QSPI

Renesas Debuts Its Lowest Power Consumption, Dual-core Bluetooth Low Energy SoC with Integrated Flash

Retrieved on: 
Thursday, January 18, 2024
Telecommunications, Networks, Hardware, Consumer Electronics, Technology, Semiconductor, Mobile, Wireless, Other Technology, Cortex, Socs, Instrument panel, RCX, Renesas Electronics, LE, ADC, SOC, Multimedia, Radio, Combination, RAM, Flash, POS, Bluetooth Low Energy, CSL, Analog, QSPI, Video game

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced the DA14592 Bluetooth® Low Energy (LE) System-on-Chip (SoC) representing Renesas’ lowest power consumption and smallest, multi-core (Cortex-M33, Cortex-M0+), Bluetooth LE device.

Key Points: 
  • Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced the DA14592 Bluetooth® Low Energy (LE) System-on-Chip (SoC) representing Renesas’ lowest power consumption and smallest, multi-core (Cortex-M33, Cortex-M0+), Bluetooth LE device.
  • View the full release here: https://www.businesswire.com/news/home/20240118157661/en/
    Continuing Renesas’ Bluetooth LE SoC leadership in lowest radio power consumption, the DA14592 utilizes a new low-power mode to offer world-class, 2.3mA radio transmit current at 0dBm and 1.2mA radio receive current.
  • Renesas has integrated all external components required to implement a Bluetooth LE solution into the DA14592MOD module.
  • For information about Renesas’ comprehensive development kits and support, including its widely adopted, low-cost, no-licensing fees product line tester, contact Renesas or visit: renesas.com/DA14592 .

GigaDevice Launches Brand New Wi-Fi 6 MCU Series - GD32VW553

Retrieved on: 
Thursday, November 9, 2023
SPI, PTA, SRAM, Wi-Fi 6, RFIC, QSPI, Architecture, TWT, IEEE, Android SDK, Partnership, CPU, Sleep, Internet of things, Connectivity Standards Alliance, Temperature, MCU, Wi-Fi, Automatic gain control, Certification, Internet, ART, Ecosystem, WFA, GD32, WPA3, Monolithic kernel, CSA, SSE, IEEE 802.11n-2009, OTA, RF, Bluetooth Special Interest Group, AGC, Artificial intelligence of things, Orthogonal frequency-division multiple access, ADC, GPIO, Data-rate units, Connectivity, Communication, WPA, OFDMA, PWM, DSP, Bluetooth Low Energy, FPU, GigaDevice, Confidentiality, AES, TRNG, Acceleration, Mobile phone, Video game, Atmosphere of Earth, Bluetooth

The GD32VW553 series MCU supports Wi-Fi 6 and Bluetooth LE 5.2 wireless connectivity.

Key Points: 
  • The GD32VW553 series MCU supports Wi-Fi 6 and Bluetooth LE 5.2 wireless connectivity.
  • GigaDevice provides the new GD32VW553 series MCU with a range of free development tools , including GD32 IDE, GD-LINK debugging and download tool, and GD32 All-In-One Programmer.
  • IAR from Sweden will also provide comprehensive support for the new GD32VW553 series MCU, including development and compilation tools as well as tracking and debugging tools.
  • The GD32VW553 series MCU has achieved official Wi-Fi 6 certification from the Wi-Fi Alliance (WFA), Bluetooth certification from the Bluetooth Special Interest Group (Bluetooth SIG), and RF FCC/CE compliance certification.

GigaDevice Launches the GD-xD-W515-EVAL Board: The All-in-One Kit for Rapid Prototyping and Development in Multiple Applications

Retrieved on: 
Wednesday, September 27, 2023
Data management, MCU, GigaDevice, SPI, QSPI, MIC, Light-emitting diode, Privacy, GD, XD, HMI, LCD, Flash, CAU, Somatosensory system, Ivanti Pulse Connect Secure data breach, TSI, Video game, Electric battery

This evaluation platform leverages various GigaDevice products, enabling customers to evaluate multiple hardware and software combinations all within one comprehensive kit.

Key Points: 
  • This evaluation platform leverages various GigaDevice products, enabling customers to evaluate multiple hardware and software combinations all within one comprehensive kit.
  • The GD-xD-W515-EVAL Board is the first evaluation kit in the xD series, it comprises a mainboard, a fingerprint board, and an LCD board within a compact footprint.
  • Multiple Information Output Choices: Equipped with a flat vibration motor, multi-channel LEDs, and an LCD screen for versatile information output.
  • For more information please visit: www.gigadevice.com/gd-xd-w515-eval-board , and you will have a chance to order a free W515 evaluation board.

GigaDevice Launches the GD-xD-W515-EVAL Board: The All-in-One Kit for Rapid Prototyping and Development in Multiple Applications

Retrieved on: 
Wednesday, September 27, 2023
Data management, MCU, GigaDevice, SPI, QSPI, MIC, Light-emitting diode, Privacy, GD, XD, HMI, LCD, Flash, CAU, Somatosensory system, Ivanti Pulse Connect Secure data breach, TSI, Video game, Electric battery

This evaluation platform leverages various GigaDevice products, enabling customers to evaluate multiple hardware and software combinations all within one comprehensive kit.

Key Points: 
  • This evaluation platform leverages various GigaDevice products, enabling customers to evaluate multiple hardware and software combinations all within one comprehensive kit.
  • The GD-xD-W515-EVAL Board is the first evaluation kit in the xD series, it comprises a mainboard, a fingerprint board, and an LCD board within a compact footprint.
  • Multiple Information Output Choices: Equipped with a flat vibration motor, multi-channel LEDs, and an LCD screen for versatile information output.
  • For more information please visit: www.gigadevice.com/gd-xd-w515-eval-board , and you will have a chance to order a free W515 evaluation board.

GigaDevice Launches the GD32H7 Arm® Cortex®-M7 MCU Product Family, Delivering Exceptional Performance for Embedded Systems

Retrieved on: 
Monday, May 29, 2023
3DES, ECC, Eclipse, IAR, MCU, ETM, KEIL, The, DES, DSP, SDRAM, USB, TCM, Confidentiality, PWM, AXI, IPA, UART, I2C, Flash memory, Environment, Embedded, GigaDevice, QSPI, Rotation, TFT-LCD, GD32, FAC, Machine learning, ADC, TMU, SPI, Octal, SWD, CPU, Algorithm, AHB, Full Speed (album), System software, DAC, FPU, OTG, Digital signal processing, OSPI, Floating-point unit, ROM, Digital signal, Intelligence, SAI, Flash, GUI, SRAM, Artificial intelligence, AES, Ecosystem, AI, IDE, Spiš, Computer data storage, Video game

BEIJING, May 29, 2023 (GLOBE NEWSWIRE) -- GigaDevice Semiconductor Inc. introduces its first Arm® Cortex®-M7 core microcontroller (MCU) product family, the GD32H737/757/759 ultra-high performance MCU series.

Key Points: 
  • BEIJING, May 29, 2023 (GLOBE NEWSWIRE) -- GigaDevice Semiconductor Inc. introduces its first Arm® Cortex®-M7 core microcontroller (MCU) product family, the GD32H737/757/759 ultra-high performance MCU series.
  • "The popularization of connected devices and AI algorithms are driving more intelligence into embedded designs," said Eric Jin, GigaDevice's Product Marketing Director.
  • The GD32H7 MCU series adopts an Arm® Cortex®-M7 high-performance core based on Armv7E-M architecture, with up to 600MHz clock frequency.
  • GigaDevice provides a free development environment for the new GD32H7 MCU series, the GD32 Eclipse IDE, and the GD32 All-In-One Programmer.

Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP

Retrieved on: 
Thursday, May 18, 2023
SPI, QSPI, Octal, Hertz, PHY, PSRAM, UVM, Arasan, IP, Flash, UFS, Open NAND Flash Interface Working Group, SRAM, Socs, SAN, Serial Peripheral Interface, Verilog, JEDEC, FPGA, Total, VIP, Software, Telecommunications, Cable television

SAN JOSE, Calif., May 18, 2023 /PRNewswire/ -- Arasan expands its solid state storage IP portfolio with the announcement of the immediate availability of its Total eXpanded Serial Peripheral Interface (xSPI) IP including xSPI PHY compliant to the JEDEC JESD251 xSPI Specification V1.0. The xSPI IP also supports JESD216D Serial Flash Discoverable Parameters (SFDP). The JEDEC JESD251 standardizes the NOR Flash Device Interfaces. PSRAM is also supported.

Key Points: 
  • Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, today announced the immediate availability of its SUREBOOT™ Total xSPI IP Solution which now includes the xSPI PHY IP.
  • SAN JOSE, Calif., May 18, 2023 /PRNewswire/ -- Arasan expands its solid state storage IP portfolio with the announcement of the immediate availability of its Total eXpanded Serial Peripheral Interface (xSPI) IP including xSPI PHY compliant to the JEDEC JESD251 xSPI Specification V1.0.
  • Arasan provides a Total xSPI IP Solution with xSPI PHY and software, FPGA prototyping platform and 3'rd party UVM based VIP in addition to the Verilog RTL code and test environment.
  • Arasan Total xSPI IP joins its comprehensive portfolio of solid state storage IP which includes Total UFS IP, Total eMMC IP and Total NAND IP Solutions.

Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP

Retrieved on: 
Thursday, May 18, 2023
SPI, QSPI, Octal, Hertz, PHY, PSRAM, UVM, Arasan, IP, Flash, UFS, Open NAND Flash Interface Working Group, SRAM, Socs, SAN, Serial Peripheral Interface, Verilog, JEDEC, FPGA, Total, VIP, Software, Telecommunications, Cable television

SAN JOSE, Calif., May 18, 2023 /PRNewswire/ -- Arasan expands its solid state storage IP portfolio with the announcement of the immediate availability of its Total eXpanded Serial Peripheral Interface (xSPI) IP including xSPI PHY compliant to the JEDEC JESD251 xSPI Specification V1.0. The xSPI IP also supports JESD216D Serial Flash Discoverable Parameters (SFDP). The JEDEC JESD251 standardizes the NOR Flash Device Interfaces. PSRAM is also supported.

Key Points: 
  • Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, today announced the immediate availability of its SUREBOOT™ Total xSPI IP Solution which now includes the xSPI PHY IP.
  • SAN JOSE, Calif., May 18, 2023 /PRNewswire/ -- Arasan expands its solid state storage IP portfolio with the announcement of the immediate availability of its Total eXpanded Serial Peripheral Interface (xSPI) IP including xSPI PHY compliant to the JEDEC JESD251 xSPI Specification V1.0.
  • Arasan provides a Total xSPI IP Solution with xSPI PHY and software, FPGA prototyping platform and 3'rd party UVM based VIP in addition to the Verilog RTL code and test environment.
  • Arasan Total xSPI IP joins its comprehensive portfolio of solid state storage IP which includes Total UFS IP, Total eMMC IP and Total NAND IP Solutions.

Global Automotive Memory Chip Market to 2027: Chinese Storage Suppliers Accelerate Deployment in the Promising Automotive Storage Market

Retrieved on: 
Tuesday, March 28, 2023
Cloud, Communication, Counterpoint, DDR3, Original equipment manufacturer, L5, Temperature, Lidar, Continental, MMC, Memory, Flash memory, App, Powe, XPeng P7, Software, Integrated circuit, GigaDevice, GPS, QSPI, EEPROM, OBC, LPDDR5, Electronics, ISO, GDDR, TB, Ingenic Semiconductor, SK Hynix, PCI Express, MultiMediaCard, UFS, LPDDR, Car, Growth, Cloud computing, GB, Intellectual property, DDR, DRAM, LPDDR3, IVI, Micron Technology, SOC, WD, DDR2, VCU, Radar, CPU, GDDR6, RAM, L4, Samsung, Micrometre, Qualcomm, Flash, SSD, FOTA, SRAM, Reading, AI, EB, IDMS, Cryptocurrency, Electric battery, Computer data storage, Video game, Satellite navigation device, Lexar, L3, LPDDR4, ADAS

The global smart phone storage market size hit US$46 billion in 2021 when the global automotive storage market size reached about US$4.5 billion, which is only equivalent to 1/10 of the former.

Key Points: 
  • The global smart phone storage market size hit US$46 billion in 2021 when the global automotive storage market size reached about US$4.5 billion, which is only equivalent to 1/10 of the former.
  • By 2027, global automotive storage market size will exceed US$12.5 billion, with a CAGR of 18.6% from 2021 to 2027.
  • High-level autonomous vehicles have posed enormous demand for automotive memory capacity, density and bandwidth
    At present, main storage applications in automotive market include DRAM(DDR, LPDDR) and NAND (e.MMC and UFS, etc.).
  • 3.1 Memory Chip Application Scenario: Cockpit
    3.2 Memory Chip Application Scenario: Autonomous Driving
    3.3 Memory Chip Application Scenario: Driving Data Recording
    3.4 Memory Chip Application Scenarios: Cloud Computing and Storage

Global Automotive Memory Chip Industry Research Report 2022: Featuring Samsung, SK Hynix, Micron, Kioxia and Fujitsu Among Others - ResearchAndMarkets.com

Retrieved on: 
Friday, March 24, 2023
Technology, Hardware, Integrated circuit, Communication, QSPI, DDR, DRAM, LPDDR5, LPDDR3, Electronics, ISO, GDDR, Software, TB, DDR3, IVI, SK Hynix, PCI Express, Samsung, Micrometre, L5, Qualcomm, Micron Technology, SOC, Flash, Lidar, SSD, MultiMediaCard, UFS, DDR2, MMC, FOTA, LPDDR, GDDR6, Flash memory, RAM, Reading, Growth, L4, GB, Computer data storage, Video game, L3, LPDDR4, ADAS

High-level autonomous vehicles have posed enormous demand for automotive memory capacity, density and bandwidth

Key Points: 
  • High-level autonomous vehicles have posed enormous demand for automotive memory capacity, density and bandwidth
    At present, main storage applications in automotive market include DRAM(DDR, LPDDR) and NAND (e.MMC and UFS, etc.).
  • Low-power LPDDR and NAND will be main growth engines, and the demand for NOR Flash, used for chip startup, will continue to increase.
  • Overseas storage vendors such as Micron, Samsung, SK Hynix and Microchip still dominate the development of the automotive storage industry as monopolists.
  • In 2021, Micron launched its industry-leading automotive LPDDR5 certified by ISO 26262 ASIL-D, with the maximum capacity of 128GB.

Renesas Expands RA MCU Family with Two New Entry-Line Groups Offering Optimal Combination of Performance, Features and Value

Retrieved on: 
Tuesday, March 14, 2023
Technology, Hardware, Semiconductor, Consumer Electronics, SCI, GPIO, Kilobyte, FSP, Renesas Electronics, SRAM, SPI, FD, VUI, Internet of things, Senior, SSI, Winning Combination, QSPI, Family, Voice user interface, Lightwave Electronics Corporation, I3C, Temperature, Computing, Multimedia, MCU, Software, RAM, USB, Internet, RA, HDMI, Ecosystem, BGA, HDMI CEC, QFN, Video game, Computer data storage

It enables flexible use of legacy code as well as easy compatibility and scalability with other RA family devices.

Key Points: 
  • It enables flexible use of legacy code as well as easy compatibility and scalability with other RA family devices.
  • “Our RA Family continues to exceed expectations by delivering market-leading performance, features, ease-of-design and value,” said Roger Wendelken, Senior Vice President in the IoT and Infrastructure Business Unit at Renesas.
  • “The new RA4E2 and RA6E2 Groups are exceptional examples of why many customers have adopted the RA family as their MCU family of choice.
  • Renesas is also offering separate Evaluation Kits and fast prototyping boards for both MCU Groups.