping extravaganza is exclusively available to Amazon Prime members. ZOTAC GAMING is set to offer a selection of its most coveted Gaming PCs and ZOTAC GAMING GeForce RTX graphics cards.

Key Points: 
  • ZOTAC GAMING is set to offer a selection of its most coveted Gaming PCs and ZOTAC GAMING GeForce RTX graphics cards.
  • "ZOTAC GAMING has teamed up with Amazon for the 2023 Prime Big Deal Days with exclusive deals.
  • "ZOTAC GAMING has teamed up with Amazon for the 2023 Prime Big Deal Days with exclusive deals.
  • To learn more about the Amazon Prime Big Deal Days ZOTAC GAMING exclusive offers, please visit: https://amzn.to/3rAq2AN

Laird Connectivity Brings Wi-Fi 6/6E to Their Extensive Portfolio of Wi-Fi Modules with the New Sona™ IF573 Product Line

Retrieved on: 
Thursday, June 8, 2023
HD, CE, Partnership, Wi-Fi, MIC, FCC, Bed, Internet of things, Pump, RCM, PCIE, BT, Wireless, Sona College of Technology, SMT, SDIO, Linux, Bluetooth Special Interest Group, Sona, ISED, Partner, Amplifier, Infineon Technologies, LNA, Radio, Silicon, WPA3, AI, Mobile phone

AKRON, Ohio, June 8, 2023 /PRNewswire/ -- Laird Connectivity, a global leader in wireless technology and Premium Partner for Infineon Technologies, today announces the upcoming Sona™ IF573 Wi-Fi 6/6E family of modules to their extensive portfolio of Wi-Fi solutions. Powered by Infineon Technologies' leading AIROC™ CYW55573 chipset, the Sona IF573 is a truly robust industrial IoT module that is rugged, small, globally certified, has reliable connectivity, and is easy to integrate. 

Key Points: 
  • The Sona IF573 delivers a fully featured Wi-Fi 6E radio, answering the call for next-generation wireless IoT.
  • "Adding the Sona IF573 to our Wi-Fi portfolio demonstrates Laird Connectivity's commitment to providing the latest technology and wireless capabilities to our customer base," said Andrew Ross, Senior Product Manager, Laird Connectivity.
  • "Infineon is pleased to build on its strategic partnership with our Premium Partner, Laird Connectivity," said Sivaram Trikutam, Vice President of Wi-Fi Product Line, Infineon Technologies.
  • For more information about the Sona IF573, visit: www.lairdconnect.com/sona-if573-series
    To learn more about Laird Connectivity, visit: www.lairdconnect.com

Global Active Optical Network Market Report 2022-2027: High-End Investments and Initiatives Taken by the Governments of Several Developing Economies to Digitize Processes Propelling Sector

Retrieved on: 
Thursday, August 4, 2022
Competition, PCI Express, Growth, Forecast, Connector, DisplayPort, SCSI, Serial Attached SCSI, InfiniBand, PCIE, USB, SAS, HDMI, Satellite navigation device, Ethernet

The global active optical network market is expected to grow at a promising rate in the forecast period.

Key Points: 
  • The global active optical network market is expected to grow at a promising rate in the forecast period.
  • The active optical network provides a better alternative to conventional copper cables owing to its lightweight nature, easier installations, longer life span, and low power consumption.
  • Also, the high-end investments and initiatives taken by the governments of several developing economies to digitize processes to ensure connectivity for smooth operations are accelerating the growth of the global active optical network market.
  • However, huge implementation costs for active optical networks may hinder the growth of the global active optical network.

Global Active Optical Network Market Report 2022-2027: Increasing Demand for High-Speed Bandwidth Requirements and Fast Data Transmission Driving Growth - ResearchAndMarkets.com

Retrieved on: 
Wednesday, August 3, 2022
Technology, Networks, Internet, Competition, PCI Express, Growth, Forecast, Connector, DisplayPort, SCSI, Serial Attached SCSI, InfiniBand, PCIE, USB, SAS, HDMI, Satellite navigation device, Ethernet

The global active optical network market is expected to grow at a promising rate in the forecast period.

Key Points: 
  • The global active optical network market is expected to grow at a promising rate in the forecast period.
  • The market is driven by increasing demand for high-speed bandwidth requirements and fast data transmission.
  • Also, the high-end investments and initiatives taken by the governments of several developing economies to digitize processes to ensure connectivity for smooth operations are accelerating the growth of the global active optical network market.
  • However, huge implementation costs for active optical networks may hinder the growth of the global active optical network.

First PCI Express® 5.0 Mini Cool Edge IO™ (MCIO) Interposer

Retrieved on: 
Tuesday, August 2, 2022
PCI-SIG, Time, View, Transfer (computing), CXL, PCI Express, NVM Express, Solution, Teledyne Technologies, Multimedia, PCIE, Interposer, HPC, NVM, PHY, Company, Compute Express Link, PCI, Summit, Sega, Video game console, Printed circuit board, Online shopping, LeCroy Corporation, Test probe

MILPITAS, Calif., Aug. 2, 2022 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of a PCI Express 5.0 Mini Cool Edge IO (MCIO) interposer that works in combination with Teledyne LeCroy's Summit™ family of PCI Express 5.0 protocol analyzers.  The new interposer enables engineers to test products that incorporate card edge connectors or cabled connector assemblies that utilize the MCIO mechanical connector with PCIe 5.0, NVM Express® (NVMe) or Compute Express Link™ (CXL) technologies.  The PCIe 5.0 MCIO Interposer joins the list of CrossSync™ PHY enabled interposers, allowing users to debug enhanced power management and link training equalization through correlated and time aligned physical and protocol layer views. No other solution gives this type of insight into link behavior.

Key Points: 
  • Test MCIO-based high-speed interfaces for PCIe, NVMe, or CXL up to 32GT/s
    MILPITAS, Calif., Aug. 2, 2022 /PRNewswire/ --Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of a PCI Express 5.0 Mini Cool Edge IO (MCIO) interposer that works in combination with Teledyne LeCroy's Summit family of PCI Express 5.0 protocol analyzers.
  • The new interposer enables engineers to test products that incorporate card edge connectors or cabled connector assemblies that utilize the MCIO mechanical connector with PCIe 5.0, NVM Express (NVMe) or Compute Express Link (CXL) technologies.
  • The Mini Cool Edge IO connector is a flexible, robust, and cost-effective connector and cable assembly that helps equipment designers offer flexibility, reduce overall space requirements, and extend the reach for high data rate signals.
  • NVMe and NVM Express are registered trademarks and/or service marks of NVM Express, Inc. CXL and Compute Express Link are trademarks and/or service marks of the Compute Express Link Consortium, Inc.
    View original content to download multimedia: https://www.prnewswire.com/news-releases/first-pci-express-5-0-mini-cool...

Global Active Optical Cable Markets, 2022-2027 - Increasing Demand for Bandwidth and Reliability & Rising Adoption of Virtualization and Cloud-Based Services - ResearchAndMarkets.com

Retrieved on: 
Thursday, July 21, 2022
Technology, Internet, TE Connectivity, The Siemon Company, SWOT, Investment, Hitachi Cable, Others, COVID-19, Sumitomo Electric Industries, Market development, CXP, CFP, Industry, SFP, Global, II-VI, Form factor, PCI Express, Data center, Coherence, QSFP, Risk, USD, SAS, Ansoff Matrix, USB, PCIE, Personal computer, Geography, CAGR, Protocol, CE, HPC, HDMI, 3M, Molex, Serial Attached SCSI, Emotion, Broadcom Inc., Competitive analysis, Consumer electronics, Cx4, Impact, Growth, Internet service provider, Retail, Risk management, Thunderbolt, InfiniBand, DisplayPort, Ethernet, Fujikura

The Global Active Optical Cable Market is estimated to be USD 3.43 Bn in 2022 and is projected to reach USD 11.47 Bn by 2027, growing at a CAGR of 27.3%.

Key Points: 
  • The Global Active Optical Cable Market is estimated to be USD 3.43 Bn in 2022 and is projected to reach USD 11.47 Bn by 2027, growing at a CAGR of 27.3%.
  • Market dynamics are forces that impact the prices and behaviors of the Global Active Optical Cable Market stakeholders.
  • These forces create pricing signals which result from the changes in the supply and demand curves for a given product or service.
  • The report presents a detailed Ansoff matrix analysis for the Global Active Optical Cable Market.

First PCIe® Integrity and Data Encryption (IDE) Protocol Testing Solutions Now Available

Retrieved on: 
Tuesday, June 14, 2022
CA, Time, Company, IDE, LeCroy Corporation, PCI Express, PCIE, Conference, Generation, Confidentiality, Solution, Developer, PCI-SIG, Technology, Integrity, Teledyne Technologies, Summit, Muscle Atrophy Research and Exercise System, Cryptocurrency

MILPITAS, Calif., June 14, 2022 /PRNewswire/ -- Teledyne LeCroy, a worldwide leader in serial data test solutions, will be showcasing new protocol analysis and traffic generation solutions for testing PCI Express (PCIe) Integrity and Data Encryption (IDE) security protocols using their Summit Protocol Analyzers and Exercisers at the PCI Special Interest Group (PCI-SIG) Developers Conference 2022 in Santa Clara, CA on June 21-22, 2022.

Key Points: 
  • MILPITAS, Calif., June 14, 2022 /PRNewswire/ -- Teledyne LeCroy, a worldwide leader in serial data test solutions, will be showcasing new protocol analysis and traffic generation solutions for testing PCI Express (PCIe) Integrity and Data Encryption (IDE) security protocols using their Summit Protocol Analyzers and Exercisers at the PCI Special Interest Group (PCI-SIG) Developers Conference 2022 in Santa Clara, CA on June 21-22, 2022.
  • The PCIe technology is integral to high-speed flow of information, and the PCI-SIG has recognized the importance of secured data transfers with the introduction of IDE capabilities to the PCI Express specification.
  • Users of Teledyne LeCroy systems appreciate the rich library of decodes and analysis capabilities that are available on all of Teledyne LeCroy's PCIe specification test tools.
  • The PCIe IDE Analysis and Generation licenses for Summit Protocol Analyzers and Exercisers can be ordered now.

First PCI Express® 5.0 OCP NIC 3.0 Interposer

Retrieved on: 
Tuesday, May 10, 2022
GPU, Summit, Transfer (computing), OCP, Teledyne Technologies, NVM Express, Company, Sega, Time, LeCroy Corporation, Network interface controller, Compute Express Link, PHY, CXL, PCI Express, PCI, PCI-SIG, NIC, Solution, SFF, NVM, PCIE, Cryptocurrency, Online shopping, Probe effect

MILPITAS, Calif., May 10, 2022 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of a PCI Express 5.0 Open Compute Project (OCP) Network Interface Card (NIC) 3.0 interposer that works in combination with Teledyne LeCroy's Summit family of PCI Express 5.0 protocol analyzers.  The new OCP interposer allows engineers to test product designs that incorporate OCP NIC 3.0 with PCIe 5.0, NVM Express® (NVMe) or Compute Express Link™ (CXL) technologies.  The PCIe 5.0 OCP interposer joins the list of CrossSync™ PHY enabled interposers, allowing users to debug enhanced power management and link training equalization through correlated and time aligned physical and protocol layer views. No other solution gives this type of insight into link behavior.

Key Points: 
  • The new OCP interposer allows engineers to test product designs that incorporate OCP NIC 3.0 with PCIe 5.0, NVM Express (NVMe) or Compute Express Link (CXL) technologies.
  • The specification utilizes the SFF-TA-1002 connector and enables any OCP NIC 3.0 card from any vendor to work in any OCP NIC 3.0 server.
  • The PCIe 5.0 OCP NIC 3.0 interposer, which can be optionally upgraded withCrossSync PHY support, has been added to the Teledyne LeCroy PCI Express test solutions product line with the product code of PE260UIA-X.
  • NVMe and NVM Express are registered trademarks and/or service marks of NVM Express, Inc. CXL and Compute Express Link are trademarks and/or service marks of the Compute Express Link Consortium, Inc.

First PCI Express® 5.0 EDSFF Interposers for SSD Protocol Testing

Retrieved on: 
Tuesday, December 7, 2021
NVM Express, Company, NVM, PCI-SIG, Compute Express Link, Sega, PCI Express, PCI, SSD, Teledyne Technologies, 5.0, Summit, CXL, Time, PCIE, Solid-state drive, LeCroy Corporation, Enterprise, EDSFF, Transfer (computing), Solution, Computer data storage, Online shopping

Based on the PCIe 5.0, NVMe and CXL specifications, the EDSFF interface can support speeds of up to 32GT/s.

Key Points: 
  • Based on the PCIe 5.0, NVMe and CXL specifications, the EDSFF interface can support speeds of up to 32GT/s.
  • Now design and test engineers can test, identify issues, and optimize EDSFF (E1.S, E1.L, E3.x) type memory systems and solid-state drive performance using Teledyne LeCroy PCIe 5.0 EDSFF interposers.
  • Three new PCIe 5.0 EDSFF Interposer models, which can be optionally upgraded with CrossSync PHY support, have been added to the Teledyne LeCroy PCI Express test solutions product line.
  • For more information on PCI Express 5.0 EDSFF interposer models, please contact Teledyne LeCroy at +1 (800) 909-7211 or visit https://teledynelecroy.com/protocolanalyzer/pci-express/interposers-and-... .

Getac F110 Windows-Based Fully Rugged Tablet Provides Next Gen Performance For Class 1 Division 2 Explosion Proof Certification

Retrieved on: 
Wednesday, November 10, 2021
Consumer Electronics, Defense, Technology, Mobile, Wireless, Other Defense, Hardware, WWAN, Hydrogen, GPS, Medicine, GE Aerospace, Fear, Technology, Police, General Electric F110, 2009 Davis Cup, SatCon Technology Corporation, Facebook, Software, Firefighter, Static electricity, YouTube, Twitter, Propane, F110, Oxygen, Century, WLAN, FHD, LinkedIn, RFID, Blog, ANSI, Electronics, Dust, Mining, Tablet, IP66, PCIE, Plant, Solid-state drive, Data collection, Explosive, Satellite navigation device

Getac Technology Corporation, a leading producer of rugged technology, today announced the launch of the new era Windows-based F110 Class 1 Division 2 tablet computer.

Key Points: 
  • Getac Technology Corporation, a leading producer of rugged technology, today announced the launch of the new era Windows-based F110 Class 1 Division 2 tablet computer.
  • The F110 merges C1D2 hazardous and explosive environment protection with the state-of-the-art performance, MIL-STD-810H certifications and IP66 rating of the highly acclaimed 2021 F110.
  • However, the F110 offers a superior combination of C1D2 certification, fully rugged durable and top-level non-rugged tablet performance, heavy industry communications protocols and connectivity options incorporated into the latest F110 for the North American market, plus our exclusive three-year, bumper-to-bumper warranty.
  • Today Getacs business includes rugged laptops, rugged tablets, software, and mobile video solutions for defense, police, firefighters, utilities, automotive, manufacturing, transport and logistics.