MEMS

Nokia and Celesta Capital Announce Major Strategic Partnership for Acceleration of Deep Technologies

Retrieved on: 
Monday, December 11, 2023
Research, Bell Labs, Information, SAN, Internet of things, Cubit, IP, Partnership, Investment, History, Laser, Partner, Artificial intelligence, City, Quantum computing, Semiconductor, Advanced Communications Riser, Kool-Aid, Deep learning, Communication, AI, Information theory, Robotics, MEMS, Consumer electronics, Mobile phone, Silicon, Celesta, Nokia

SAN FRANCISCO, Dec. 11, 2023 /PRNewswire/ -- Nokia and Celesta Capital today announced a long-term strategic partnership to accelerate the commercialization of deep technologies invented by Nokia Bell Labs, including advanced communications, AI and deep learning, next-generation semiconductor fabrication, sensors, and quantum computing. Celesta Capital will help cultivate and invest in key technologies incubated and developed within Nokia Bell Labs, to form commercially viable, independent venture-backed companies. The new partnership unites Nokia Bell Labs' robust IP portfolio and research prowess with Celesta Capital's unique expertise as a global deep tech investor and business builder.   

Key Points: 
  • SAN FRANCISCO, Dec. 11, 2023 /PRNewswire/ -- Nokia and Celesta Capital today announced a long-term strategic partnership to accelerate the commercialization of deep technologies invented by Nokia Bell Labs, including advanced communications, AI and deep learning, next-generation semiconductor fabrication, sensors, and quantum computing.
  • Celesta Capital will help cultivate and invest in key technologies incubated and developed within Nokia Bell Labs, to form commercially viable, independent venture-backed companies.
  • The new partnership unites Nokia Bell Labs' robust IP portfolio and research prowess with Celesta Capital's unique expertise as a global deep tech investor and business builder.
  • The core focus of the partnership will work to incorporate technology developed by Nokia Bell Labs into newly created companies.

Radio Frequency (RF) Signal Generator Market size to grow by USD 677.64 million from 2023 to 2028, Driven by Increasing partnerships between companies and value chain members - Technavio

Retrieved on: 
Friday, December 8, 2023
Signal generator, MEMS, RF, Telecommunications, Fortive, DS, Electronics, Radio frequency, Radio, ASP, ISO, USD, Teledyne Technologies, Analysis, RFID, Geography, National Instruments, Growth, ISO 9001:2015, Keysight, Texas Instruments, Amateur radio frequency allocations, Certification, LTE, Mobile phone, Retail, Cable television

The potential growth difference for the radio frequency (RF) signal generator market between 2023 and 2028 is USD 677.64 million.

Key Points: 
  • The potential growth difference for the radio frequency (RF) signal generator market between 2023 and 2028 is USD 677.64 million.
  • The increasing partnerships between players and value chain members is the key factor driving market growth.
  • The radio frequency identification (RFID) market size is estimated to grow by USD 10,456.94 million at a CAGR of 10.9% between 2022 and 2027.
  • The radio frequency (RF) MEMS market size is estimated to grow by USD 1,237.4 million at a CAGR of 9.22% between 2022 and 2027.

EV Group Brings Revolutionary Layer Transfer Technology to High-Volume Manufacturing with EVG®850 NanoCleave™ System

Retrieved on: 
Thursday, December 7, 2023
Glass, CFET-FM, EVG, Adhesive, Silicon, HVM, ACE EV Group, Memory, Nanotechnology, 3D, SOI, Temperature, MEMS, 3D printing, Printed circuit board

ST. FLORIAN, Austria, Dec. 7, 2023 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®850 NanoCleave™ layer release system—the first product platform to feature EVG's revolutionary NanoCleave technology. The EVG850 NanoCleave system enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an infrared (IR) laser coupled with specially formulated inorganic release materials in a proven, high-volume-manufacturing (HVM) capable platform. As a result, the EVG850 NanoCleave eliminates the need for glass carriers—enabling ultra-thin chiplet stacking for advanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced logic, memory and power device formation, to support future 3D integration roadmaps. 

Key Points: 
  • In addition, organic adhesives are generally limited to processing temperatures below 300 °C,  limiting their use to back-end processing.
  • Silicon carriers and inorganic release layers support process cleanliness, material compatibility and high processing temperature requirements for front-end manufacturing flows.
  • The layer transfer process also eliminates the need for expensive solvents associated with carrier wafer grinding, polishing and etching.
  • For more information on the EVG850 NanoCleave layer release system, visit https://www.evgroup.com/products/bonding/temporary-bonding-and-debonding... .

poLight ASA To Showcase Tunable Optics Technology At SPIE Photonics West 2024

Retrieved on: 
Wednesday, December 6, 2023
ASA, PLT, MEMS, Exhibition, OSE, Telescopic sight, Nightclub

HORTEN, Norway, Dec. 6, 2023 /PRNewswire/ -- poLight ASA (OSE: PLT) announced that Chief Technology Officer Pierre Craen will present at the SPIE Photonics West 2024, the world's premier event for optics and optoelectronics technology. His presentation, scheduled for January 29 at 3pm PST, will detail the company's innovative proprietary polymer and piezo MEMS based TLens® device structure delivering compact size, ultra-fast speed, low power consumption, athermalisation, and constant field of view as well as integration methods for several lens systems with the associated lens designs and guidelines. In addition, poLight will demonstrate its latest tunable optics technology with TLens®, Add-In lens reference designs, and Add-In/Add-On camera modules, and TWedge® wobulation capabilities in booth #5336. For more information, visit  https://bit.ly/41bD0Cy

Key Points: 
  • HORTEN, Norway, Dec. 6, 2023 /PRNewswire/ -- poLight ASA (OSE: PLT) announced that Chief Technology Officer Pierre Craen will present at the SPIE Photonics West 2024 , the world's premier event for optics and optoelectronics technology.
  • In addition, poLight will demonstrate its latest tunable optics technology with TLens®, Add-In lens reference designs, and Add-In/Add-On camera modules, and TWedge® wobulation capabilities in booth #5336.
  • For more information, visit https://bit.ly/41bD0Cy
    "SPIE Photonics West 2024 marks an important milestone for poLight as we host our first tradeshow exhibition, showcase the next generation capabilities of our tunable optics technology publicly, and share its uniquely differentiated benefits with conference attendees," said Dr. Øyvind Isaksen, CEO of poLight ASA.
  • "We are driving innovation in imaging across mobile/consumer, AR/MR, industrial/machine vision, and starting to explore opportunities in healthcare and automotive.

Avalanche Technology Presents "Dual QSPI 8Gb STT-MRAM Solutions for Space Applications" at the 2023 IEDM Conference

Retrieved on: 
Monday, December 4, 2023
Transfer, Socs, STT, Deep Space Industries, Radiation, Physics, Avalanche, Torque wrench, STT-MRAM, Field-programmable gate array, Space industry, Pareto, MRAM, International Electron Devices Meeting, Software, Environment, UMC, CMOS, Swap, JEDEC, MEMS, Video game

FREMONT, Calif., Dec. 4, 2023 /PRNewswire-PRWeb/ -- Avalanche Technology continues to demonstrate industry leadership of both technology development and commercialization of the most advanced next-generation MRAM platform solutions for the Space Industry. Avalanche will present "Dual QSPI 8Gb STT-MRAM Solutions for Space Applications" at the 2023 IEEE International Electron Devices Meeting (IEDM), held in San Francisco, CA December 9th-13th. The presentation will provide attendees with a comprehensive overview of the technical specifications, design considerations, and real-world applications of Avalanche's most advanced Spin Transfer Torque (STT) MRAM devices for space applications. The company invites industry experts, researchers, and space technology enthusiasts to explore the potential of this groundbreaking innovation.

Key Points: 
  • Avalanche will present "Dual QSPI 8Gb STT-MRAM Solutions for Space Applications" at the 2023 IEEE International Electron Devices Meeting (IEDM), held in San Francisco, CA December 9th-13th.
  • The presentation will provide attendees with a comprehensive overview of the technical specifications, design considerations, and real-world applications of Avalanche's most advanced Spin Transfer Torque (STT) MRAM devices for space applications.
  • The company invites industry experts, researchers, and space technology enthusiasts to explore the potential of this groundbreaking innovation.
  • IEDM is the world's preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling.

EV GROUP COMPLETES CONSTRUCTION OF NEW MANUFACTURING V BUILDING AT CORPORATE HEADQUARTERS TO EXPAND PRODUCTION CAPACITY

Retrieved on: 
Tuesday, November 28, 2023
Nanotechnology, FOWLP, Investment, 3D, Growth, Glass, NIL, CMOS, AI, ACE EV Group, WLO, EVG, MEMS

ST. FLORIAN, Austria, Nov. 28, 2023 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction work for the next expansion phase of its corporate headquarters. The new "Manufacturing V" facility, which is now open and serves as the manufacturing department for EVG equipment components, provides a significant increase in production floor and warehouse space. The opening of the Manufacturing V facility is the latest in a series of expansion phases and investments driven by continued strong demand for EVG's hybrid bonding and other process solutions and process development services to support the rapidly growing advanced packaging and 3D/heterogeneous integration market.

Key Points: 
  • The new "Manufacturing V" facility, which is now open and serves as the manufacturing department for EVG equipment components, provides a significant increase in production floor and warehouse space.
  • EVG's state-of-the-art Manufacturing V facility adds more than 1200 m2 of additional production floor space (for a total of more than 8100 m2 of production area), and more than 1200 m2 of warehouse space.
  • Since embarking on these two most recent growth phases, EVG has expanded its production capacity by more than 60 percent.
  • As key process enablers for 3D/heterogeneous integration, fusion and hybrid bonding have been transformed into the new scaling mechanism for semiconductor manufacturing.

Environmental Sensor Market worth $3.0 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Friday, November 17, 2023
Carbon, VOC, Climate change, Carbon dioxide, Investment, Ecosystem, Carbon monoxide, Home appliance, Oxygen, Region, Growth, Volatile organic compound, HVAC, Car, Raritan Inc., Internet of things, Headache, Communication, Nausea, Amphenol, Dizziness, Schneider Electric, UV, Honeywell, Weather, OTDR, Omron, MEMS, Image sensor, Research, Electronics, Tablet, Switch, Texas Instruments, Humidity, Biophysical environment, Pressure sensor, Ams-OSRAM, Consumer electronics, Hydrocarbon, Infrared, Geography, Application, Temperature, Thermistor, Motion, Pressure

By type, the gas/air quality segment is projected to grow at high CAGR of the environmental sensor market during the forecast period.

Key Points: 
  • By type, the gas/air quality segment is projected to grow at high CAGR of the environmental sensor market during the forecast period.
  • Consumer electronics segment is projected to grow at high CAGR of the environmental sensor market during the forecast period.
  • The consumer electronics segment is expected to grow at a high CAGR in the environmental sensor market during the forecast period.
  • Noth America is poised for significant growth in the environmental sensor market by 2028.

Environmental Sensor Market worth $3.0 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Friday, November 17, 2023
Carbon, VOC, Climate change, Carbon dioxide, Investment, Ecosystem, Carbon monoxide, Home appliance, Oxygen, Region, Growth, Volatile organic compound, HVAC, Car, Raritan Inc., Internet of things, Headache, Communication, Nausea, Amphenol, Dizziness, Schneider Electric, UV, Honeywell, Weather, OTDR, Omron, MEMS, Image sensor, Research, Electronics, Tablet, Switch, Texas Instruments, Humidity, Biophysical environment, Pressure sensor, Ams-OSRAM, Consumer electronics, Hydrocarbon, Infrared, Geography, Application, Temperature, Thermistor, Motion, Pressure

By type, the gas/air quality segment is projected to grow at high CAGR of the environmental sensor market during the forecast period.

Key Points: 
  • By type, the gas/air quality segment is projected to grow at high CAGR of the environmental sensor market during the forecast period.
  • Consumer electronics segment is projected to grow at high CAGR of the environmental sensor market during the forecast period.
  • The consumer electronics segment is expected to grow at a high CAGR in the environmental sensor market during the forecast period.
  • Noth America is poised for significant growth in the environmental sensor market by 2028.

Quantum Sensors vs. Quantum Computers: IDTechEx Takes a Look at the Next 10 Years

Retrieved on: 
Thursday, November 16, 2023
Quanta, Quantum, Safety, Electronics, Database, TMR, Honeywell, Quantum annealing, Culture, Laser, Ecosystem, Science, Artificial intelligence, CORDIS, Quantum computing, Miniaturization, Diamond, Black Mirror, Motion, MEMS, Microscope, Video game

Similar quantum hardware platforms can be adapted into quantum sensors and quantum computers.

Key Points: 
  • Similar quantum hardware platforms can be adapted into quantum sensors and quantum computers.
  • More detail about these technology platforms is covered in the IDTechEx's reports "Quantum Sensors Market 2024-2044" and "Quantum Computers 2023-2033" .
  • Few would deny that hype about quantum computers far outweighs that of quantum sensors.
  • Even within the quantum technology community, quantum computing often overshadows interest in quantum sensing – look no further than most industry conference agendas and scientific abstracts.

Quantum Sensors vs. Quantum Computers: IDTechEx Takes a Look at the Next 10 Years

Retrieved on: 
Thursday, November 16, 2023
Quanta, Quantum, Safety, Electronics, Database, TMR, Honeywell, Quantum annealing, Culture, Laser, Ecosystem, Science, Artificial intelligence, CORDIS, Quantum computing, Miniaturization, Diamond, Black Mirror, Motion, MEMS, Microscope, Video game

Similar quantum hardware platforms can be adapted into quantum sensors and quantum computers.

Key Points: 
  • Similar quantum hardware platforms can be adapted into quantum sensors and quantum computers.
  • More detail about these technology platforms is covered in the IDTechEx's reports "Quantum Sensors Market 2024-2044" and "Quantum Computers 2023-2033" .
  • Few would deny that hype about quantum computers far outweighs that of quantum sensors.
  • Even within the quantum technology community, quantum computing often overshadows interest in quantum sensing – look no further than most industry conference agendas and scientific abstracts.