CPU

AIMobile Debuts an Innovative Edge AI Box powered by Qualcomm

Retrieved on: 
Tuesday, April 9, 2024
Qualcomm, Automation, Internet of things, Transport, NPU, Hertz, QC01, SOM, CPU, Video game

Powered by the Qualcomm® QCS6490 processor, AIM-Edge QC01 is equipped with multi-OS support and USB/LAN ports for camera connection.

Key Points: 
  • Powered by the Qualcomm® QCS6490 processor, AIM-Edge QC01 is equipped with multi-OS support and USB/LAN ports for camera connection.
  • Drawing on nearly a decade of expertise in Edge AI, AIMobile also adds market-proven AI models on top to shorten time to market for partners.
  • The AI Edge Box is demonstrated at Qualcomm Technologies' booth (#161, Hall 5, NurnbergMesse) at Embedded World.
  • said Timothy Chang, President of AIMobile, "We are really honored to work with Qualcomm Technologies again in the ever-growing edge AI field.

Silicon Labs xG26 Sets New Standard in Multiprotocol Wireless Device Performance

Retrieved on: 
Tuesday, April 9, 2024
Silicon Labs, Attention, SOC, Algorithm, Bluetooth Low Energy, GPIO, Bluetooth mesh networking, Acceleration, Intelligence, Internet of things, Network layer, Wireless, Internet, Sleep, ARM, Running, RAM, Silicon, Home, ARM architecture family, Radio, MG26, CCTV, CPU, Machine learning, Family, Matter, Code, Bluetooth, Video game

AUSTIN, Texas, April 9, 2024 /PRNewswire/ -- Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date. The new family consists of the multiprotocol MG26 SoC, the Bluetooth LE BG26 SoC, and the PG26 MCU. All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter, with double the Flash and RAM of other Silicon Labs multiprotocol devices.

Key Points: 
  • All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter , with double the Flash and RAM of other Silicon Labs multiprotocol devices.
  • That's Matter's interoperability and security promise, which is why Silicon Labs designed the MG26 to be the most advanced SoC for the Matter standard.
  • Pin compatibility between select xG26 and xG24 devices and shared hardware and software development tools like Silicon Labs Simplicity Studios allows for easy development and seamless migration from other Silicon Labs Series 2 devices.
  • Learn more about how to begin developing cutting-edge IoT devices using Silicon Labs, be sure to :

ADLINK releases Intel® Amston-Lake-powered modules with up to 8 cores at 12W TDP suiting ruggedized edge solutions

Retrieved on: 
Tuesday, April 9, 2024
Temperature, COM Express, TSN, Intel, Communication, Time-Sensitive Networking, MIPI, Internet of things, LAN, LPDDR5, Transport, AI, PCI Express, Intel Atom, TCC, Robotics, USB, SMARC, Gracemont, Oklahoma, USB 3.2, HMI, TDP, Type 6, CPU, Computer data storage

SAN JOSE, Calif., April 8, 2024 /PRNewswire-PRWeb/ -- Summary:

Key Points: 
  • "Built for highly responsive on-device AI execution and at the same time can withstand ruggedized use scenarios, these new ADLINK COMs allow developers to realize various IoT edge innovations moving forward."
  • Utilizing Intel's Gracemont architecture, with broadened cache and memory bandwidth, responsive coding footprint, combined with soldered-down memory and extreme temperature option, the modules deliver superior performance with great efficiency for wide-ranging ruggedized IoT solutions at the edge.
  • For more information about ADLINK COMs, visit the product pages for: cExpress-ASL (COM Express Type 6) and LEC-ASL (SMARC) modules.
  • Stay tuned, as ADLINK is working to offer another COM Express Type 10 module based on Intel Atom X7000RE & X7000C series processors (Amston Lake).

DFI Elevates Electric Vehicle Charging Experience at Embedded World 2024

Retrieved on: 
Monday, April 8, 2024
DFI, Intel, XMX, GM, Intel Arc, FHD, Embedded, EDGE Group, Kyōto Station, Transport, VM, City, Electronics, System, BenQ, CMS, AIOT, CPU, UI, Video game

TAIPEI, April 8, 2024 /PRNewswire/ -- At Embedded World 2024, DFI, the world's leading brand in embedded motherboards and industrial computers, unveiled its groundbreaking EV Charger application, responding to the surge in electric vehicle (EV) usage and the corresponding need for an extensive EV charging infrastructure. Powered by the 13th Gen Intel Core i9-13900TE processor and Intel Arc GPU, DFI's embedded solution enhances AI capabilities at edge in the expanding EV market.

Key Points: 
  • TAIPEI, April 8, 2024 /PRNewswire/ -- At Embedded World 2024 , DFI , the world's leading brand in embedded motherboards and industrial computers, unveiled its groundbreaking EV Charger application, responding to the surge in electric vehicle (EV) usage and the corresponding need for an extensive EV charging infrastructure.
  • Powered by the 13th Gen Intel Core i9-13900TE processor and Intel Arc GPU, DFI's embedded solution enhances AI capabilities at edge in the expanding EV market.
  • "DFI leverages virtual machine (VM) virtualization technology to introduce a robust Workload Consolidation platform that can run multiple operating systems simultaneously with just one Intel CPU for applications such as EV charging."
  • DFI President Alexander Su said, "We're proud to offer solutions enhancing user experiences and promoting sustainability in the AIOT era."

Seven Years of Uninterrupted Growth: Andes Technology Achieves Milestone Annual Revenue Exceeding NT$1 Billion

Retrieved on: 
Thursday, March 21, 2024
Socs, SOC, Ecosystem, Growth, Artificial intelligence of things, Internet of things, HPC, AI, IPO, Field-programmable gate array, RVI, D23, Safety, OOO, Andes Technology, ISO, CPU, Video game

Andes has invested capital and R&D manpower to accelerate the launch of high-end products to ensure long-term competitiveness and maintain market leadership.

Key Points: 
  • Andes has invested capital and R&D manpower to accelerate the launch of high-end products to ensure long-term competitiveness and maintain market leadership.
  • In 2023, even when the whole industry was still under inventory pressure, Andes surpassed a significant total shipment milestone of 14 billion Andes-Embedded™ SoCs.
  • In 2023, the diverse product portfolio offered by Andes has resonated exceptionally well with the market and enabled its sustained growth.
  • More recently, Andes ventured into the application processor market with the launch of its cutting-edge out-of-order (OOO) processor AX65.

ECARX Unveils Multiple Automotive Intelligence Solutions on Tech Day

Retrieved on: 
Wednesday, March 20, 2024
Photon, Cloud, Microsoft, Android Automotive, Geely, Volvo, TFLOPS, SOC, HPA, GAS, Tesla Autopilot, Original equipment manufacturer, Atlas, Pike, Intelligence, RPA, Atlas Mountains, Partnership, Name, ISP, Hongqi, Image, Navigation, ADAS, Electronics, Research, Unreal Engine, FAW Group, ECX, VPA, Rocky, DMIPS, NOA, Ecosystem, Lidar, APA, Lynk & Co, CPU, Tech, Video game

SHANGHAI, China, March 20, 2024 (GLOBE NEWSWIRE) -- ECARX Holdings Inc. (Nasdaq: ECX) (“ECARX” or the “Company”), a global mobility technology provider, today held its second Tech Day at the Hangzhou E-Sports Center, where it unveiled several ground-breaking automotive intelligence solutions and ecosystem advancements.

Key Points: 
  • SHANGHAI, China, March 20, 2024 (GLOBE NEWSWIRE) -- ECARX Holdings Inc. (Nasdaq: ECX) (“ECARX” or the “Company”), a global mobility technology provider, today held its second Tech Day at the Hangzhou E-Sports Center, where it unveiled several ground-breaking automotive intelligence solutions and ecosystem advancements.
  • The Atlas and Pikes computing platforms are powered by the fourth-generation Qualcomm Snapdragon® System-on-a-Chip (SoC), namely SA8255P and SA8295P Snapdragon®, respectively.
  • Integrating both Flyme Auto and Google Automotive Services (GAS), each of the Atlas and Pikes computing platforms will allow ECARX to service automotive OEMs worldwide within a single platform.
  • "ECARX remains at the forefront of technological advancements, leveraging ground-breaking, cross-border technology integration and innovation.

NVIDIA Announces Project GR00T Foundation Model for Humanoid Robots and Major Isaac Robotics Platform Update

Retrieved on: 
Monday, March 18, 2024
ArcBest, GTC, BYD, SOC, GPU, Agility, Learning, Environment, Library, SAN, Perception, KION Group, History, Universal Robots, Robotics, Yaskawa Electric Corporation, Imagination, Ecosystem, Safety, Machine learning, Generalist, Collection, NVIDIA, CPU, Video game

SAN JOSE, Calif., March 18, 2024 (GLOBE NEWSWIRE) -- GTC -- NVIDIA today announced Project GR00T, a general-purpose foundation model for humanoid robots, designed to further its work driving breakthroughs in robotics and embodied AI.

Key Points: 
  • SAN JOSE, Calif., March 18, 2024 (GLOBE NEWSWIRE) -- GTC -- NVIDIA today announced Project GR00T, a general-purpose foundation model for humanoid robots, designed to further its work driving breakthroughs in robotics and embodied AI.
  • “Building foundation models for general humanoid robots is one of the most exciting problems to solve in AI today,” said Jensen Huang, founder and CEO of NVIDIA.
  • NVIDIA also announced Isaac Manipulator and Isaac Perceptor — a collection of robotics pretrained models, libraries and reference hardware.
  • Among early ecosystem partners are Yaskawa, Universal Robots, a Teradyne company, PickNik Robotics, Solomon, READY Robotics and Franka Robotics.

NVIDIA Healthcare Launches Generative AI Microservices to Advance Drug Discovery, MedTech and Digital Health

Retrieved on: 
Monday, March 18, 2024
Nexus, Cloud, Hewlett Packard Enterprise, Azure, GTC, Google Cloud, Health, Metropolis, Patient, History, Orion, LLM, Therapy, San Jose Convention Center, Microsoft, Synthetic media, Vanilla, SAN, Oracle Cloud, 3D, AUC, Protein folding, AWS, Chemistry, Hippocrates, Flywheel, Amgen, Data management, Drug discovery, Acceleration, Hospital, Cadence, AI, Medtech, Dell Technologies, Amazon Web Services, API, CPU, VISTA, Supermicro, Biology, NIM, Universal, Collection, NVIDIA, Generative, Medical device

The microservices, 25 of which launched today, can accelerate transformation for healthcare companies as generative AI introduces numerous opportunities for pharmaceutical companies, doctors and hospitals.

Key Points: 
  • The microservices, 25 of which launched today, can accelerate transformation for healthcare companies as generative AI introduces numerous opportunities for pharmaceutical companies, doctors and hospitals.
  • These include screening for trillions of drug compounds to advance medicine, gathering better patient data to aid early disease detection and implementing smarter digital assistants.
  • “By helping healthcare companies easily build and manage AI solutions, we’re enabling them to harness the full power and potential of generative AI.”
    The new suite of healthcare microservices includes NVIDIA NIM , which provides optimized inference for a growing collection of models across imaging, medtech, drug discovery and digital health.
  • Hippocratic AI is developing task-specific Generative AI Healthcare Agents, powered by the company’s safety-focused LLM for healthcare, connected to NVIDIA Avatar Cloud Engine microservices and will utilize NVIDIA NIM for low-latency inferencing and speech recognition.

TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production

Retrieved on: 
Monday, March 18, 2024
Physics, GTC, Algorithm, GPU, H100, Partnership, SAN, Light, Software, Proteus, Workflow, Graphics processing unit, Engineering, OPC, Workload, NVIDIA, Central processing unit, CPU, TSMC, Silicon, Video game

“Computational lithography is a cornerstone of chip manufacturing,” said Jensen Huang, founder and CEO of NVIDIA.

Key Points: 
  • “Computational lithography is a cornerstone of chip manufacturing,” said Jensen Huang, founder and CEO of NVIDIA.
  • Computational lithography is the most compute-intensive workload in the semiconductor manufacturing process, consuming tens of billions of hours per year on CPUs.
  • “We are moving NVIDIA cuLitho into production at TSMC, leveraging this computational lithography technology to drive a critical component of semiconductor scaling.”
    Since its introduction last year, cuLitho has enabled TSMC to open new opportunities for innovative patterning technologies.
  • Synopsys’ Proteus ™ optical proximity correction software running on the NVIDIA cuLitho software library significantly speeds computational workloads compared to current CPU-based methods.

Pliops Unlocks Limitless Potential of AI at NVIDIA GTC 2024

Retrieved on: 
Monday, March 18, 2024
Honey, HBM, GTC, GPU, Cooper pair, Memory, Acceleration, RAG, SAN, NVM Express, DBS, AI, Honey badger, Graphics processing unit, Investment, XDP, Solid-state drive, Dell, NVIDIA, Central processing unit, Gen, CPU

Pliops , a leading provider of data processors for cloud and enterprise data centers, will be on hand at NVIDIA GTC this week to tackle these challenges head on.

Key Points: 
  • Pliops , a leading provider of data processors for cloud and enterprise data centers, will be on hand at NVIDIA GTC this week to tackle these challenges head on.
  • Pliops XDP-AccelKV universal data acceleration engine significantly minimizes the scalability challenges of AI/Gen AI applications.
  • The memory capacity and bandwidth limitations of GPUs to load AI/Gen AI models prevent them from fully utilizing their computational power.
  • It extends HBM memory with fast storage to enable terabytes-scale AI applications to run on a single GPU.