RRAM

KBRA Assigns Preliminary Ratings to RRE 18 Loan Management DAC

Retrieved on: 
Tuesday, March 5, 2024
Banking, Professional Services, Finance, Class, European, CLO, LLP, RRE, RRAM, KBRA, Lisp (programming language), Note, Security (finance)

KBRA UK (KBRA) assigns preliminary ratings to seven classes of notes and one of loans issued by RRE 18 Loan Management DAC, a cash flow collateralised loan obligation (CLO) backed primarily by a diversified portfolio of Euro-denominated corporate loans.

Key Points: 
  • KBRA UK (KBRA) assigns preliminary ratings to seven classes of notes and one of loans issued by RRE 18 Loan Management DAC, a cash flow collateralised loan obligation (CLO) backed primarily by a diversified portfolio of Euro-denominated corporate loans.
  • RRE 18 Loan Management DAC is managed by Redding Ridge Asset Management (UK) LLP (“RRAM UK” or the “collateral manager”).
  • The ratings reflect initial credit enhancement levels, coverage tests including par value and interest coverage tests, excess spread, and a reinvestment overcollateralisation test.
  • The collateral in RRE 18 Loan Management DAC will mainly consist of broadly syndicated leveraged loans and bonds issued by corporate obligors diversified across sectors.

KBRA Assigns Preliminary Ratings to RRE 17 Loan Management DAC

Retrieved on: 
Thursday, February 8, 2024
Professional Services, Finance, KBRA, LLP, Lisp (programming language), Class, CLO, RRE, European, Note, RRAM, Security (finance)

KBRA UK (KBRA) assigns preliminary ratings to seven classes of notes and one of loans issued by RRE 17 Loan Management DAC, a cash flow collateralised loan obligation (CLO) backed primarily by a diversified portfolio of Euro-denominated corporate loans.

Key Points: 
  • KBRA UK (KBRA) assigns preliminary ratings to seven classes of notes and one of loans issued by RRE 17 Loan Management DAC, a cash flow collateralised loan obligation (CLO) backed primarily by a diversified portfolio of Euro-denominated corporate loans.
  • RRE 17 Loan Management DAC is managed by Redding Ridge Asset Management (UK) LLP (“RRAM UK” or the “collateral manager”).
  • The ratings reflect initial credit enhancement levels, coverage tests including par value and interest coverage tests, excess spread, and a reinvestment overcollateralisation test.
  • The collateral in RRE 17 Loan Management DAC will mainly consist of broadly syndicated leveraged loans and bonds issued by corporate obligors diversified across sectors.

Global Memory Chip Market Report, with Profiles of Broadcom, Intel, Micron Technology, Samsung Electronics, SK Hynix and Transcend Information - ResearchAndMarkets.com

Retrieved on: 
Thursday, December 28, 2023
Technology, Hardware, Semiconductor, Other Technology, Samsung, FRAM, 3D XPoint, Personal computer, RRAM, Geography, Micrometre, Research, Acquisition, Patent, NRAM, Intel, Memory, Plant, Broadcom Inc., AI, Internet of things, Micron Technology, COVID-19, Traction, MRAM, SK Hynix, Tablet, Swings, Investment, Samsung Electronics, EPROM, PROM, DRAM, SRAM, Video game

Memory chip sales dropped due to a variety of issues including oversupply, lower demand, higher product prices, and increased competition from alternative storage technologies.

Key Points: 
  • Memory chip sales dropped due to a variety of issues including oversupply, lower demand, higher product prices, and increased competition from alternative storage technologies.
  • Overall, it is projected that the memory chip business will continue to evolve and adapt to changing market conditions and technological advancements.
  • The report provides an overview of the global memory chip market and analyzes market trends.
  • In addition to industry and competitive analysis of the market for memory chips, this report also exhaustively covers patents and company profiles of key players active in the global market.

KBRA Assigns Preliminary Ratings to RRE 16 Loan Management DAC

Retrieved on: 
Friday, September 1, 2023
Banking, Professional Services, Finance, RRE, LLP, Note, CLO, B-2, Class, KBRA, X class, Disclosure, C-1, RRAM, Lisp (programming language), C-2, European, ESG, Policy, Security (finance), Risk management, Telescopic sight

KBRA UK (KBRA) assigns preliminary ratings to eight classes of notes and one of loans issued by RRE 16 Loan Management DAC, a cash flow collateralised loan obligation (CLO) backed primarily by a diversified portfolio of Euro-denominated corporate loans.

Key Points: 
  • KBRA UK (KBRA) assigns preliminary ratings to eight classes of notes and one of loans issued by RRE 16 Loan Management DAC, a cash flow collateralised loan obligation (CLO) backed primarily by a diversified portfolio of Euro-denominated corporate loans.
  • RRE 16 Loan Management DAC is managed by Redding Ridge Asset Management (UK) LLP (“RRAM UK” or the “collateral manager”).
  • The ratings reflect initial credit enhancement levels, coverage tests including par value and interest coverage tests, excess spread, and a reinvestment overcollateralisation test.
  • The collateral in RRE 16 Loan Management DAC will mainly consist of broadly syndicated leveraged loans and bonds issued by corporate obligors diversified across sectors.

NEO Semiconductor to Present Its Ground-Breaking 3D NAND and 3D DRAM Architectures in Keynote Address at Flash Memory Summit 2023

Retrieved on: 
Wednesday, July 26, 2023
PCM, DRAM, NAND, Flash memory, 3D, MRAM, RRAM, Locale (computer hardware), Local, SAN, RAM, AI, 3D NAND, Memory, NEO, Computer data storage

SAN JOSE, Calif., July 26, 2023 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced its participation at Flash Memory Summit 2023, taking place in person in Santa Clara, California, on August 8-10. CEO, Andy Hsu, will deliver a keynote address titled "New Architectures which will Drive Future 3D NAND and 3D DRAM Solutions" on August 9th at 11:40 a.m. Pacific Time. 

Key Points: 
  • CEO, Andy Hsu, will deliver a keynote address titled "New Architectures which will Drive Future 3D NAND and 3D DRAM Solutions" on August 9th at 11:40 a.m. Pacific Time.
  • 3D X-DRAM™ can be manufactured using the existing 3D NAND flash memory process with minor changes, significantly reducing the time and cost spent developing a new 3D process.
  • Also, Neo Semiconductor will show other new memory structures derived from 3D X-DRAM™ for 3D NOR flash memory, 3D Ferroelectric RAM (FFRAM), 3D Resistive RAM (RRAM), 3D Magnetoresistive RAM (MRAM), and 3D Phase Change Memory (PCM).
  • DRAM and NAND flash memory are two of the most important types of memory in computer and electronic systems.

NEO Semiconductor to Present Its Ground-Breaking 3D NAND and 3D DRAM Architectures in Keynote Address at Flash Memory Summit 2023

Retrieved on: 
Wednesday, July 26, 2023
PCM, DRAM, NAND, Flash memory, 3D, MRAM, RRAM, Locale (computer hardware), Local, SAN, RAM, AI, 3D NAND, Memory, NEO, Computer data storage

SAN JOSE, Calif., July 26, 2023 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced its participation at Flash Memory Summit 2023, taking place in person in Santa Clara, California, on August 8-10. CEO, Andy Hsu, will deliver a keynote address titled "New Architectures which will Drive Future 3D NAND and 3D DRAM Solutions" on August 9th at 11:40 a.m. Pacific Time. 

Key Points: 
  • CEO, Andy Hsu, will deliver a keynote address titled "New Architectures which will Drive Future 3D NAND and 3D DRAM Solutions" on August 9th at 11:40 a.m. Pacific Time.
  • 3D X-DRAM™ can be manufactured using the existing 3D NAND flash memory process with minor changes, significantly reducing the time and cost spent developing a new 3D process.
  • Also, Neo Semiconductor will show other new memory structures derived from 3D X-DRAM™ for 3D NOR flash memory, 3D Ferroelectric RAM (FFRAM), 3D Resistive RAM (RRAM), 3D Magnetoresistive RAM (MRAM), and 3D Phase Change Memory (PCM).
  • DRAM and NAND flash memory are two of the most important types of memory in computer and electronic systems.

World Non Volatile Memory Vendor Share Analysis Report 2023: Will the Oversupply Shift to a Rejuvenation of Demand by Late 2023 or 2024? - ResearchAndMarkets.com

Retrieved on: 
Thursday, June 29, 2023
Technology, Data Management, Read-only memory, PCM, ASP, NOR, ASPS, Real-time clock, EPROM, NAND, Electronics, DRAM, RTC, Samsung, ICS, Winbond, MRAM, RRAM, NRAM, NvSRAM, OTP, NVSRAM, STMicroelectronics, SLC, Flash memory, Cypress, NVM, Non-volatile memory, 3D XPoint, NVRAM, Memory, Computer data storage, Video game, EEPROM, Flash, Infineon Technologies

The "Non Volatile Memory Market Shares by Vendor Report" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Non Volatile Memory Market Shares by Vendor Report" report has been added to ResearchAndMarkets.com's offering.
  • In addition, the NVSRAM market shares are broken out by vendor for Real Time Clocks (RTC) and NVSRAM from 2017-2022.
  • 2022 was a year of high inflation and downturn for Flash, DRAM and some Non Volatile Memory.
  • This report is vital for the seasoned memory professional as well as the casual market observer.

Global Memory Chip Global Market 2023: Massive Investments for the Progress of the Semiconductor Sector Present Opportunities

Retrieved on: 
Tuesday, April 18, 2023
Patent, FRAM, Swings, NOR, ROM, DRAM, EPROM, Smartphone, Internet of things, COVID-19, SK Hynix, Samsung, Micrometre, Research, MRAM, 3D XPoint, RRAM, NRAM, Tablet, Plant, Personal computer, Acquisition, Traction, Investment, SRAM, Memory, Intel, City, AI, R, PROM, Video game, Computer data storage, Fine chemical

DUBLIN, April 18, 2023 /PRNewswire/ -- The "Global Memory Chip Market" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, April 18, 2023 /PRNewswire/ -- The "Global Memory Chip Market" report has been added to ResearchAndMarkets.com's offering.
  • With the introduction of smart households and smart cities, the demand for memory chips is at an all-time high.
  • Memory is a significant revenue generator for the semiconductor industry, accounting for around 35.3% of overall sales.
  • Overall, it is projected that the memory chip business will continue to evolve and adapt to changing market conditions and technological advancements.

Automotive Microcontroller Unit (MCU) Industry Report 2023: Automotive High-End MCUs Will Still Be in Short Supply, and How OEMS Can Break the Situation - ResearchAndMarkets.com

Retrieved on: 
Thursday, March 30, 2023
Automotive, Other Automotive, Stellar, Cortex, Communication, MCU, Hertz, DSP, Original equipment manufacturer, SAIC, PWM, Écu, Ecotron, Dongfeng Motor Corporation, TSMC, Volkswagen Group, Memory, SAIC-GM-Wuling, Panic, PCM, GigaDevice, E3100, T-box, Renesas Electronics, EV, TI, SMIC, Arm, Game Industry Report Magazine, HUD reports, BCM, Machine learning, CARIAD, Safety, IVI, Atari ST, SOC, MRAM, Volkswagen, CPU, CICT, Algorithm, ADAS, Research, VPAC, NXP, MMA, Partnership, FSD, ST, ISP, Intelligence, RRAM, Socs, STMicroelectronics, Architecture, Multi, BMS, AI, IDMS, GPU, Instrumentation, Video game, Automotive industry, Semiconductor, Fast food, Ceramic, Computer data storage, Electric motor, Infineon Technologies

MCU Industry Research: Automotive high-end MCU will still be in short supply, and how OEMs can break the situation.

Key Points: 
  • MCU Industry Research: Automotive high-end MCU will still be in short supply, and how OEMs can break the situation.
  • The publisher has released `Automotive Microcontroller Unit (MCU) Industry Report, 2023`, highlighting the following:
    Automotive MCU industry (overview, market size, competitive pattern, chip shortage and response strategies, etc.
  • ;
    Foreign automotive MCU vendors (product layout, planning, and deployment of new products);
    Chinese automotive MCU vendors (product layout, planning, and deployment of new products).
  • The shortage of automotive MCUs will continue, and how OEMs can break the situation.

KBRA Assigns Preliminary Ratings to RRE 15 Loan Management DAC

Retrieved on: 
Monday, February 20, 2023
Banking, Professional Services, Finance, RRAM, RRE, European, LLP, CLO, Disclosure, ESG, Class, Policy, Lisp (programming language), KBRA, Security (finance), Risk management, Telescopic sight

KBRA UK (KBRA) assigns preliminary ratings to seven classes of notes issued by RRE 15 Loan Management DAC, a cash flow collateralised loan obligation (CLO) backed primarily by a diversified portfolio of Euro-denominated corporate loans.

Key Points: 
  • KBRA UK (KBRA) assigns preliminary ratings to seven classes of notes issued by RRE 15 Loan Management DAC, a cash flow collateralised loan obligation (CLO) backed primarily by a diversified portfolio of Euro-denominated corporate loans.
  • RRE 15 Loan Management DAC is managed by Redding Ridge Asset Management (UK) LLP (“RRAM UK” or the “collateral manager”).
  • The ratings reflect initial credit enhancement levels, coverage tests including par value and interest coverage tests, excess spread, and a reinvestment overcollateralisation test.
  • The collateral in RRE 15 Loan Management DAC will mainly consist of broadly syndicated leveraged loans and bonds issued by corporate obligors diversified across sectors.