GPIO

INDUSTRY LEADING PPA EFPGA AND DSP/AI IN DEVELOPMENT FOR TSMC N5/4/3

Retrieved on: 
Tuesday, April 9, 2024
Pixel, DSP, GPIO, Inference, IPS, Complex, Urinary tract infection, FFT, Field-programmable gate array, Silicon, Architecture, Graphics processing unit, SDR, IP, FPGA, TSMC

MOUNTAIN VIEW, Calif., April 9, 2024 /PRNewswire/ -- Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and reconfigurable DSP/AI solutions, announced that it is in development of next generation EFLX eFPGA Generation 3.0 for TSMC N5/4 and N3. EFLX Generation 3.0, along with the eXpreso™ eFPGA compiler enables Millions of LUTs and higher frequency operation; and LUTs that can programmably be I/O's for applications requiring a lot of control like networking switches or InferX DSP/SDR/AI. EFLX Gen3.0 can reconfigure in a few microseconds for dynamic workload switches.

Key Points: 
  • MOUNTAIN VIEW, Calif., April 9, 2024 /PRNewswire/ -- Flex Logix® Technologies, Inc. , the leading supplier of embedded FPGA (eFPGA) IP and reconfigurable DSP/AI solutions, announced that it is in development of next generation EFLX eFPGA Generation 3.0 for TSMC N5/4 and N3.
  • EFLX Generation 3.0, along with the eXpreso™ eFPGA compiler enables Millions of LUTs and higher frequency operation; and LUTs that can programmably be I/O's for applications requiring a lot of control like networking switches or InferX DSP/SDR/AI.
  • "Our commercial customers rely on our TSMC EFLX eFPGA technology already from 40nm to 7nm for applications including reconfigurable crypto agility, micro FPGA, programmable GPIO, customer-programmable accelerators, reconfigurable packet processing, asynchronous control and many more.
  • We are now supporting our customers on TSMC N5/4/3 with our improved EFLX architecture and our new InferX DSP/AI hardware and the InferX compiler.

Silicon Labs xG26 Sets New Standard in Multiprotocol Wireless Device Performance

Retrieved on: 
Tuesday, April 9, 2024
Silicon Labs, Attention, SOC, Algorithm, Bluetooth Low Energy, GPIO, Bluetooth mesh networking, Acceleration, Intelligence, Internet of things, Network layer, Wireless, Internet, Sleep, ARM, Running, RAM, Silicon, Home, ARM architecture family, Radio, MG26, CCTV, CPU, Machine learning, Family, Matter, Code, Bluetooth, Video game

AUSTIN, Texas, April 9, 2024 /PRNewswire/ -- Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date. The new family consists of the multiprotocol MG26 SoC, the Bluetooth LE BG26 SoC, and the PG26 MCU. All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter, with double the Flash and RAM of other Silicon Labs multiprotocol devices.

Key Points: 
  • All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter , with double the Flash and RAM of other Silicon Labs multiprotocol devices.
  • That's Matter's interoperability and security promise, which is why Silicon Labs designed the MG26 to be the most advanced SoC for the Matter standard.
  • Pin compatibility between select xG26 and xG24 devices and shared hardware and software development tools like Silicon Labs Simplicity Studios allows for easy development and seamless migration from other Silicon Labs Series 2 devices.
  • Learn more about how to begin developing cutting-edge IoT devices using Silicon Labs, be sure to :

SmartCow introduces Uranus Plus: An AI Fanless Embedded System Powered by NVIDIA Jetson Orin

Retrieved on: 
Monday, February 26, 2024
GPIO, SSD, NVM Express, AI, USB, Intelligence, API, San Jose Convention Center, OTG, Safety, GTC, Uranus, Nvidia Jetson, LAN, Wi-Fi, NVIDIA, Medical device

ST JULIANS, Malta, Feb. 25, 2024 /PRNewswire/ -- SmartCow, an AI engineering company specializing in building complex hardware and software solutions for artificial intelligence at the edge, announces the launch of their latest product, Uranus Plus, an AI fanless embedded system powered by the latest NVIDIA Jetson ™ Orin NX and Jetson Orin Nano™ system-on-modules.

Key Points: 
  • ST JULIANS, Malta, Feb. 25, 2024 /PRNewswire/ -- SmartCow, an AI engineering company specializing in building complex hardware and software solutions for artificial intelligence at the edge, announces the launch of their latest product, Uranus Plus, an AI fanless embedded system powered by the latest NVIDIA Jetson ™ Orin NX and Jetson Orin Nano™ system-on-modules.
  • Uranus Plus supercharges vision AI application development at the edge with NVIDIA Metropolis Microservices for Jetson through app stack modernization.
  • "Uranus Plus is suitable for general smart applications, especially vision AI projects and AI gateways.
  • SmartCow will exhibit Uranus Plus at NVIDIA GTC 2024 — a global AI conference running March 18-21 online and at the San Jose Convention Center — in booth 342.

SparkFun Electronics Unleashes the ESP32-C6 Thing Plus: A Wireless Innovation Powerhouse

Retrieved on: 
Friday, February 9, 2024
Lithium polymer battery, Electronics, PTH, Ecosystem, SparkFun Electronics, Life, JST, Internet of things, Payment card, Hertz, GPIO, Power management, Benefit, Video game

BOULDER, Colo., Feb. 9, 2024 /PRNewswire/ -- SparkFun Electronics releases the ESP32-C6 Thing Plus, a game-changing wireless development board set to elevate your projects to new heights. For over eight years SparkFun has been designing around Espressif technologies, and the release of the ESP32-C6 signals the completion of SparkFun's first major roadmap for development boards using ESP-based modules.

Key Points: 
  • The SparkFun ESP32-C6 Thing Plus is poised to revolutionize IoT projects with its intuitive design, powerful features, and seamless connectivity.
  • BOULDER, Colo., Feb. 9, 2024 /PRNewswire/ -- SparkFun Electronics releases the ESP32-C6 Thing Plus , a game-changing wireless development board set to elevate your projects to new heights.
  • The SparkFun ESP32-C6 Thing Plus combines cutting-edge technology with a compact, user-friendly design.
  • "We're thrilled to introduce the SparkFun Thing Plus - ESP32-C6," says Kirk Benell, CTO at SparkFun Electronics.

Silicon Labs and Arduino Partner to Democratize Matter

Retrieved on: 
Tuesday, February 6, 2024
Partnership, GitHub, DBm, Family, Silicon Labs, Internet of things, Language, Environment, RAM, Running, Ecosystem, Simplicity, Certification, Wireless, Documentation, Arduino Nano, Silicon, Privacy, SparkFun Electronics, Student, Software, IDE, GPIO, Library, Video game

AUSTIN, Texas, Feb. 6, 2024 /PRNewswire/ -- Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced a new partnership in collaboration with Arduino, the global leader in open-source hardware and software, to better enable seamless development of Matter over Thread applications for Arduino's 33 million-strong developer community. Developed in collaboration with Silicon Labs, Arduino's first-ever Matter software libraries are available today on both the xG24 Explorer Kit from Silicon Labs and the xG24-based SparkFun Thing Plus Matter – MGM240P development board.

Key Points: 
  • Developed in collaboration with Silicon Labs, Arduino's first-ever Matter software libraries are available today on both the xG24 Explorer Kit from Silicon Labs and the xG24-based SparkFun Thing Plus Matter – MGM240P development board.
  • Code samples, reference designs, documentation and more are now live in the Arduino Core for Silicon Labs Devices GitHub page.
  • This new partnership between Silicon Labs and Arduino is a part of Silicon Labs' ongoing goal to make IoT development as user-friendly and expedient as possible.
  • Learn more about how Silicon Labs is looking inward and outward to make the lives of developers easier:

pSemi Unveils PE562212, Its Smallest and Fully Integrated PA-LNA-SW IoT Front-End Module

Retrieved on: 
Tuesday, January 9, 2024
Semiconductor, IOT (Internet of Things), Technology, Mobile, Wireless, Networks, Internet, Hardware, RF, PCB, Hertz, Semiconductor industry, Multimedia, LGA, SMD, FEM, ESD, BLE, DBm, Wi-Fi, CES, Typ, Marketing, GPIO, Internet of things, Internet service provider

pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration and advanced connectivity, today announced the introduction of their smallest PA-LNA-SW Internet of Things (IoT) front-end module (FEM): the PE562212.

Key Points: 
  • pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration and advanced connectivity, today announced the introduction of their smallest PA-LNA-SW Internet of Things (IoT) front-end module (FEM): the PE562212.
  • The PE562212 enables connectivity across Thread, Zigbee®, Bluetooth® BDR/EDR, BLE, and low-medium throughput Wi-Fi® (MCS7) as well as 2.4 GHz proprietary applications.
  • It also offers excellent ESD and ruggedness for all intended applications and environmental conditions inherent to the IoT space.
  • Samples and EVKs for PE562212 are available now, directly through pSemi, and are expected to be commercially available by August 2024.

Atmosic and AONDevices announce strategic partnership to leverage both the benefits of AI and energy harvesting to lower power consumption in AIoT Smart Home devices

Retrieved on: 
Wednesday, January 10, 2024
RF, AON, Sound, Artificial intelligence, SOC, Wireless, Radio, Partnership, Memory, AI, Spacecraft, Artificial intelligence of things, Human, GPIO, Television, Bluetooth Low Energy, Thread, SVP

CAMPBELL,Calif. and IRVINE, Calif., Jan. 10, 2024 /PRNewswire/ -- Atmosic Technologies, an innovator of ultra-low-power wireless IoT platforms such as the award-winning ATM33/e, today announced its strategic partnership with AONDevices, a pioneer in low-power application-specific edge Artificial Intelligence (AI) processors including the AON1120. The collaboration brings together low-power AI capabilities and ultra-low-power wireless technology, for innovative AIoT and wearable applications.

Key Points: 
  • Atmosic's partnership with AONDevices will reduce product power consumption by reducing false detect wakeups, RF transmissions, and cloud time.
  • The collaboration brings together low-power AI capabilities and ultra-low-power wireless technology, for innovative AIoT and wearable applications.
  • Atmosic has set a golden standard in IoT sustainability by reducing the power consumption of RF radios, and by leveraging harvested energy to power sensors, tags, remotes, and more.
  • The partnership with AONDevices brings further power reductions by cutting energy used when sensors 'false detect'.

XIMEA Releases High Speed Cameras With Resolutions Up To 21 Mpix With Speeds Above 300 FPS

Retrieved on: 
Monday, December 18, 2023
Polsat News 2, Starz (Canadian TV channel), ROI, PCI Express, DMA, Binning, CPU, Housing, FPS, CMOS, GPIO, Noise, EF, Camera, Television, Computer data storage, Gigapixel image

MUNSTER, Germany, Dec. 18, 2023 /PRNewswire-PRWeb/ -- XIMEA, a pioneer in high speed interfaces, developed new models for the well established camera family of high resolution line cameras with PCI Express interface.

Key Points: 
  • XIMEA, a pioneer in high speed interfaces, developed new models for the well established camera family of high resolution line cameras with PCI Express interface.
  • MUNSTER, Germany, Dec. 18, 2023 /PRNewswire-PRWeb/ -- XIMEA, a pioneer in high speed interfaces, developed new models for the well established camera family of high resolution line cameras with PCI Express interface.
  • This PCIe high-speed camera line from XIMEA called xiB-64 already contains fast models ranging from 1 Mpix at 3600 Fps to 65 Mpix at 71 Fps.
  • The new models with names CB209, CB100 and CB024 offer resolutions up to 21 Megapixels at outstanding speeds of 300 frames per second.

Valens Semiconductor's New USB3.2 Extension Solution Named as CES 2024 Innovation Awards Honoree

Retrieved on: 
Tuesday, November 21, 2023
NYSE, CES, Engineering, Advanced driver-assistance system, USB, Valens Semiconductor, ISO, Consumer Technology Association, UART, Cybook Gen1, LVCC, HDBaseT, USB3, Control, INT, ADAS, USB2, Information technology, Innovation, CTA, GPIO, VLN, SVP, Education, Consumer electronics

HOD HASHARON, Israel, Nov. 21, 2023 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN), a premier provider of high-performance connectivity solutions for the audio-video and automotive markets, today announced that it has been named a CES® 2024 Innovation Awards Honoree in the Embedded Technologies category. This year's CES Innovation Awards program received a record number of over 3000 submissions. The announcement was made ahead of CES 2024, happening January 9-12 in Las Vegas, NV. The Company's latest innovations for in-vehicle connectivity advancing Advanced Driver Assistance Systems (ADAS), autonomous and vehicle safety, as well as the VS6320 chipset, will be showcased at LVCC West Hall #W317.

Key Points: 
  • This year's CES Innovation Awards program received a record number of over 3000 submissions.
  • The announcement was made ahead of CES 2024 , happening January 9-12 in Las Vegas, NV.
  • Valens Semiconductor's VS6320 provides extension of high-performance USB3.2 Gen1 peripherals at up to 100 meters/328 feet over category cable.
  • Please join Valens Semiconductor at CES 2024 (LVCC, West Hall, #W317, January 9 –12, 2024) to learn more about our latest innovations for advancing in-vehicle connectivity advancing ADAS, autonomous and vehicle safety, as well as the VS6320 audio-video USB3 extension solution.

GigaDevice Launches Brand New Wi-Fi 6 MCU Series - GD32VW553

Retrieved on: 
Thursday, November 9, 2023
SPI, PTA, SRAM, Wi-Fi 6, RFIC, QSPI, Architecture, TWT, IEEE, Android SDK, Partnership, CPU, Sleep, Internet of things, Connectivity Standards Alliance, Temperature, MCU, Wi-Fi, Automatic gain control, Certification, Internet, ART, Ecosystem, WFA, GD32, WPA3, Monolithic kernel, CSA, SSE, IEEE 802.11n-2009, OTA, RF, Bluetooth Special Interest Group, AGC, Artificial intelligence of things, Orthogonal frequency-division multiple access, ADC, GPIO, Data-rate units, Connectivity, Communication, WPA, OFDMA, PWM, DSP, Bluetooth Low Energy, FPU, GigaDevice, Confidentiality, AES, TRNG, Acceleration, Mobile phone, Video game, Atmosphere of Earth, Bluetooth

The GD32VW553 series MCU supports Wi-Fi 6 and Bluetooth LE 5.2 wireless connectivity.

Key Points: 
  • The GD32VW553 series MCU supports Wi-Fi 6 and Bluetooth LE 5.2 wireless connectivity.
  • GigaDevice provides the new GD32VW553 series MCU with a range of free development tools , including GD32 IDE, GD-LINK debugging and download tool, and GD32 All-In-One Programmer.
  • IAR from Sweden will also provide comprehensive support for the new GD32VW553 series MCU, including development and compilation tools as well as tracking and debugging tools.
  • The GD32VW553 series MCU has achieved official Wi-Fi 6 certification from the Wi-Fi Alliance (WFA), Bluetooth certification from the Bluetooth Special Interest Group (Bluetooth SIG), and RF FCC/CE compliance certification.