CPU

Renesas Unveils Powerful Single-Chip RZ/V2H MPU for Next-Gen Robotics with Vision AI and Real-Time Control

Retrieved on: 
Thursday, February 29, 2024
Semiconductor, Hardware, Robotics, Technology, Artificial Intelligence, Cortex, International, Algorithm, Multimedia, ISSCC, AI, Embedded, Partnership, ICS, Linux, DRP, Conference, OpenCV, BOM, SDK, Reconfigurability, Business analyst, Family, Accelerator, Ben Goertzel, Knowledge, Cloud computing, Software development kit, Software, CPU, Medical device

View the full release here: https://www.businesswire.com/news/home/20240229979997/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240229979997/en/
    Offering the highest levels of performance within the family, the RZ/V2H enables both vision AI and real-time control capabilities.
  • Additionally, pruning technology employed in the DRP-AI3 accelerator significantly improves AI computing efficiency, boosting AI inference performance up to 80 TOPS.
  • This performance boost allows engineers to process vision AI applications directly at edge AI devices without relying on cloud computing platforms.
  • By integrating these cores into a single chip, the device can effectively manage both vision AI and real-time control tasks, making it ideal for demanding robotics applications of the future.

CORSAIR Expands iCUE LINK Ecosystem with Performance-Focused RX Series Fans

Retrieved on: 
Tuesday, February 27, 2024
Technology, Mobile, Wireless, Electronic Games, Audio, Video, Entertainment, Online, Apps, Applications, General Entertainment, Other Technology, Software, Internet, Hardware, Semiconductor, Consumer Electronics, Engineering, Senior, LINK, Multimedia, CRSR, AIO, Growth, GM, DIY, PC, Corsair Gaming, Ecosystem, CPU, Video game

Corsair Gaming, Inc. (Nasdaq: CRSR) today launched the iCUE LINK RX Series of PC cooling fans, further expanding the company's groundbreaking iCUE LINK ecosystem.

Key Points: 
  • Corsair Gaming, Inc. (Nasdaq: CRSR) today launched the iCUE LINK RX Series of PC cooling fans, further expanding the company's groundbreaking iCUE LINK ecosystem.
  • View the full release here: https://www.businesswire.com/news/home/20240227566911/en/
    Corsair Gaming, Inc. (Nasdaq: CRSR) today launched the iCUE LINK RX Series of PC cooling fans, further expanding the company's groundbreaking iCUE LINK ecosystem.
  • The iCUE LINK ecosystem now spans dozens of products across multiple categories including fans, all-in-one (AIO) CPU coolers, and custom cooling components.
  • The positive critical and consumer reception to iCUE LINK has bolstered the company's market presence and underscored iCUE LINK’s potential for future growth.

Quectel’s RG620T 5G Module Hits Mass-Market Milestone with Adoption in Australia

Retrieved on: 
Tuesday, February 27, 2024
Software, Mobile, Wireless, Networks, Internet, Hardware, Consumer Electronics, IOT (Internet of Things), Apps, Applications, Technology, Semiconductor, 5G, Telecommunications, Cortex, FWA, Multimedia, Temperature, ARM, Internet of things, MWC, MediaTek, Wi-Fi, VEX, CSO, IEEE 802.11be, CPU, Mobile phone

This deployment is the first commercial, massive volume production use case for the RG620T and will bring 5G fixed wireless access (FWA) to end users across Australia.

Key Points: 
  • This deployment is the first commercial, massive volume production use case for the RG620T and will bring 5G fixed wireless access (FWA) to end users across Australia.
  • View the full release here: https://www.businesswire.com/news/home/20240227033990/en/
    Quectel’s RG620T 5G module hits mass-market milestone with adoption in Australia (Photo: Business Wire)
    The Quectel RG620T is a series of 5G Sub-6GHz modules designed to support IoT and extended mobile broadband (eMBB) use cases.
  • The module offers maximum data rates over 5G standalone networks of 7.01Gbps downlink and 2.5Gbps uplink.
  • It also integrates 5G capabilities, allowing users to leverage the strengths of both 5G and WiFi 7 for more innovative and demanding application scenarios.

Arrcus Enhances ACE-AI Solution with New Platforms and Functionality to Deliver Lossless Connectivity Fabric for Next-Gen Distributed AI Workloads

Retrieved on: 
Monday, February 26, 2024
Apps, Applications, Mobile, Wireless, Technology, Other Technology, Telecommunications, Software, Networks, Internet, Data Management, Artificial Intelligence, Cloud, ECC, ECN, Intel, MUP, Artificial intelligence, AI, ETS, Partnership, CPU, Communication, RDMA, Data center bridging, PFC, Organization, Remote direct memory access, NVIDIA

As AI workloads become increasingly distributed, driven by economic considerations and application requirements, Arrcus ACE-AI is a platform designed to seamlessly network them across various locations and deliver applications at the edge, with high speed and lossless connectivity.

Key Points: 
  • As AI workloads become increasingly distributed, driven by economic considerations and application requirements, Arrcus ACE-AI is a platform designed to seamlessly network them across various locations and deliver applications at the edge, with high speed and lossless connectivity.
  • Arrcus recognizes the need for a unified networking fabric that interconnects these workloads, regardless of where they may reside.
  • "The future of AI lies in its ubiquity, and Arrcus has built the industry’s most flexible and intelligent fabric that connects and orchestrates distributed AI workloads,” said Shekar Ayyar, Chairman and CEO of Arrcus.
  • "Broadcom is very excited to collaborate with Arrcus to deliver industry-leading switching solutions that are optimized to meet the performance demands of next-generation AI workloads.

Intel Brings AI Everywhere Across Network, Edge, Enterprise

Retrieved on: 
Monday, February 26, 2024
Data Management, Carriers and Services, Technology, Semiconductor, Telecommunications, Software, Artificial Intelligence, Networks, Mobile, Wireless, 5G, Hardware, NEC, Investment, RAN, L&T Technology Services, EDGE Group, Sierra Forest, Ericsson, Organization, Artificial intelligence, Acceleration, Radio access network, Hewlett Packard Enterprise, Xeon, Central processing unit, Amazon Web Services, MWC, Vodafone, Radio, SK Telecom, HPE, Sapphire Rapids, Ecosystem, Verizon Business, Microsoft, Deutsche Telekom, Environment, SAP, Carbon, KDDI, Network, Automation, Dell Technologies, SOC, Research, PSG, Intel, BT Group, Mavenir, TCO, AI, Intelligence, Wipro, Samsung, Silicon, Glass, AT&T, Red Hat, Ultra, CPU

At MWC 2024, Intel announced new platforms, solutions and services spanning network and edge AI, Intel® Core™ Ultra processors and the AI PC, and more.

Key Points: 
  • At MWC 2024, Intel announced new platforms, solutions and services spanning network and edge AI, Intel® Core™ Ultra processors and the AI PC, and more.
  • Across today’s announcements, Intel is focused on empowering the industry to further modernize and monetize 5G, edge and enterprise infrastructures and investments, and to take advantage of bringing AI Everywhere.
  • Intel is working with AT&T, Deutsche Telekom, SK Telecom and Vodafone to showcase the benefits AI can bring to the RAN.
  • On day two of MWC 2024, Intel and Microsoft will host an AI PC industry reception at the Intel booth.

NTT and Red Hat Fuel AI Analysis at the Edge with IOWN Technologies

Retrieved on: 
Monday, February 26, 2024
Technology, Professional Services, Other Technology, Telecommunications, Apps, Applications, Data Analytics, Software, Artificial Intelligence, Networks, Internet, Mobile, Wireless, Fujitsu, Nippon Telegraph and Telephone, NTT, POC, Intelligence, Library, Triage, Mobile World Congress, CPU, CDI, DCI, Communication, Wind, RDMA, Wireless network, Memory, GPU, Organization, Data analysis, Acceleration, Remote direct memory access, Red, Graphics processing unit, Red Hat, APN, Primergy, PRIMERGY, OpenShift, NVIDIA, Medical device

With edge computing capabilities emerging in more remote locations, AI analysis can be placed closer to the sensors, reducing latency and increasing bandwidth.

Key Points: 
  • With edge computing capabilities emerging in more remote locations, AI analysis can be placed closer to the sensors, reducing latency and increasing bandwidth.
  • This solution consists of the IOWN All-Photonics Network (APN) and data pipeline acceleration technologies in IOWN Data-Centric Infrastructure (DCI).
  • NTT and Red Hat have successfully demonstrated that this solution can effectively reduce power consumption while maintaining lower latency for real-time AI analysis at the edge.
  • With Red Hat OpenShift, we can help NTT provide large-scale AI data analysis in real time and without limitations.”
    “The NTT Group, in great collaboration with partners, is accelerating the development of IOWN to achieve a sustainable society.

MaxLinear Launches Single Chip for 5G Open RAN Radio Units

Retrieved on: 
Thursday, February 22, 2024
Data Management, Semiconductor, Technology, Mobile, Wireless, 5G, Networks, Hardware, DFE, Intermodulation, Algorithm, Federal Communications Commission, Architecture, Macro, FCC, DSS, SRAM, MXL, 33-centimeter band, Silicon, NB, Original equipment manufacturer, RAN, Picocell, Digital, MIMO, PIM, DDC, CFR, Radio, Ball grid array, DUC, Multimedia, Mobile World Congress, 3GPP, A53, DDR, System, DRAM, SOC, Congress, Gallium nitride, Heart, RF, SCS, DPD, RX, Software, PIMC, CPU, Video game

MaxLinear, Inc. (Nasdaq: MXL), a leader in wireless infrastructure silicon solutions, today announced it has launched the MXL17xxx family of devices (“Sierra”), a highly integrated SoC optimized for 4G/5G Open Radio Access Network (RAN) radio units (RU).

Key Points: 
  • MaxLinear, Inc. (Nasdaq: MXL), a leader in wireless infrastructure silicon solutions, today announced it has launched the MXL17xxx family of devices (“Sierra”), a highly integrated SoC optimized for 4G/5G Open Radio Access Network (RAN) radio units (RU).
  • Designers can rapidly build new macro and picocell O-RUs using just a single Sierra device by adding an appropriate RF front end.
  • “Open RAN momentum continues to build and is set to account for 20 percent to 30 percent of worldwide RAN revenues by 2028,” said Stefan Pongratz, Vice President and Analyst at the Dell’Oro Group.
  • MaxLinear will be conducting briefings on MaxLinear’s radio solutions at Mobile World Congress – Hall 2, meeting rooms 2A54MR and 2A63MR – from February 26 through February 29, 2024.

Renesas Develops New AI Accelerator for Lightweight AI Models and Embedded Processor Technology to Enable Real-Time Processing

Retrieved on: 
Thursday, February 22, 2024
Robotics, Semiconductor, IOT (Internet of Things), Technology, Artificial Intelligence, Internet, Hardware, International, Architecture, Multimedia, ISSCC, AI, IPS, Renesas Electronics, SLAM, DRP, Conference, CNN, Automation, Environment, Central processing unit, Software, CPU, Video game

The newly developed technologies are as follows: (1) A dynamically reconfigurable processor (DRP)-based AI accelerator that efficiently processes lightweight AI models and (2) Heterogeneous architecture technology that enables real-time processing by cooperatively operating processor IPs, such as the CPU.

Key Points: 
  • The newly developed technologies are as follows: (1) A dynamically reconfigurable processor (DRP)-based AI accelerator that efficiently processes lightweight AI models and (2) Heterogeneous architecture technology that enables real-time processing by cooperatively operating processor IPs, such as the CPU.
  • View the full release here: https://www.businesswire.com/news/home/20240222749810/en/
    Dynamically Reconfigurable Processor AI technology from Renesas enables higher speeds and lower power consumption in microprocessor units (MPUs) that realize advanced vision AI.
  • The technologies developed by Renesas are as follows:
    As a typical technology for improving AI processing efficiency, pruning is available to omit calculations that do not significantly affect recognition accuracy.
  • That is why Renesas introduced a dynamically reconfigurable processor (DRP), which handles complex processing, in addition to the CPU and AI accelerator (DRP-AI).

Wind River Studio Enhancements Advance Automation at Scale for 5G Services for Intelligent Edge Clouds

Retrieved on: 
Thursday, February 22, 2024
Mobile, Wireless, Technology, Security, 5G, Carriers and Services, Telecommunications, Software, Networks, Internet, Data Management, Cloud, Growth, MWC, CPU, CNF, RAN, Environment, Automation, Mobile World Congress, Renewable energy

Wind River® , a global leader in delivering software for mission-critical intelligent systems, today announced enhancements for Wind River Studio designed to improve automation at scale, helping communication service providers (CSPs) support their growth of 5G-enabled services at the edge.

Key Points: 
  • Wind River® , a global leader in delivering software for mission-critical intelligent systems, today announced enhancements for Wind River Studio designed to improve automation at scale, helping communication service providers (CSPs) support their growth of 5G-enabled services at the edge.
  • Automation at scale is becoming a necessary reality for operators to meet these requirements effectively,” said Paul Miller, chief technology officer, Wind River.
  • The latest Wind River Studio capabilities improve automation for mass deployments for day 0 to day 2 deployment and operations at scale.
  • To view Wind River technologies firsthand at MWC Barcelona 2024, February 26–29, visit the Wind River booth in Hall 2, 2F25.

At APEC 2024, Alpha and Omega Semiconductor to Display and Demo its Industry-Leading Power Management Solutions

Retrieved on: 
Thursday, February 22, 2024
Batteries, Hardware, EV, Electric Vehicles, Automotive, Consumer Electronics, Technology, Semiconductor, Other Technology, MOSFET, DC-DC, Intel, Silicon carbide, Mega, NVIDIA, Socs, AEC, APEC, Swap (finance), AOS, ICS, CPU, PC, Conference, BMS, Solar inverter, Universal, AMD, EMI, BLDC, RC, Kyōto Station, Electronics

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules will showcase its complete line of advanced power management solutions at the Applied Power Electronics Conference (APEC).

Key Points: 
  • Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules will showcase its complete line of advanced power management solutions at the Applied Power Electronics Conference (APEC).
  • The new products are designed to meet key power management challenges in several key application areas and markets AOS focuses on.
  • When paired with AOS’ industry-leading power stages, AOS controllers offer a complete Vcore solution to power next-generation chipset-based SoCs.
  • Motor Drives: AOS introduces a new range of 60V and 100V drivers for power tools, outdoor garden equipment, and e-mobility applications.