MEMS sensor generations

For the first time in the Middle East, The Sultanate of Oman hosts the International Semiconductors Executive Summit

Retrieved on: 
Thursday, February 2, 2023
Semiconductor, Amer, Design, GCC, Government, Internet of things, Information technology, Communication, Ministry of Transport, Communications and Information Technology (Oman), Sensor, Ministry, Electronics, Semiconductor device fabrication, Vanguard International Semiconductor Corporation, Summit, Advanced packaging (semiconductors), MEMS sensor generations, MEMS, Automotive Electronics Council, ISES, Video game, Metaverse

LONDON , Feb. 2, 2023 /PRNewswire/ -- To further enhance, strengthen and expand the global semiconductor ecosystem, the International Semiconductor Executive Summits (ISES) launches the International Semiconductor Executive Summits (ISES) Middle East will be held in Oman, Muscat on February 22nd-23rd.

Key Points: 
  • LONDON , Feb. 2, 2023 /PRNewswire/ -- To further enhance, strengthen and expand the global semiconductor ecosystem, the International Semiconductor Executive Summits (ISES) launches the International Semiconductor Executive Summits (ISES) Middle East will be held in Oman, Muscat on February 22nd-23rd.
  • The first Semiconductor event hosted in the GCC will take place in Muscat, Oman hosted by The Sultanate on February 22-23, 2023, combining an international executive audience, very important topics and exclusive access to incredible cultural highlights for all attendees.
  • For more information and to register for the Summit, please visit https://isesglobal.com/events/ises-middle-east/
    The Ministry is the responsible body for formulating and implementing the government digital strategies and programs in the Sultanate of Oman.
  • International Semiconductor Executive Summits (ISES) Middle East offers full membership benefits to both local and multinational companies within the country through this platform.

For the first time in the Middle East, The Sultanate of Oman hosts the International Semiconductors Executive Summit

Retrieved on: 
Thursday, February 2, 2023
Semiconductor, Amer, Design, GCC, Government, Internet of things, Information technology, Communication, Ministry of Transport, Communications and Information Technology (Oman), Sensor, Ministry, Electronics, Semiconductor device fabrication, Vanguard International Semiconductor Corporation, Summit, Advanced packaging (semiconductors), MEMS sensor generations, MEMS, Automotive Electronics Council, ISES, Video game, Metaverse

LONDON, Feb. 2, 2023 /PRNewswire/ -- To further enhance, strengthen and expand the global semiconductor ecosystem, the International Semiconductor Executive Summits (ISES) launches the International Semiconductor Executive Summits (ISES) Middle East will be held in Oman, Muscat on February 22nd-23rd.

Key Points: 
  • LONDON, Feb. 2, 2023 /PRNewswire/ -- To further enhance, strengthen and expand the global semiconductor ecosystem, the International Semiconductor Executive Summits (ISES) launches the International Semiconductor Executive Summits (ISES) Middle East will be held in Oman, Muscat on February 22nd-23rd.
  • The first Semiconductor event hosted in the GCC will take place in Muscat, Oman hosted by The Sultanate on February 22-23, 2023, combining an international executive audience, very important topics and exclusive access to incredible cultural highlights for all attendees.
  • For more information and to register for the Summit, please visit https://isesglobal.com/events/ises-middle-east/
    The Ministry is the responsible body for formulating and implementing the government digital strategies and programs in the Sultanate of Oman.
  • International Semiconductor Executive Summits (ISES) Middle East offers full membership benefits to both local and multinational companies within the country through this platform.

ASE Breaks Ground on New Chip Assembly and Testing Facility in Penang, Malaysia

Retrieved on: 
Thursday, November 10, 2022
Semiconductor, Hardware, Manufacturing, Technology, Engineering, MEMS sensor generations, OSAT, Recycling, State, Supercomputer, ASEM, NYSE, MEMS, TWSE, Workforce, Partnership, Communication, Knowledge, Adoption, Technology, Silicon, Electronics, SME, Multimedia, Efficiency, State government, AI, E&E, Flip chip, Plant, Engineering, SIP, TSV, Growth, Bayan Lepas Free Industrial Zone, ASE, Industry, Trust, Semiconductor, Renewable energy, Lithium

Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Inc, NYSE: ASX, TWSE: 3711) hosted a groundbreaking ceremony today for the construction of a new semiconductor assembly and testing facility in Penang, Malaysia.

Key Points: 
  • Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Inc, NYSE: ASX, TWSE: 3711) hosted a groundbreaking ceremony today for the construction of a new semiconductor assembly and testing facility in Penang, Malaysia.
  • The new facility at ASE Malaysia (ASEM) will comprise 2 buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone.
  • Outsourced semiconductor assembly and test (OSAT) manufacturing continues to form a critical link in the global electronics supply chain.
  • High demand packaging product types including copper clip and image sensors will be the core focus of the new facility.

ASE announces FOCoS advancements under the VIPack™ Platform

Retrieved on: 
Thursday, November 3, 2022
Semiconductor, Hardware, Manufacturing, Technology, Engineering, RDL, High Bandwidth Memory, Zonya Foco, Flip chip, ASE, Industry, Solution, AI, Memory, NYSE, ASX, ASIC, SOC, HPC, Efficiency, R&D, TSV, Artificial intelligence, Si, SIP, Intelligence, MEMS sensor generations, Acosta Sales & Marketing, IP, CPI, High performance positioning system, HBM, BGA, Technology, MEMS, Miniaturization, Video game console, TAIEX, Automotive industry

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today the industrys first Fan-Out Chip on Substrate Chip First (FOCoS-CF) with encapsulant-separated redistribution layer (RDL) and Chip Last (FOCoS-CL) semiconductor packaging solution that elevates the performance for High Performance Computing (HPC), under the ASE VIPack platform.

Key Points: 
  • Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today the industrys first Fan-Out Chip on Substrate Chip First (FOCoS-CF) with encapsulant-separated redistribution layer (RDL) and Chip Last (FOCoS-CL) semiconductor packaging solution that elevates the performance for High Performance Computing (HPC), under the ASE VIPack platform.
  • FOCoS-CF using encapsulant-separated RDL enables improved Chip Package Interaction (CPI), lessened mechanical stress risk over the chip edge at RDL, and better high frequency signal integrity.
  • Heterogeneous integration through advanced packaging technology enables chiplet integration with separate designs and different manufacturing process nodes within a single package.
  • ASEs FOCoS-CF and FOCoS-CL technologies feature within VIPack, a scalable platform available now that is expanding in alignment with industry roadmaps.

ASE announces Dr. William Chen is the 2022 recipient of IMAPS Daniel C. Hughes, Jr. Memorial Award

Retrieved on: 
Tuesday, October 4, 2022
Semiconductor, Hardware, Manufacturing, Technology, Engineering, TSV, Electronics, EDS, Â, SIP, IEEE Society on Social Implications of Technology, IEEE, Society, Cloud computing, SIA, LinkedIn, ISHM, Technology, IMAPS, MEMS sensor generations, Industry, Institute of Electrical and Electronics Engineers, ASE, International Electron Devices Meeting, CEO, Twitter, Multimedia, Monaco Heliport, ASX, Flip chip, ASME, Education, Assembly, EPS, IEEE Electronics Packaging Society, Growth, ITRS, Fremantle Football Club Life Members, American Society of Mechanical Engineers, MEMS, Science, SEMI, NYSE, Efficiency, IBM, AI, Fellows, Internet service provider, Consumer electronics, Automotive industry, TAIEX

The award was presented at a ceremony at IMAPS 2022 in Boston, Massachusetts by IMAPS President, Dr. Beth Keser.

Key Points: 
  • The award was presented at a ceremony at IMAPS 2022 in Boston, Massachusetts by IMAPS President, Dr. Beth Keser.
  • He is the recipient of IEEE Electronics Packaging Technology Field Award and ASME InterPACK Award.
  • Besides being ASE Fellow, he has also been elected IEEE Fellow, ASME Fellow, and now IMAPS Fellow.
  • One must be an IMAPS member in good standing for a minimum of five years to qualify for this Award.

ASE Unveils Plans for the World’s First 5G mmWave NR-DC SA Smart Factory

Retrieved on: 
Wednesday, September 28, 2022
Semiconductor, 5G, Security, Manufacturing, Nanotechnology, Other Technology, Telecommunications, Networks, Internet, Consulting, Hardware, Data Management, Professional Services, Technology, Mobile, Wireless, Other Manufacturing, Packaging, Engineering, Efficiency, New, Face, Industry, AOI, Environment, Government, Industrial Development Bureau, APT, Technology, Ecosystem, Flip chip, Research, Supercomputer, Datang Telecom Group, Adoption, QUALCOMM, Telecom, Telecommunication, IPO, Qualcomm, National Cheng Kung University, SIP, Antirrhinum, TAIEX, Industrialisation, Industrial, View, IOT, Institute, NYSE, Indian Institute of Information Technology, Design and Manufacturing, Jabalpur, ICT, Automation, MEMS sensor generations, MEMS, ASE, Twitter, OEE, LinkedIn, High-pass filter, Data analysis, TSV, Solution, Information technology, Ericsson, Mobile phone, Television, Printed circuit board, OT, Askey

Asia Pacific Telecoms vast experience in enterprise wireless networks will be instrumental in deploying next-generation 5G network architecture within a manufacturing environment.

Key Points: 
  • Asia Pacific Telecoms vast experience in enterprise wireless networks will be instrumental in deploying next-generation 5G network architecture within a manufacturing environment.
  • Today marks an important milestone, as leading players in the industry, government, academia and research sectors joined forces to drive the developments of smart factory technologies.
  • At ASE, partnerships are key to advancing our competitiveness and seizing new opportunities across diverse disciplines, generations and global borders.
  • We will continue to support Taiwans development of mmWave technology and work together to strengthen Taiwans 5G ecosystem.

ASE Introduces VIPack™ to Help Transform Packaging Solution Enablement

Retrieved on: 
Wednesday, June 1, 2022
Data Management, Technology, Manufacturing, Semiconductor, Other Technology, Software, Nanotechnology, Internet, Packaging, Engineering, Hardware, HBM, Marketing, CA, Union of Sales and Marketing Professionals, Flip chip, ASE, 3D, Supercomputer, MEMS, MEMS sensor generations, Artificial intelligence, RDL, Foco, Silicon, AI, IC, Socs, HPC, TSV, ECTC, Senior, Ecosystem, Solution, IOT, R&D, Growth, SIP, Technology, NYSE, Machine learning, Adoption, Twitter, Industry, Efficiency, High Bandwidth Memory, ASX, OSAT, Network, ML, Video game console, TAIEX, Automotive industry

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today introduced VIPack, an advanced packaging platform designed to enable vertically integrated package solutions.

Key Points: 
  • Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today introduced VIPack, an advanced packaging platform designed to enable vertically integrated package solutions.
  • VIPack represents ASEs next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance.
  • ASEs VIPack is comprised of six core packaging technology pillars supported by a comprehensive and integrated co-design ecosystem.
  • As the worlds leading OSAT, ASE is strategically positioned to help customers improve efficiency, speed time-to-market, and sustain profitable growth.

Silicon Catalyst Welcomes Flex Logix as an In-Kind Partner

Retrieved on: 
Friday, May 20, 2022
Software, VP, AI, ICS, Private law, MEMS, IOT, Nneka Onyeali-Ikpe, Acceleration, Internet, Solution, Silicon, PDK, MEMS sensor generations, IKP, FPGA, Marketing, MPW, Algorithm, Mentorship, Partner, Technology, Next, Ecosystem, RTL, IP, CEO, Medical device, Computer data storage, Cryptocurrency

SILICON VALLEY, Calif., May 20, 2022 /PRNewswire/ -- Silicon Catalyst ,the world's only incubator focused exclusively on accelerating semiconductor solutions,is pleased to announce that Flex Logix has joined as the newest member of its In-Kind Partner program (IKP).

Key Points: 
  • SILICON VALLEY, Calif., May 20, 2022 /PRNewswire/ -- Silicon Catalyst ,the world's only incubator focused exclusively on accelerating semiconductor solutions,is pleased to announce that Flex Logix has joined as the newest member of its In-Kind Partner program (IKP).
  • The Flex Logix Infer AI acceleration technology is designed to provide acceleration of AI applications at the Edge of the Internet.
  • Flex Logix is a reconfigurable computing company providing AI inference and eFPGA solutions based on software, systems and silicon.
  • The Silicon Catalyst Angels was established in July 2019 as a separate organization to provide access to seed and Series A funding for Silicon Catalyst portfolio companies.

Silicon Catalyst Announces Upcoming Webinar on Wednesday, January 19th: “What to Know About Investing in Semiconductor Startups”

Retrieved on: 
Tuesday, January 18, 2022
Data Management, Consumer Electronics, Technology, Semiconductor, Other Technology, Telecommunications, Nanotechnology, Networks, Mobile, Wireless, Hardware, Electronic Design Automation, IP, Semiconductor, IOT, MEMS sensor generations, Machine learning, Sensor, Access, Growth, MEMS, Solution, Silicon, Quantum computing, Marketing, Method, Mentorship, AI, AR

Silicon Catalyst, the worlds only incubator focused exclusively on accelerating semiconductor solutions, announced today that registration for its upcoming webinar is now open.

Key Points: 
  • Silicon Catalyst, the worlds only incubator focused exclusively on accelerating semiconductor solutions, announced today that registration for its upcoming webinar is now open.
  • The webinar, What to Know About Investing in Semiconductor Startups will take place on January 19, 2022.
  • With a world-class network of mentors to advise startups, Silicon Catalyst is helping new semiconductor companies address the challenges in moving from idea to realization.
  • The Silicon Catalyst Angels was established in July 2019 as a separate organization to provide access to seed and Series A funding for Silicon Catalyst portfolio companies.

Global $50+ Billion 3D IC and 2.5D IC Markets, 2021-2026 - Opportunities with High-End Computing, Servers, and Datacenters Becoming More Popular - ResearchAndMarkets.com

Retrieved on: 
Thursday, January 13, 2022
Technology, Semiconductor, Other Technology, Data Management, CAGR, Samsung Electronics, ASE Group, Power, Bachelor of Engineering, TSV, Competitive analysis, Miniaturization, Growth, IC, MEMS sensor generations, Memory, Geography, Monolith, Silicon, COVID-19, Data center, USD, LED, Medicine, Toshiba, Architecture, 3D IC, 3D, Impact, RF, Photonics, Printed circuit board, Video game console, Mobile phone, Application, Industry, Broadcom Inc., Logic

The Global 3D IC and 2.5D IC Market is estimated to be USD 52 Bn in 2021 and is expected to reach USD 178.7 Bn by 2026, growing at a CAGR of 28%.

Key Points: 
  • The Global 3D IC and 2.5D IC Market is estimated to be USD 52 Bn in 2021 and is expected to reach USD 178.7 Bn by 2026, growing at a CAGR of 28%.
  • 3D IC is a metal oxide semiconductor made by stacking silicon wafers on top of each other and connecting them vertically.
  • 5D IC are stacked, they are packed into a single package and both are flipped-chipped on a silicon interposer.
  • However, the present unit cost, low volume, and IC implementation concerns limit the growth of the 3D IC and 2.