TDP

ADLINK releases Intel® Amston-Lake-powered modules with up to 8 cores at 12W TDP suiting ruggedized edge solutions

Retrieved on: 
Tuesday, April 9, 2024
Temperature, COM Express, TSN, Intel, Communication, Time-Sensitive Networking, MIPI, Internet of things, LAN, LPDDR5, Transport, AI, PCI Express, Intel Atom, TCC, Robotics, USB, SMARC, Gracemont, Oklahoma, USB 3.2, HMI, TDP, Type 6, CPU, Computer data storage

SAN JOSE, Calif., April 8, 2024 /PRNewswire-PRWeb/ -- Summary:

Key Points: 
  • "Built for highly responsive on-device AI execution and at the same time can withstand ruggedized use scenarios, these new ADLINK COMs allow developers to realize various IoT edge innovations moving forward."
  • Utilizing Intel's Gracemont architecture, with broadened cache and memory bandwidth, responsive coding footprint, combined with soldered-down memory and extreme temperature option, the modules deliver superior performance with great efficiency for wide-ranging ruggedized IoT solutions at the edge.
  • For more information about ADLINK COMs, visit the product pages for: cExpress-ASL (COM Express Type 6) and LEC-ASL (SMARC) modules.
  • Stay tuned, as ADLINK is working to offer another COM Express Type 10 module based on Intel Atom X7000RE & X7000C series processors (Amston Lake).

Ventiva Announces Partnership with Clarion for Mass Production of ICE Electronics Manufacturing Expansion in Malaysia

Retrieved on: 
Tuesday, March 19, 2024
Technology, Batteries, Hardware, Consumer Electronics, Certification, Plasma, BHD, International Automotive Task Force, Partnership, ICE, Thermal design power, TDP, Crystal

Ventiva , a leading company in active cooling solutions for electronic devices, today announced its partnership with Crystal Precision (M) Sdn.

Key Points: 
  • Ventiva , a leading company in active cooling solutions for electronic devices, today announced its partnership with Crystal Precision (M) Sdn.
  • Bhd., a member of Clarion (Malaysia) Group of Companies, to manufacture its unique Ionic Cooling Engine (ICE) technology.
  • A dedicated production line in Crystal Precision’s 40,000-square-foot factory will be equipped to produce up to four million units per month.
  • Currently targeted at laptop computers, Ventiva delivers thermal subsystems for up to 30 watts of Thermal Design Power (TDP).

AMD Showcases AEWIN High-Density Edge Computing Server at Embedded World 2024

Retrieved on: 
Tuesday, April 2, 2024
DTLS, SSL/TLS, OS, QAT, IPMI, CRPS, Total cost, Memory, Embedded, RAID, Common, NVM Express, DDR5, PCI Express, AI, BMC, OCP, Solid-state drive, AMD, IPsec, TDP, CPU, Video game

TAIPEI, April 2, 2024 /PRNewswire/ -- AEWIN is glad to share with you that our High-Density Edge Computing Server, BAS-6101A, powered by Single AMD Zen4 Genoa or Zen4c Bergamo CPU is selected is displayed by AMD at Embedded World 2024.

Key Points: 
  • TAIPEI, April 2, 2024 /PRNewswire/ -- AEWIN is glad to share with you that our High-Density Edge Computing Server, BAS-6101A, powered by Single AMD Zen4 Genoa or Zen4c Bergamo CPU is selected is displayed by AMD at Embedded World 2024.
  • The BAS-6101A supports the latest AMD Bergamo CPU with up to 128 cores (~100% increased) and 400W TDP (~28% increased) to enable the extreme computing power pursued in the market.
  • With its short-depth design of 600mm for easy deployment at the edge, the system is suitable for diverse Edge AI applications.
  • Learn more about AEWIN BAS-6101A at AMD's booth at Embedded World 2024 or contact AEWIN sales at any time!

Accelerating Networking and Edge AI with AEWIN High Performance Network Appliances and Edge Servers Powered by AMD Siena

Retrieved on: 
Tuesday, March 26, 2024
OS, MEC, GPU, SSD, TPM, NVM Express, DDR5, Network, AI, CXL, PCI Express, TCO, 2U, NIC, Processor, EPYC, DW, AMD, Solid-state drive, Computer appliance, TDP, Video game

TAIPEI, March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.

Key Points: 
  • TAIPEI, March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.
  • Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.
  • Benefited from the Siena CPU with energy efficiency, both models feature extraordinary computing performance and short-depth design (SCB-1945: 548mm; SCB-1947A: 600mm) to achieve faster speeds for Edge Computing and Networking.
  • In addition to the GPU slots, there are 4x PCIe 5.0 x8 slots available for NIC, accelerators, or NVMe SSDs.

Accelerating Networking and Edge AI with AEWIN High Performance Network Appliances and Edge Servers Powered by AMD Siena

Retrieved on: 
Tuesday, March 26, 2024
OS, MEC, GPU, SSD, TPM, NVM Express, DDR5, Network, AI, CXL, PCI Express, TCO, 2U, NIC, Processor, EPYC, DW, AMD, Solid-state drive, Multimedia, Computer appliance, TDP, Video game

TAIPEI , March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.

Key Points: 
  • TAIPEI , March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.
  • Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.
  • Benefited from the Siena CPU with energy efficiency, both models feature extraordinary computing performance and short-depth design (SCB-1945: 548mm; SCB-1947A: 600mm) to achieve faster speeds for Edge Computing and Networking.
  • In addition to the GPU slots, there are 4x PCIe 5.0 x8 slots available for NIC, accelerators, or NVMe SSDs.

Supermicro Grows AI Optimized Product Portfolio with a New Generation of Systems and Rack Architectures Featuring New NVIDIA Blackwell Architecture Solutions

Retrieved on: 
Monday, March 18, 2024
Cloud, HGX, GTC, GPU, Communication, Deep learning super sampling, NVLink, Grace, InfiniBand, SAN, B200, AI, LLM, Architecture, Graphics processing unit, GPT, TB, San Jose Convention Center, NVIDIA, MGX, TDP, Total, Video game

SAN JOSE, Calif., March 18, 2024 /PRNewswire/ -- NVIDIA GTC 2024, -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing new AI systems for large-scale generative AI featuring NVIDIA's next-generation of data center products, including the latest NVIDIA GB200 Grace™ Blackwell Superchip, the NVIDIA B200 Tensor Core and B100 Tensor Core GPUs. Supermicro is enhancing its current NVIDIA HGX™ H100/H200 8-GPU systems to be drop-in ready for the NVIDIA HGX™ B100 8-GPU and enhanced to support the B200, resulting in a reduced time to delivery. Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs. Supermicro is also adding new systems to its lineup, including the 4U NVIDIA HGX B200 8-GPU liquid-cooled system.

Key Points: 
  • Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs.
  • "These new products are built upon Supermicro and NVIDIA's proven HGX and MGX system architecture, optimizing for the new capabilities of NVIDIA Blackwell GPUs.
  • Optimized for the NVIDIA Blackwell architecture, the NVIDIA Quantum-X800, and Spectrum-X800 will deliver the highest level of networking performance for AI infrastructures.
  • Supermicro will also showcase two rack-level solutions, including a concept rack with systems featuring the upcoming NVIDIA GB200 with 72 liquid-cooled GPUs interconnected with fifth-generation NVLink.

Supermicro Grows AI Optimized Product Portfolio with a New Generation of Systems and Rack Architectures Featuring New NVIDIA Blackwell Architecture Solutions

Retrieved on: 
Monday, March 18, 2024
Cloud, HGX, GTC, GPU, Communication, Deep learning super sampling, NVLink, Grace, InfiniBand, SAN, B200, AI, LLM, Architecture, Graphics processing unit, GPT, TB, San Jose Convention Center, NVIDIA, MGX, TDP, Total, Video game

SAN JOSE, Calif., March 18, 2024 /PRNewswire/ -- NVIDIA GTC 2024, -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing new AI systems for large-scale generative AI featuring NVIDIA's next-generation of data center products, including the latest NVIDIA GB200 Grace™ Blackwell Superchip, the NVIDIA B200 Tensor Core and B100 Tensor Core GPUs. Supermicro is enhancing its current NVIDIA HGX™ H100/H200 8-GPU systems to be drop-in ready for the NVIDIA HGX™ B100 8-GPU and enhanced to support the B200, resulting in a reduced time to delivery. Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs. Supermicro is also adding new systems to its lineup, including the 4U NVIDIA HGX B200 8-GPU liquid-cooled system.

Key Points: 
  • Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs.
  • "These new products are built upon Supermicro and NVIDIA's proven HGX and MGX system architecture, optimizing for the new capabilities of NVIDIA Blackwell GPUs.
  • Optimized for the NVIDIA Blackwell architecture, the NVIDIA Quantum-X800, and Spectrum-X800 will deliver the highest level of networking performance for AI infrastructures.
  • Supermicro will also showcase two rack-level solutions, including a concept rack with systems featuring the upcoming NVIDIA GB200 with 72 liquid-cooled GPUs interconnected with fifth-generation NVLink.

Record Year for Data Center Physical Infrastructure Market with 16 Percent Growth for 2023, According to Dell'Oro Group

Retrieved on: 
Tuesday, March 12, 2024
Growth, Mitsubishi Electric, Vertiv, Thermal management, DCPI, CALA, Y/Y, UPS, Telecommunications, TDP

REDWOOD CITY, Calif., March 12, 2024 /PRNewswire/ -- According to a recently published report from Dell'Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, Data Center Physical Infrastructure (DCPI) revenue growth continued to decelerate in 4Q 2023, but maintained double-digit year-over-year (Y/Y) growth. This capped off a record year of 16 percent revenue growth.

Key Points: 
  • This capped off a record year of 16 percent revenue growth.
  • "In my nearly decade-long coverage of the DCPI market, 2023 marked the highest year of revenue growth I've observed.
  • Additional highlights from the 4Q 2023 Data Center Physical Infrastructure Quarterly Report:
    Eaton, Munters, and Mitsubishi Electric led all vendors in market share gains in 4Q 2023.
  • North America, Asia Pacific (excluding China), Europe, and the Middle East and Africa (EMEA) paced market growth in 4Q 2023 with double-digit growth rates.

LiquidStack Opens New Manufacturing Facility and Global Headquarters in Carrollton, Texas, to Scale Liquid Cooling Production

Retrieved on: 
Tuesday, March 5, 2024
TDP, Commerce, Housing, University

CARROLLTON, Texas, March 05, 2024 (GLOBE NEWSWIRE) -- LiquidStack , a global leader in liquid cooling for data centers, today announced its new U.S. manufacturing site and headquarters located in Carrollton, Texas.

Key Points: 
  • CARROLLTON, Texas, March 05, 2024 (GLOBE NEWSWIRE) -- LiquidStack , a global leader in liquid cooling for data centers, today announced its new U.S. manufacturing site and headquarters located in Carrollton, Texas.
  • The new facility is a major milestone in LiquidStack’s mission to deliver high performance, cost-effective and reliable liquid cooling solutions for high performance data center and edge computing applications.
  • The Carrollton, Texas LiquidStack manufacturing facility and headquarters occupies over 20,000 square feet.
  • Expected attendees include members of the city council and the Metrocrest Chamber of Commerce, as well as LiquidStack customers and partners.

CLPS Incorporation Reports Financial Results for the First Half of Fiscal Year 2024

Retrieved on: 
Tuesday, March 5, 2024
Acquisition, RMB, Operating cost, Research, USD, Investment, Marketing, Growth, Talent, TCP, TDP, CLPS, Fiscal

HONG KONG, March 5, 2024 /PRNewswire/ -- CLPS Incorporation (the "Company" or "CLPS") (Nasdaq: CLPS), today announced its unaudited financial results for the six months ended December 31, 2023, or the first half of the Company's fiscal year 2024.

Key Points: 
  • HONG KONG, March 5, 2024 /PRNewswire/ -- CLPS Incorporation (the "Company" or "CLPS") (Nasdaq: CLPS), today announced its unaudited financial results for the six months ended December 31, 2023, or the first half of the Company's fiscal year 2024.
  • First Half of Fiscal 2024 Highlights (all results compared to the six months ended December 31, 2022)
    Revenue from the United States increased by 92.7% to $1.9 million from $1.0 million.
  • Ms. Rui Yang, Chief Financial Officer of CLPS, commented, "We have managed to achieve noteworthy financial results during this period.
  • Gross profit was $15.8 million in the first half of fiscal 2024, compared to $18.5 million in the prior year period.