LVDS

Advance Beyond Boundaries with Corelis

Retrieved on: 
Wednesday, April 3, 2024
Consumer Electronics, Technology, Manufacturing, IOT (Internet of Things), Robotics, Semiconductor, Other Technology, Other Manufacturing, Software, Engineering, Hardware, Conference, Embedded, Electronics, BSDL, PCI eXtensions for Instrumentation, Telecommunications, LVDS, JTAG, IPC, Printed circuit board

Corelis will showcase its latest embedded hardware test solutions, bus analyzer tools, and other JTAG boundary-scan products, renowned for their ease-of-use, and exceptional features.

Key Points: 
  • Corelis will showcase its latest embedded hardware test solutions, bus analyzer tools, and other JTAG boundary-scan products, renowned for their ease-of-use, and exceptional features.
  • Join us as we advance beyond boundaries and drive the future of test in the rapidly evolving electronics industry.
  • For more than three decades, Corelis has been empowering customers with innovative automated test solutions for debugging, testing, and in-system programming of embedded hardware.
  • Corelis’ customers comprise the foremost global manufacturers of electronic products in industries such as military-aerospace, consumer electronics, telecommunications, semiconductors, networking, and medical.

Cervoz at Embedded World 2024: Empowering Industry with Future-Ready Solutions

Retrieved on: 
Monday, March 25, 2024
ECC, Automation, Temperature, Communication, M.2, Memory, Data loss, Internet of things, NVM Express, DDR5, AI, PCI Express, Gigabit Ethernet, Solid-state drive, LVDS, Hall, Mobile phone

TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.

Key Points: 
  • TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.
  • At the event, Cervoz will showcase its advanced solutions in themes echoing today's industrial trends, highlighting edge and advanced computing, compact design, interconnectivity, and more.
  • Acknowledging the surge in edge computing, Cervoz introduces M.2 2230 (A+E Key) NVMe Gen3x2 solutions, the T425 series .
  • Lead the future of industries—join Cervoz at Embedded World 2024 in Hall 1, Booth 1-401.

Cervoz at Embedded World 2024: Empowering Industry with Future-Ready Solutions

Retrieved on: 
Monday, March 25, 2024
ECC, Automation, Temperature, Communication, M.2, Memory, Data loss, Internet of things, NVM Express, DDR5, AI, PCI Express, Gigabit Ethernet, Solid-state drive, LVDS, Hall, Mobile phone

TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.

Key Points: 
  • TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.
  • At the event, Cervoz will showcase its advanced solutions in themes echoing today's industrial trends, highlighting edge and advanced computing, compact design, interconnectivity, and more.
  • Acknowledging the surge in edge computing, Cervoz introduces M.2 2230 (A+E Key) NVMe Gen3x2 solutions, the T425 series .
  • Lead the future of industries—join Cervoz at Embedded World 2024 in Hall 1, Booth 1-401.

STMicroelectronics powers up the intelligent edge with second-generation STM32 microprocessors, bringing performance boost and industrial resilience

Retrieved on: 
Thursday, March 7, 2024
CyberTrust, Cortex, TSN, NPU, LVDS, Multimedia, STM32, Artificial intelligence, AI, MIPI, USB, Internet of things, VPU, USB 3.0, Electronics, Patent, Digital, Bit, Projection, Communication, General-purpose, Safety, DSI, PTP, STMicroelectronics, ARM Cortex-M, ISP, Android, GPU, MPU, Ecosystem, STM, Arm, United States patent law, Cloud computing, CPU, Video game

ST’s new STM32MP2 MPUs will power the next generations of equipment that create the fabric of this evolving digital world.

Key Points: 
  • ST’s new STM32MP2 MPUs will power the next generations of equipment that create the fabric of this evolving digital world.
  • These include industrial controllers and machine-vision systems, scanners, medical wearables, data aggregators, network gateways, smart appliances, and industrial and domestic robots.
  • The devices are fully supported with STM32 development resources that are familiar to engineers working with ST’s STM32 microcontrollers (MCUs) and STM32 microprocessors.
  • * STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere.

Teledyne e2v announces next generation of high-performance global shutter CMOS image sensors

Retrieved on: 
Tuesday, November 21, 2023
Emerald, CLGA, Marketing, MIPI, LVDS, CMOS, Documentation, Noise, TDY, ADC

GRENOBLE, France, Nov. 21, 2023 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces Emerald™ Gen2 , its new state-of-the-art CMOS image sensor family.

Key Points: 
  • GRENOBLE, France, Nov. 21, 2023 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces Emerald™ Gen2 , its new state-of-the-art CMOS image sensor family.
  • Built on Teledyne e2v’s advanced imaging technologies, this new family delivers enhanced performance, making the new sensors ideal for a wide range of machine vision uses, outdoor surveillance, and traffic detection and monitoring cameras.
  • Emerald Gen2 is available in 8.9-Megapixels (4,096 x 2,160) or 12-Megapixels (4,096 x 3,072), in monochrome or color, and in two-speed grades, standard and high.
  • The sensor has a small 2.8 µm global shutter pixel, designed with Teledyne e2v’s latest generation light pipe technology, which provides up to 67 dB dynamic range in 10-bit and 12-bit ADC mode.

Variscite Unveils i.MX 95-based System on Module For Powerful, Next Generation Edge platforms

Retrieved on: 
Thursday, November 2, 2023
Semiconductor, Security, Technology, Audio, Video, Artificial Intelligence, Hardware, Cortex, Internet of things, System on module, LVDS, MX, MIPI, NXP, Software, NPU, Aviation, ISP, GPU, Som, Platinum, Robotics, Silicon, Video game, Variscite

Variscite , a leading worldwide System on Module (SoM) designer, developer and manufacturer, today announced the upcoming release of the new DART-MX95 for high-performance edge applications including industrial, medical, aviation, IoT, robotics, vision-capable and smart edge devices.

Key Points: 
  • Variscite , a leading worldwide System on Module (SoM) designer, developer and manufacturer, today announced the upcoming release of the new DART-MX95 for high-performance edge applications including industrial, medical, aviation, IoT, robotics, vision-capable and smart edge devices.
  • Designed for high-end scalable computing, DART-MX95 is based on NXP’s i.MX 95 application processor family.
  • The Pin2Pin family provides an extended lifespan, reduced development time, costs, and risks as well as scalability to additional modules.
  • Variscite ensures supply continuity of 15 years to preserve customers’ engineering investment for their embedded designs.

Parade Technologies Reports Third Quarter 2023 Financial Results

Retrieved on: 
Wednesday, November 1, 2023
Semiconductor, Consumer Electronics, Technology, Mobile, Wireless, Audio, Video, Hardware, AEC, LVDS, VCU, DisplayPort, Taipei Exchange, Embedded, Video game, Television, Parade

Parade Technologies, Ltd. (Taipei Exchange: 4966.TWO), a leading high-speed interface IC supplier, today announced financial results for the third quarter fiscal year 2023 ended September 30, 2023, and provided guidance for the fourth quarter of fiscal year 2023.

Key Points: 
  • Parade Technologies, Ltd. (Taipei Exchange: 4966.TWO), a leading high-speed interface IC supplier, today announced financial results for the third quarter fiscal year 2023 ended September 30, 2023, and provided guidance for the fourth quarter of fiscal year 2023.
  • In US dollars, the third quarter of 2023 consolidated revenue increased 12.27% sequentially and was down 22.57% year-over-year.
  • The gross profit in the third quarter of 2023 was US$51.17 million, representing an increase of 11.74% from the previous quarter and a decrease of 25.15% compared to the same quarter of last year.
  • Based on current business outlook, Parade is providing the following guidance for the fourth quarter of fiscal 2023:
    The financial figures detailed above for the third quarter of 2023 have been reviewed by independent accountants.

Beacon EmbeddedWorks High-Performance i.MX 8M Plus SOM - Ready to Drive Embedded AI/ML Applications

Retrieved on: 
Wednesday, November 1, 2023
Cortex, SOM, SPI, ARM, LVDS, UART, Bluetooth, DiscoverIE Group, NXP, Baseboard, MIPI, PDM, Hertz, REACH, Restriction of Hazardous Substances Directive, USB, NPU, GPIO, Electronics, Payment card, ML, HDMI, Algorithm, MIPI DSI, Medical device, Video game, Telescopic sight, Ethernet, Beacon

The i.MX 8M Plus SOM stands out as the premier selection for security, power-efficiency, and high-definition video and graphics processing.

Key Points: 
  • The i.MX 8M Plus SOM stands out as the premier selection for security, power-efficiency, and high-definition video and graphics processing.
  • The Zoom™ Development Kit includes an i.MX 8M Plus SOM, baseboard, power supply, microSD card, and all necessary cables.
  • By leveraging the fully tested and pre-certified i.MX 8M Plus SOM, you can reduce design risk and kickstart your development process.
  • For more information about the i.MX 8M Plus SOM and Zoom™ Development Kit, visit www.beaconembedded.com/8mplus .

Parade Technologies Expands DisplayPort™ Interface Adaptation for Automotive Grade LVDS Display Panels

Retrieved on: 
Wednesday, October 18, 2023
Vehicle Technology, Semiconductor, Automotive, Technology, Audio, Video, Hardware, Digital, OEM, LVDS, System, Temperature, DVD, DP, LQFP, VCU, DisplayPort, Socs, Notebook, EDP, HDCP, Safety, Graphics processing unit, Embedded, High-bandwidth Digital Content Protection, Marketing, Television, Video game

The PS8627V is used to convert a DisplayPort™ (DP) or eDP™ (Embedded DisplayPort) video transport stream to the LVDS (Low-Voltage Differential Signaling) interface used by automotive-grade display panels or display assemblies.

Key Points: 
  • The PS8627V is used to convert a DisplayPort™ (DP) or eDP™ (Embedded DisplayPort) video transport stream to the LVDS (Low-Voltage Differential Signaling) interface used by automotive-grade display panels or display assemblies.
  • For comparison, PS8625V, the current DP/eDP to LVDS converter in mass production for top automotive OEM, supports up to 1920x1200 display resolution.
  • The automotive industry is currently following the consumer electronic trend in transitioning from display panels using an LVDS interface to those using eDP.
  • While automotive-grade eDP display panels are slowly becoming available, many automotive-grade LVDS panels of various sizes remain in production.

WINSYSTEMS Announces Industrial COM Express® Type 6 Compact CPU Module Built on 11th Gen Intel® Core™ i3/i5/i7 Processors with RAM-Down Design

Retrieved on: 
Thursday, August 24, 2023
TPM, Internet of things, EDP, Vibration, USB, Compact, Shock, LPDDR4, PCI Express, LVDS, BIOS, LCD, HDMI, COM Express, SATA, COM, DisplayPort, RAM, Transport, Robotics, DVI, Mobile phone, Online shopping

GRAND PRAIRIE, Texas, Aug. 24, 2023 /PRNewswire/ -- American embedded computing leader WINSYSTEMS today debuted the latest entry in its well-received computer-on-module product line: the COMeT6-1100 COM Express® Type 6 Compact CPU module. Leveraging the 11th Gen Intel® Core™ i3/i5/i7 processors for industrial, IoT and embedded systems, this module offers up to four cores of high-performance processing in a low-power platform. And, with RAM soldered down, it ably handles applications running in environments subject to shock, vibration and extended temperatures.

Key Points: 
  • Leveraging the 11th Gen Intel® Core™ i3/i5/i7 processors for industrial, IoT and embedded systems, this module offers up to four cores of high-performance processing in a low-power platform.
  • The USA-made COMeT6-1100 module is fully compatible with any carrier board conforming to the PICMG® COM Express Type 6 standards.
  • Orders for the new COMeT6-1100 module with 11th Gen Intel® Core™ i7 embedded processor (UP3-class) are being accepted now.
  • By relying on WINSYSTEMS' expertise in embedded industrial computing systems, customers can be confident their applications are built using the optimal computer solution.