CPU

Shipa Launches Shipa Insights – Delivering Immediate Security, Compliance, and Engineering Efficiency Reports Across Both New and Existing Kubernetes Workloads

Retrieved on: 
Tuesday, May 31, 2022
Cloud, Risk, Knowledge, API, Engineering, CPU, History, DevOps, Policy, Metadata, Goal, Organization, Efficiency, Compliance, GLOBE, Risk management, Telecommunication, Kubernetes

Part of the Shipa Cloud platform, the Shipa Insights module provides reporting and metrics that enable DevOps and platform engineering teams to enhance Kubernetes security and compliance policy enforcement across all workloads, and also accelerate their engineering efficiency with actionable data.

Key Points: 
  • Part of the Shipa Cloud platform, the Shipa Insights module provides reporting and metrics that enable DevOps and platform engineering teams to enhance Kubernetes security and compliance policy enforcement across all workloads, and also accelerate their engineering efficiency with actionable data.
  • Shipa Insights solves this challenge by empowering teams to easily understand any workloads policy posture, support, history, metadata, and integration into incident management.
  • With Shipa Insights, teams can quickly scan workloads to make sure they comply with all current policies, for security scanning and beyond.
  • Shipa Insights also solves the growing problem of existing Kubernetes workloads, where the original engineers are no longer available to provide expertise or a path to insights.

Top Global Systems Makers Accelerate Adoption of NVIDIA Grace and Grace Hopper

Retrieved on: 
Monday, May 30, 2022
GPU, HPC, CPU, AI, Swiss National Supercomputing Centre, Computation, Grace Hopper, Memory, Grace, Graphics processing unit, NASDAQ, Simulation, HPE, NVIDIA, Transport, OEM, ISC, Artificial intelligence, Research, Advanced Simulation and Computing Program, Ecosystem, LANL, Los Alamos National Laboratory, Central processing unit, Growth, GLOBE, Video game console, Cryptocurrency

Across climate science, energy research, space exploration, digital biology, quantum computing and more, the NVIDIA Grace CPU Superchip and Grace Hopper Superchip form the foundation of the worlds most advanced platform for HPC and AI.

Key Points: 
  • Across climate science, energy research, space exploration, digital biology, quantum computing and more, the NVIDIA Grace CPU Superchip and Grace Hopper Superchip form the foundation of the worlds most advanced platform for HPC and AI.
  • The NVIDIA Grace CPU Superchip features two Arm-based CPUs, connected coherently through the high-bandwidth, low-latency, low-power NVIDIA NVLink-C2C interconnect.
  • The Grace Hopper Superchip pairs an NVIDIA Hopper GPU with an NVIDIA Grace CPU in an integrated module connected with NVLink-C2C to address HPC and giant-scale AI applications.
  • The NVIDIA Grace-powered systems will run the portfolio of NVIDIA AI and NVIDIA HPC software for full-stack, integrated computing.

Alces Flight Acquires Concertim

Retrieved on: 
Monday, May 30, 2022
Research, Efficiency, HPC, Solution, CPU, Health, Carbon, Climate, Moose, Acquisition, GLOBE, Video game console

BICESTER, England, May 30, 2022 (GLOBE NEWSWIRE) -- Alces Flight, leader in building and transforming HPC clusters into cloud and cloud-enabled environments, today announced the acquisition of Concertim, a data-centre management appliance designed to gain deep insight into the operational and energy efficiency of HPC hardware.

Key Points: 
  • BICESTER, England, May 30, 2022 (GLOBE NEWSWIRE) -- Alces Flight, leader in building and transforming HPC clusters into cloud and cloud-enabled environments, today announced the acquisition of Concertim, a data-centre management appliance designed to gain deep insight into the operational and energy efficiency of HPC hardware.
  • With the drive to improve on the overall green performance of HPC systems globally and the continued diversification of HPC hardware and solutions, the addition of Concertim will allow Alces Flight clients and partners the ability to build more durable solutions with a reduced carbon footprint.
  • The acquisition of Concertim completed in May 2022 with a demonstration of new capabilities at the ISC'22 conference in Hamburg, Germany.
  • For more details, please contact Cristin Merritt at [email protected] or visit the Alces Flight website: www.alces-flight.com .

Global Edge AI Processor Market Predicted to Hit $9,566.30 Million, Growing at 16.0% CAGR from 2022 to 2030 [225-Pages] | Research Dive

Retrieved on: 
Monday, May 30, 2022
Automotive industry, AR, GPU, CPU, Center for Urban and Regional Analysis, NEW, Research, IOT, Application-specific integrated circuit, Electronics, SCSI Peripheral Device Type, Automation, COVID-19, Robotics, Transport, Industry, Graphics processing unit, Hospital, Edge, Consumer electronics, Central, Maintenance, Adoption, ASIC, CAGR, Growth, Artificial intelligence, Copper, Renewable energy, Milk, Medical device, Health care

NEW YORK, May 30, 2022 /PRNewswire/ -- Research Dive has added a new report to its offerings titled, "Edge AI Processor Market by Type (Central Processing Unit (CPU), Graphics Processing Unit (GPU), and Application Specific Integrated Circuit (ASIC)), Device Type (Consumer Devices and Enterprise Devices), End-use (Automotive & Transportation, Healthcare, Consumer Electronics, Retail & Ecommerce, Manufacturing, and Others), and Regional Analysis (North America, Europe, Asia-Pacific, and LAMEA): Global Opportunity Analysis and Industry Forecast, 2022–2030".

Key Points: 
  • Rising demand for edge AI processors in electronics products is fueling the global edge AI processor market growth.
  • The global edge AI processor market is expected to garner $9,566.30 million by 2030, growing at a CAGR of 16.0% from 2022 to 2030.
  • Key Segment Findings of the Edge AI Processor Market:
    The market is segmented based ontype, device type, end-use, and region.
  • Impact of the COVID-19 Pandemic on the Edge AI Processor Market:
    The COVID-19 pandemic has made a positive impact on the growth of the global edge AI processor market in 2020.

Global Edge AI Processor Market Predicted to Hit $9,566.30 Million, Growing at 16.0% CAGR from 2022 to 2030 [225-Pages] | Research Dive

Retrieved on: 
Monday, May 30, 2022
Automotive industry, AR, GPU, CPU, Center for Urban and Regional Analysis, NEW, Research, IOT, Application-specific integrated circuit, Electronics, SCSI Peripheral Device Type, Automation, COVID-19, Robotics, Transport, Industry, Graphics processing unit, Hospital, Edge, Consumer electronics, Central, Maintenance, Adoption, ASIC, CAGR, Growth, Artificial intelligence, Copper, Renewable energy, Milk, Medical device, Health care

NEW YORK, May 30, 2022 /PRNewswire/ -- Research Dive has added a new report to its offerings titled, "Edge AI Processor Market by Type (Central Processing Unit (CPU), Graphics Processing Unit (GPU), and Application Specific Integrated Circuit (ASIC)), Device Type (Consumer Devices and Enterprise Devices), End-use (Automotive & Transportation, Healthcare, Consumer Electronics, Retail & Ecommerce, Manufacturing, and Others), and Regional Analysis (North America, Europe, Asia-Pacific, and LAMEA): Global Opportunity Analysis and Industry Forecast, 2022–2030".

Key Points: 
  • Rising demand for edge AI processors in electronics products is fueling the global edge AI processor market growth.
  • The global edge AI processor market is expected to garner $9,566.30 million by 2030, growing at a CAGR of 16.0% from 2022 to 2030.
  • Key Segment Findings of the Edge AI Processor Market:
    The market is segmented based ontype, device type, end-use, and region.
  • Impact of the COVID-19 Pandemic on the Edge AI Processor Market:
    The COVID-19 pandemic has made a positive impact on the growth of the global edge AI processor market in 2020.

Hewlett Packard Enterprise and SiPearl Partner to Develop HPC Solutions with European Processors and Accelerate Europe’s Adoption of Exascale Supercomputers

Retrieved on: 
Monday, May 30, 2022
Semiconductor, Data Management, Consumer Electronics, Technology, Software, Hardware, Rhea, Cloud, HPC, Engineering, CPU, Medicine, Computing, AI, European High-Performance Computing Joint Undertaking, Center of excellence, Science, Investment, Solution, EPI, HPE, Storage, Â, Artificial intelligence, Research, Efficiency, Industry, Partnership, European Processor Initiative, Biotechnology, Technology, Union, Organization, Name, Ecosystem, Hewlett Packard Enterprise, Nanotechnology, Adoption, COE, Drug discovery, NYSE, Microprocessor, CEO, Video game console, Medical device, EU, European, Software

Hewlett Packard Enterprise (NYSE: HPE) and SiPearl , the company designing a high-performance and low-power microprocessor for European exascale supercomputers, today announced a strategic partnership to jointly develop HPC solutions.

Key Points: 
  • Hewlett Packard Enterprise (NYSE: HPE) and SiPearl , the company designing a high-performance and low-power microprocessor for European exascale supercomputers, today announced a strategic partnership to jointly develop HPC solutions.
  • The partnership, which expands heterogenous computing options for supercomputing and leverages European architectures, will support and accelerate adoption of exascale systems in Europe.
  • The exascale era will enable us to achieve new breakthroughs in science and engineering by taking advantage of performance and the integration of new processors.
  • By combining SiPearls Rhea with HPEs supercomputing solutions, HPE and SiPearl will deliver a broad set of advanced HPC and AI technologies, leveraging the upcoming European processor.

TECNO's Electrifyingly Stylish POVA 3: A Stunning Player That Delivers the Ultimate Gaming Experience for Unlimited Fun

Retrieved on: 
Friday, May 27, 2022
G88, Smartphone, GPU, Software, Human voice, CPU, Align Technology, Social media, NEW, AI, Multimedia, Stop at Nothing, Language, View, POVA, Intelligence, Color, Lightning, RGB, Culture, Nothing, LED, Life, 3, FHD, Heart, Transsion, Tablet, RAM, HiOS, Mark (given name), Electric blue, Video game console, Video game, Electric battery, Mobile phone

NEW YORK, May 26, 2022 /PRNewswire/ -- TECNO, the innovative global smartphone brand, released the POVA 3 today, representing TECNO's latest phone in its popular POVA series. Bringing together all of the series' innovative features, groundbreaking hardware and software enhancements, a stylish design language featuring electrifying color options with a unique power light, and massive 7000mAh battery, the POVA 3 delivers the ultimate gaming experience right to your fingertips. 

Key Points: 
  • The stylish new addition to the existing POVA series will feature a combination of hardware and software enhancements aimed at redefining the mobile gaming experience.
  • NEW YORK, May 26, 2022 /PRNewswire/ --TECNO, the innovative global smartphone brand, released the POVA 3 today, representing TECNO's latestphone in its popular POVA series.
  • TECNO draws inspiration from the latest trends in design and culture for the design language of the POVA 3.
  • The POVA 3 is embellished with power light - a luminous LED-changing bar that cuts through the center of the phone.

New Cincoze DV-1000 Industrial Embedded Computer Brings Power to Edge Computing

Retrieved on: 
Thursday, May 26, 2022
Internet, Hardware, Electronic Design Automation, Data Management, Technology, Other Manufacturing, Semiconductor, Rail, Engineering, Audio, Video, Transport, Other Technology, Manufacturing, Digital, GPU, ATX, CPU, Coffee, Computer, Align Technology, Gigabit Ethernet, Certification, DDR4, Multimedia, DisplayPort, SSD, CMI, VGA, HDMI, EN, DV, IGN, ATA Airlines, Robotics, COM, NVM Express, SATA, CFM, SIM, Temperature, Maintenance, LAN, MEC, Telescopic sight, Video game console, A4

Today, rugged embedded computer brand Cincoze added the high-performance and essential DV-1000 rugged embedded computer series to its DIAMOND product line.

Key Points: 
  • Today, rugged embedded computer brand Cincoze added the high-performance and essential DV-1000 rugged embedded computer series to its DIAMOND product line.
  • With Cincozes unwavering focus on smart manufacturing, the new DV series rounds out the Cincoze DIAMOND product line, providing industrial customers more performance, scalability, size, power, and certification options.
  • Cincoze is a rugged embedded computer brand providing diversified embedded computer solutions tailored to market needs.
  • Its product lines include rugged embedded computers, industrial panel PCs, industrial displays, and embedded GPU computers.

Sylabs Readies for Native OCI Compatibility with Release of SingularityCE 3.10

Retrieved on: 
Wednesday, May 25, 2022
HPC, CPU, OCI, Overalls, Environment, Memory, Docker, IO, CLI, SIF, Open source, Linux, RENO, RAM, Software engineer, Documentation, Video game console, Sales, Computer data storage, Singularity

RENO, Nev., May 25, 2022 /PRNewswire-PRWeb/ -- Sylabs, the global leader in providing tools and services for performance-intensive container technology, today announced that it has released SingularityCE 3.10. The newest update makes significant steps towards full OCI compatibility, giving Singularity the ability to natively run OCI-based container workflows. The release also adds functionality for resource limits using cgroups to give developers more control over the environments in which Singularity is being run.

Key Points: 
  • The newest update makes significant steps towards full OCI compatibility, giving Singularity the ability to natively run OCI-based container workflows.
  • The newest update makes significant steps towards full OCI compatibility, giving Singularity the ability to natively run OCI-based container workflows.
  • A new `--no-eval` flag makes SingularityCE treat environment variables and command line arguments the same way as Docker and other OCI runtimes, improving compatibility.
  • This is the first step in progressively introducing greater OCI compatibility to SingularityCE under our roadmap to 4.0.

German Innovation Award 2022 Honors Cinemo as a Winner

Retrieved on: 
Wednesday, May 25, 2022
Data Management, Automotive, Other Automotive, Technology, Mobile, Wireless, Software, Internet, Index, Solution, CPU, Reye syndrome, Marketing, German Design Council, Communication, Video game console

Cinemo, a global leader in high performance and automotive grade multimedia playback, streaming, media management, connectivity, and cloud middleware, has announced that its Cinemo Play Anywhere solution has been elected a winner for the esteemed German Innovation Award, by the German Design Council.

Key Points: 
  • Cinemo, a global leader in high performance and automotive grade multimedia playback, streaming, media management, connectivity, and cloud middleware, has announced that its Cinemo Play Anywhere solution has been elected a winner for the esteemed German Innovation Award, by the German Design Council.
  • The German Innovation Awards honor innovative achievements that break new ground through their added value.
  • The initiator and organizer of the German Innovation Award is the German Design Council.
  • "It is a great honor for Cinemo to once again be awarded by the German Design Council, said Martina Oerther, Marketing Director at Cinemo.