DFN

Dividend 15 Split Corp. Extends Termination Date

Retrieved on: 
Tuesday, March 12, 2024
Telus Corporation, TransAlta, National Bank of Canada, Bank, DFN, Bank of Montreal, Prospectus, Commerce, Sun Life Financial, BCE Inc., Royal Bank of Canada, Thomson Reuters, Scotiabank, National bank, Toronto-Dominion Bank, Security (finance)

TORONTO, March 12, 2024 (GLOBE NEWSWIRE) -- Dividend 15 Split Corp. (the “Company”) is pleased to announce it will extend the termination date of the Company a further five year period from December 1, 2024 to December 1, 2029.

Key Points: 
  • TORONTO, March 12, 2024 (GLOBE NEWSWIRE) -- Dividend 15 Split Corp. (the “Company”) is pleased to announce it will extend the termination date of the Company a further five year period from December 1, 2024 to December 1, 2029.
  • The term extension allows holders of DFN Class A Shares (“Class A Shares”) to continue to receive ongoing leveraged exposure to a portfolio consisting of high-quality Canadian dividend yielding stocks as well as receiving targeted monthly distributions.
  • Holders of the DFN.PR.A Preferred Shares (“Preferred Shares”) are expected to continue to benefit from cumulative preferential monthly distributions.
  • The Preferred shareholders have received a total of $10.58 per share since inception.

Myriad Reports on Historic Drilling at Copper Mountain

Retrieved on: 
Tuesday, March 5, 2024
Neutron, Little Mo, Area, Canning, Weather, Owl Creek Mountains, Mining, News, Myriad, Anaconda, Qualified person (European Union), RAB, Golder Associates, PFN, National instrument, RME, Archaean, Interest group, SCI, RC, DFN, Hydrocarbon, Uranium mining

Earlier interpretations of the mineralization at Copper Mountain show that the controls on mineralization were not fully understood.

Key Points: 
  • Earlier interpretations of the mineralization at Copper Mountain show that the controls on mineralization were not fully understood.
  • The location of the Copper Mountain uranium district in relation to other uranium districts in Wyoming is shown in Figure 1 below.
  • To view an enhanced version of this graphic, please visit:
    The grade intervals were calculated as weighted averages using 3-foot composite grades that Anaconda derived from drilling data acquired from RME which conducted uranium exploration in the Copper Mountain area between 1969 to 1982.
  • Myriad plans to conduct a site visit to Copper Mountain at the earliest possibility that weather conditions will allow, possibly late April to early May, 2024.

Teledyne e2v HiRel Releases Catalog Radiation Tolerant S-Band (2 GHz to 5 GHz) Ultra-Low Noise Amplifier for Space Applications

Retrieved on: 
Wednesday, March 6, 2024
Other Science, Technology, Research, Other Defense, Contracts, Engineering, Aerospace, Manufacturing, Mobile, Wireless, Defense, Military, Semiconductor, Security, Satellite, Nanotechnology, Other Technology, Telecommunications, Networks, Hardware, Science, Electronic Design Automation, High-electron-mobility transistor, Multimedia, Radar, LNA, TID, Noise, Radio, Radiation, Business development, VDD, DFN, Transistor count, MMIC

View the full release here: https://www.businesswire.com/news/home/20240306331700/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240306331700/en/
    Teledyne e2v HiRel Rad Tolerant S-Band LNA, TDLNA2050SEP (Photo: Business Wire)
    The TDLNA2050SEP LNA leverages monolithic microwave integrated circuit (MMIC) design techniques that deliver exceptional performance in the S-band communication channel.
  • The TDLNA2050SEP amplifier delivers a gain of 17.5 dB from 2 GHz to 5 GHz while maintaining a noise figure of less than 0.4 dB and an output power (P1dB) of 19.5 dBm.
  • “Today, we’re releasing our latest LNA, optimized for space and radar applications,” said Mont Taylor, Vice President and Business Development Manager at Teledyne e2v HiRel.
  • For more information on all of Teledyne e2v HiRel’s space offerings, review our portfolio of semiconductors, converters, processors, and related services here on the Teledyne Defense Electronics website.

Toshiba Releases Power MOSFETs with High-Speed Diodes that Help to Improve Efficiency of Power Supplies

Retrieved on: 
Thursday, February 22, 2024
Data Management, Automotive Manufacturing, EV, Electric Vehicles, Automotive, Technology, Manufacturing, Semiconductor, Telecommunications, Alternative Energy, Energy, Hardware, MOSFET, Multimedia, Temperature, HSD, DFN, Electronics

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added DTMOSVI(HSD), power MOSFETs with high-speed diodes suitable for switching power supplies, including data centers and photovoltaic power conditioners, to its latest-generation[1] DTMOSVI series with a super junction structure.

Key Points: 
  • Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added DTMOSVI(HSD), power MOSFETs with high-speed diodes suitable for switching power supplies, including data centers and photovoltaic power conditioners, to its latest-generation[1] DTMOSVI series with a super junction structure.
  • Shipments of the first two products " TK042N65Z5 ” and “ TK095N65Z5 ," 650V N-channel power MOSFETs in TO-247 packages, start today.
  • View the full release here: https://www.businesswire.com/news/home/20240221220621/en/
    Toshiba: DTMOSVI(HSD), power MOSFETs with high-speed diodes that help to improve efficiency of power supplies.
  • (Graphic: Business Wire)
    The new products use high-speed diodes to improve the reverse recovery[2] characteristics important for bridge circuit and inverter circuit applications.

Teledyne e2v HiRel Releases Single-Supply, Radiation-Tolerant, UHF to S-Band (0.3 GHz to 3 GHz), Ultra-Low Noise Amplifier for Space Applications

Retrieved on: 
Tuesday, January 30, 2024
Technology, Semiconductor, Engineering, Chemicals, Plastics, Aerospace, Nanotechnology, Manufacturing, Government Technology, Hardware, Defense, Multimedia, MMIC, Transistor count, Noise, DFN, Environment, UHF, VDD, Radio, Business development, LNA, Radiation, High-electron-mobility transistor, TID, Cable television

Teledyne e2v HiRel announces the availability of a rad-tolerant UHF to S-band low noise amplifier, model TDLNA0430SEP that is ideal for use in demanding high reliability space applications where low noise figure, minimal power consumption and small package footprint are critical to mission success.

Key Points: 
  • Teledyne e2v HiRel announces the availability of a rad-tolerant UHF to S-band low noise amplifier, model TDLNA0430SEP that is ideal for use in demanding high reliability space applications where low noise figure, minimal power consumption and small package footprint are critical to mission success.
  • This new LNA is developed on a 90nm enhancement-mode pseudomorphic High Electron Mobility Transistor (pHEMT) process.
  • “Today we’re releasing our latest plastic space qualified LNA for harsh environment applications,” said Mont Taylor, Vice President and Business Development Manager at Teledyne e2v HiRel.
  • For more information on all of Teledyne e2v HiRel’s space offerings, review our portfolio of semiconductors, converters, processors, and related services here on the Teledyne Defense Electronics website.

Alpha and Omega Semiconductor Announces Innovatively Designed Double-Sided Cooling DFN 5x6 Package

Retrieved on: 
Wednesday, January 24, 2024
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Other Technology, Telecommunications, Hardware, AOS, PCB, Temperature, MOSFET, Multimedia, Peter H. Wilson, DFN, FOM, Power, ICS, Printed circuit board

Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.

Key Points: 
  • Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.
  • AOS’ new top and bottom cooling DFN 5x6 package is designed to achieve the highest heat transfer between the exposed top contact and heat sink due to its large surface contact area construction.
  • The top exposed DFN 5x6 package of the AONA66916 shares the same 5mm x 6mm footprint as AOS’ standard DFN 5x6 package, eliminating the need to modify existing PCB layouts.
  • “Cooling the power MOSFET in high power design can be challenging, and AOS has successfully addressed this essential issue with our advanced top exposed package design.

Guerrilla RF Releases New Linear PAs and LNAs Targeting Cellular Compensators for Automotive Market

Retrieved on: 
Wednesday, January 24, 2024
Automotive, Technology, Semiconductor, Satellite, Vehicle Technology, Telecommunications, Apps, Applications, Audio, Video, Mobile, Wireless, 5G, Hardware, DPD, EXW, Temperature, NF, Multimedia, DFN, LNA, QFN, OTCQX, PAS, AEC, Mobile phone

Guerrilla RF, Inc. (OTCQX: GUER) announces the formal release of two ¼ W linear PAs and two LNAs earmarked specifically for the automotive market.

Key Points: 
  • Guerrilla RF, Inc. (OTCQX: GUER) announces the formal release of two ¼ W linear PAs and two LNAs earmarked specifically for the automotive market.
  • These new PAs and LNAs are used primarily in cellular compensators (essentially cellular ‘signal boosters’ serving to amplify and enhance cellular signals within the cabin of vehicles).
  • View the full release here: https://www.businesswire.com/news/home/20240124730628/en/
    Guerrilla RF, Inc. (OTCQX: GUER) announces the formal release of two ¼ W linear PAs and two LNAs earmarked specifically for the automotive market.
  • These new PAs and LNAs are used primarily in cellular compensators (essentially cellular ‘signal boosters’ serving to amplify and enhance cellular signals within the cabin of vehicles).

pSemi Introduces New Automotive-Grade Ultra-Wideband RF Switch

Retrieved on: 
Tuesday, January 9, 2024
Semiconductor, Security, Satellite, Photography, Nanotechnology, Audio, Video, Other Technology, Telecommunications, Software, Networks, Internet, Hardware, Electronic Design Automation, Data Management, Consumer Electronics, VoIP, Technology, Mobile, Wireless, RF, WLAN, Hertz, SOI, Semiconductor industry, Temperature, Multimedia, ICMS, DFN, Lethargy, Return loss, ESD, BLE, HBM, UWB, CES, Marketing, CDM, Mobile phone

pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration and advanced connectivity, today announced it is expanding its automotive connectivity product portfolio by introducing the PE423211, an automotive-grade ultra-wideband (UWB) RF switch.

Key Points: 
  • pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration and advanced connectivity, today announced it is expanding its automotive connectivity product portfolio by introducing the PE423211, an automotive-grade ultra-wideband (UWB) RF switch.
  • The PE423211 features fast switching speed, high-power handling, and robust ESD and temperature performance, all in a compact 6-lead 1.6 × 1.6 mm DFN package.
  • Its suitability for BLE and UWB applications includes secure car access, telematics, sensing, infotainment, in-cabin monitoring systems (ICMS), and general-purpose switching.
  • “The automotive market continues to be a massive growth driver for pSemi as consumers demand a more robust connected car experience,” says Vikas Choudhary, vice president of global sales, marketing, and system engineering, pSemi.

Dividend 15 Split Corp.: Dividend Declarations/Portfolio Update

Retrieved on: 
Wednesday, December 20, 2023
BCE Inc., Bank, Sun Life Financial, Royal Bank of Canada, Telus Corporation, Commerce, TransAlta, The Company, Toronto-Dominion Bank, Scotiabank, Thomson Reuters, TC Energy, Bank of Montreal, National bank, National Bank of Canada, DFN

TORONTO, Dec. 20, 2023 (GLOBE NEWSWIRE) -- As previously announced on December 15, 2023, Dividend 15 Split Corp. (The "Company") declared its monthly distribution of $0.10000 for each DFN Class A share ($1.20 annualized) and $0.04583 for each DFN.PR.A Preferred share ($0.550 annually).

Key Points: 
  • TORONTO, Dec. 20, 2023 (GLOBE NEWSWIRE) -- As previously announced on December 15, 2023, Dividend 15 Split Corp. (The "Company") declared its monthly distribution of $0.10000 for each DFN Class A share ($1.20 annualized) and $0.04583 for each DFN.PR.A Preferred share ($0.550 annually).
  • The net asset value per unit on December 14, 2023 was $15.09.
  • Distributions are payable January 10, 2024 to shareholders on record as at December 29, 2023.
  • The most recently calculated net asset value per unit as at December 15, 2023 is $14.95.

Dividend 15 Split Corp. Dividend Declarations/Portfolio Update

Retrieved on: 
Friday, December 15, 2023
BCE Inc., Bank, Sun Life Financial, Royal Bank of Canada, Telus Corporation, Commerce, TransAlta, The Company, Toronto-Dominion Bank, Scotiabank, Thomson Reuters, Human, TC Energy, Bank of Montreal, National bank, National Bank of Canada, DFN, Holding company

TORONTO, Dec. 15, 2023 (GLOBE NEWSWIRE) -- Dividend 15 Split Corp. (The "Company") declares its monthly distribution of $0.10000 for each DFN Class A share ($1.20 annualized) and $0.04583 for each DFN.PR.A Preferred share ($0.550 annually).

Key Points: 
  • TORONTO, Dec. 15, 2023 (GLOBE NEWSWIRE) -- Dividend 15 Split Corp. (The "Company") declares its monthly distribution of $0.10000 for each DFN Class A share ($1.20 annualized) and $0.04583 for each DFN.PR.A Preferred share ($0.550 annually).
  • Distributions are payable January 10, 2024 to shareholders on record as at December 29, 2023.
  • The Company used available cash on hand to buy back and cancel 1,866,500 Class A shares at an average price of $4.02.
  • These purchases were made below net asset value in order to enhance the value for remaining shareholders.