HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering
Presto Engineering, a European leading expert in application-specific integrated circuit (ASIC) design, engineering, and production services, successfully collaborated with HaiLa to develop the first complete analog and digital implementation of HaiLa’s passive backscatter technology adapted to Wi-Fi RF bands.
- Presto Engineering, a European leading expert in application-specific integrated circuit (ASIC) design, engineering, and production services, successfully collaborated with HaiLa to develop the first complete analog and digital implementation of HaiLa’s passive backscatter technology adapted to Wi-Fi RF bands.
- Supporting an SPI interface, the chip brings seamless connectivity to a wide range of IoT devices, such as multi-channel temperature and humidity sensors.
- The joint partnership to develop the BSC2000 demonstrates the path to extreme-low power in IoT devices used in building, home and industrial automation; consumer electronics and wearables; smart transportation; agriculture; medical; and automotive markets.
- Visit HaiLa at CES for a demonstration, Las Vegas Convention Center, West Hall, booth 6300, January 9-12.