N5

Big Name VCs Back Startup to Solve a Multi-Billion Dollar Banking Problem

Retrieved on: 
Wednesday, September 13, 2023
CNHI, Lehmann, Zurich Insurance Group, JPMorgan Chase, S&P Global, Business, Investment, BNY Mellon, Omnichannel, Economist, Fintech, N26, Citigroup, Name, Beto Sicupira, CRMS, Summit Bank, Mastercard, Growth, LTS, Barclays, Security (finance), Financial services, Cryptocurrency, Ferrari, Rock (geology), Credicorp, Walmart, N5

BUENOS AIRES, Argentina, Sept. 13, 2023 /PRNewswire/ -- Fintech startup, N5 has secured the backing of a number of high profile investors, on the strength of its potential to save financial institutions billions of dollars a year.

Key Points: 
  • U.S. financial institutions lose an estimated $272B each year through inefficiency and missed opportunities resulting from fragmented and siloed technologies and processes, perpetuated and exacerbated by 'software entropy'.
  • N5 was founded by experts from the banking sector specifically to solve that problem, and is already doing so with customers in other parts of the world.
  • This helps financial institutions 'join the dots' and so improve productivity, the customer experience and cost-effectiveness.
  • The company plans to make a high profile appointment to lead North American operations, as well as fill a further 800 roles globally.

MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024

Retrieved on: 
Thursday, September 7, 2023
Partnership, Senior, Smartphone, Multimedia, SOC, TWSE, App Store (iOS/iPadOS), Tablet, NYSE, Socs, TSMC, Artificial intelligence, MediaTek, TSM, N5, Semiconductor

HSINCHU, Sept. 6, 2023 /PRNewswire/ -- MediaTek and TSMC (TWSE: 2330, NYSE: TSM) today announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production expected next year.

Key Points: 
  • HSINCHU, Sept. 6, 2023 /PRNewswire/ -- MediaTek and TSMC (TWSE: 2330, NYSE: TSM) today announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production expected next year.
  • "We are committed to our vision of using the world's most advanced technology to create cutting edge products that improve our lives in meaningful ways," said Joe Chen, President of MediaTek.
  • TSMC's 3nm process technology provides enhanced performance, power, and yield, in addition to complete platform support for both high performance computing and mobile applications.
  • MediaTek's first flagship chipset using TSMC's 3nm process is expected to empower smartphones, tablets, intelligent cars and various other devices starting in the second half of 2024.

MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024

Retrieved on: 
Thursday, September 7, 2023
Partnership, Senior, Smartphone, Multimedia, SOC, TWSE, App Store (iOS/iPadOS), Tablet, NYSE, Socs, TSMC, Artificial intelligence, MediaTek, TSM, N5, Semiconductor

HSINCHU, Sept. 7, 2023 /PRNewswire/ -- MediaTek and TSMC (TWSE: 2330, NYSE: TSM) today announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production expected next year.

Key Points: 
  • HSINCHU, Sept. 7, 2023 /PRNewswire/ -- MediaTek and TSMC (TWSE: 2330, NYSE: TSM) today announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production expected next year.
  • "We are committed to our vision of using the world's most advanced technology to create cutting edge products that improve our lives in meaningful ways," said Joe Chen, President of MediaTek.
  • TSMC's 3nm process technology provides enhanced performance, power, and yield, in addition to complete platform support for both high performance computing and mobile applications.
  • MediaTek's first flagship chipset using TSMC's 3nm process is expected to empower smartphones, tablets, intelligent cars and various other devices starting in the second half of 2024.

Implenia wins another complex railway infrastructure project in Switzerland with Lot 2 “Tunnel Ligerz” as part of the double-track expansion Ligerz-Twann

Retrieved on: 
Thursday, August 3, 2023
SIX Swiss Exchange, La Neuveville, IBD, Federal Inventory of Landscapes and Natural Monuments, SBB, Lot, Corporate communication, Institutes of National Importance, ISOS, Landscape, FTE, Mining, CHF, Natural monument, N5, BLN, Tunnel, Construction, Cryptocurrency, Opfikon, Implenia

In addition, four escape tunnels, a 114 m long viaduct for the exit of highway N5 and various additional structures are being built.

Key Points: 
  • In addition, four escape tunnels, a 114 m long viaduct for the exit of highway N5 and various additional structures are being built.
  • The excavated material will be transported by ship and the existing railway line will be dismantled and redesigned.
  • The aim of the project is to eliminate the last railway bottleneck on the “Jurafuss” line between Lausanne and Biel.
  • Joint venture led by Implenia wins contract for Lot 2 “Tunnel Ligerz” as part of the double-track expansion Ligerz-Twann (image: ©SBB).

Astronergy modules stably generating at Europe's largest TOPCon PV plant

Retrieved on: 
Monday, July 10, 2023
ASTRO, Electricity, N5, Interview, Topcon, CMO, PV, Renewable energy

HANGZHOU, China, July 10, 2023 /PRNewswire/ -- To celebrate the two-month stable generation of Europe's largest n-type TOPCon solar farm in Germany – the Döllen solar farm, an inauguration ceremony was held on June 30 to mark the success of the power plant which is generating green energy with the installations of a total of 154.77MW ASTRO N series TOPCon PV modules from Astronergy.

Key Points: 
  • HANGZHOU, China, July 10, 2023 /PRNewswire/ -- To celebrate the two-month stable generation of Europe's largest n-type TOPCon solar farm in Germany – the Döllen solar farm, an inauguration ceremony was held on June 30 to mark the success of the power plant which is generating green energy with the installations of a total of 154.77MW ASTRO N series TOPCon PV modules from Astronergy.
  • After almost one year of construction since May 2022, the Döllen solar farm finished its construction and connected to the grid in April 2023.
  • Thanks to ASTRO N series n-type TOPCon PV modules from Astronergy, the 154.77MW power output of the solar farm is expected to generate around 160,000 MWh of green electricity annually.
  • Astronergy's frontier TOPCon 3.0 tech-powered ASTRO N5 solar panels play as one of the critical cores for the sustainability system.

ASTRO N7 - Astronergy new masterpiece, globally debuts at SNEC

Retrieved on: 
Wednesday, May 24, 2023
SNEC, BOS, ASTRO, Multimedia, Temperature, Cell, LCOE, PREC, Silicon, LID, Topcon, N5, Renewable energy

SHANGHAI, May 24, 2023 /PRNewswire/ -- Astronergy, a pioneer in n-type TOPCon PV modules, launched its newly upgraded ASTRO N n-type TOPCon products – ASTRO N7 at a grand ceremony held at the 2023 SNEC PV Power Expo in Shanghai, China, on May 24th, receiving the IEC Certificate from TÜV Rheinland.

Key Points: 
  • SHANGHAI, May 24, 2023 /PRNewswire/ -- Astronergy, a pioneer in n-type TOPCon PV modules, launched its newly upgraded ASTRO N n-type TOPCon products – ASTRO N7 at a grand ceremony held at the 2023 SNEC PV Power Expo in Shanghai, China, on May 24th, receiving the IEC Certificate from TÜV Rheinland.
  • To further improve PV products' performance and reliability, the new products are composed of rectangle silicon wafers with larger area than M10 182mm wafers ASTRO N5 products use before.
  • Same as previous ASTRO N series products, ASTRO N7 will have a least 12 years product warranty and 30 years power warranty.
  • The temperature coefficient of ASTRO N7 has been further optimized to -0.29%/℃.

ASTRO N7 - Astronergy new masterpiece, globally debuts at SNEC

Retrieved on: 
Wednesday, May 24, 2023
SNEC, BOS, ASTRO, Temperature, Cell, LCOE, PREC, IEC, Silicon, LID, Topcon, N5, Renewable energy

SHANGHAI, May 24, 2023 /PRNewswire/ -- Astronergy, a pioneer in n-type TOPCon PV modules, launched its newly upgraded ASTRO N n-type TOPCon products – ASTRO N7 at a grand ceremony held at the 2023 SNEC PV Power Expo in Shanghai, China, on May 24th, receiving the IEC Certificate from TÜV Rheinland.

Key Points: 
  • SHANGHAI, May 24, 2023 /PRNewswire/ -- Astronergy, a pioneer in n-type TOPCon PV modules, launched its newly upgraded ASTRO N n-type TOPCon products – ASTRO N7 at a grand ceremony held at the 2023 SNEC PV Power Expo in Shanghai, China, on May 24th, receiving the IEC Certificate from TÜV Rheinland.
  • To further improve PV products' performance and reliability, the new products are composed of rectangle silicon wafers with larger area than M10 182mm wafers ASTRO N5 products use before.
  • Same as previous ASTRO N series products, ASTRO N7 will have a least 12 years product warranty and 30 years power warranty.
  • The temperature coefficient of ASTRO N7 has been further optimized to -0.29%/℃.

Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC's N2 Process with Optimized EDA Flows

Retrieved on: 
Tuesday, April 25, 2023
N2, Interface, N4, EDA, Temperature, IP, SNPS, SLM, Socs, TSMC, Physics, AI, PVT, N5, Semiconductor, Synopsys

MOUNTAIN VIEW, Calif., April 25, 2023 /PRNewswire/ -- In a continuing effort to meet stringent design targets for next-generation system-on-chips (SoCs) Synopsys, Inc. (Nasdaq: SNPS) today announced a collaboration with TSMC to deliver digital and custom design EDA flows on TSMC's most advanced N2 process. The TSMC N2 process leverages nanosheet transistors to offer up to 15% speed improvement at the same power or 30% power reduction at the same speed when compared with the TSMC N3E process, all while increasing chip density. This significant investment by Synopsys across the full EDA stack allows designers to jumpstart their N2 designs, differentiate their SoCs and accelerate their time to market.

Key Points: 
  • This significant investment by Synopsys across the full EDA stack allows designers to jumpstart their N2 designs, differentiate their SoCs and accelerate their time to market.
  • "TSMC and Synopsys help our mutual customers achieve the best-in-class design results across the full Synopsys EDA stack on TSMC's most advanced N2 process," said Dan Kochpatcharin, head of Design Infrastructure Management Division at TSMC.
  • "Synopsys digital and custom design flows on TSMC's N2 process allows designers to significantly benefit from the advanced features of TSMC's N2 process and accelerate time to market."
  • Designers migrating their N4 and N5 designs to N3E can use the Synopsys EDA analog migration flow to efficiently reuse designs from one process node to another.

Synopsys Wins Six Partner of the Year Awards at TSMC 2022 OIP Ecosystem Forum

Retrieved on: 
Friday, November 18, 2022
Cloud, OIP, Silicon, SNPS, Interface, IP, SOC, Marketing, Ansys, Collaboration, Partner, EDA, RF, High-pass filter, Keysight, TSMC, Life, RFIC, AI, Elasticity, Video game console, Semiconductor, Mobile phone, N5, Synopsys

"Recognizing Synopsys withsix 2022 TSMC OIP Partner of the Year awards highlights our appreciation for the deep impact our collaboration continues to have on advanced semiconductor design," said Dan Kochpatcharin, Head of Design Infrastructure Management Division at TSMC.

Key Points: 
  • "Recognizing Synopsys withsix 2022 TSMC OIP Partner of the Year awards highlights our appreciation for the deep impact our collaboration continues to have on advanced semiconductor design," said Dan Kochpatcharin, Head of Design Infrastructure Management Division at TSMC.
  • "Together, we're making huge leaps in enabling the future of computing in cutting-edge areas such as multi-die design.
  • The flows, as well as Synopsys' broad Foundation and Interface IP portfolio, have achieved multiple successful tapeouts on the N3E process.
  • Synopsys' multi-die solution enables early architectural exploration, rapid system validation, efficient die/package co-design, robust die-to-die connectivity and improved manufacturing and reliability.

Credo Launches Comprehensive Family of 112G PAM4 SerDes IP for TSMC N5 and N4 Process Technologies

Retrieved on: 
Wednesday, August 17, 2022
Semiconductor, Data Management, Technology, Telecommunications, Internet, Hardware, Online, Machine learning, Digital signal, Multimedia, Documentation, Credo, N5, LR, Industry, Silicon, AI, Technology, IP, Business development, Original equipment manufacturer, AEC Q-type, DSP, Family, Copper, Associate, NASDAQ, PAM4, Wire, Digital signal processor, Software, Solution, ICS, Efficiency, TSMC, 3D printing, Video game console, SerDes

Credo Technology Group Holding Ltd (NASDAQ: CRDO) today introduced its 112G PAM4 SerDes Intellectual Property (IP) family on TSMCs industry-leading N5 and N4 process technologies.

Key Points: 
  • Credo Technology Group Holding Ltd (NASDAQ: CRDO) today introduced its 112G PAM4 SerDes Intellectual Property (IP) family on TSMCs industry-leading N5 and N4 process technologies.
  • We have ported our unique, purpose-built SerDes technology to the TSMC N5 and N4 processes to allow our partners and customers to seamlessly integrate our industry leading 112G PAM4 IP into larger scale monolithic and multi-chip-module ASICs.
  • These new 112G PAM4 SerDes IP were designed to meet the ever-growing data needs of high-speed, data-intensive applications and early access design customers can engage immediately by contacting the Credo sales team.
  • Production, silicon validation, design kit of these 112G SerDes for multiple TSMC processes from N16 to N4 are available on TSMC-Online.