Onto Innovation Launches U.S. Applications Center of Excellence Focused on Panel-Level Packaging
Onto Innovation Inc. (NYSE: ONTO) today announced the launch of an Applications Center of Excellence, a combined tool demonstrator, photo resist qualification, process integration and research and development (R&D) facility focused on panel-level packaging (PLP), a key facilitator of the emerging chiplet market.
- Onto Innovation Inc. (NYSE: ONTO) today announced the launch of an Applications Center of Excellence, a combined tool demonstrator, photo resist qualification, process integration and research and development (R&D) facility focused on panel-level packaging (PLP), a key facilitator of the emerging chiplet market.
- The chiplet package market is expected to grow at an annual average rate of 103% over the next three years, according to TechSearch International.
- With several significant industry inflection points on the horizon, such as glass substrate and increasingly tighter line/space requirements, the Applications Center of Excellence is ideally suited for advanced packaging process development for PLP, advanced IC substrates (AICS) and wafer-level packaging.
- Interested customers and potential partner organizations should visit Onto Innovation during SEMICON® West at booth 629 or reach out to their local sales and support team to learn how to initiate collaboration at the Onto Applications Center of Excellence.