TANAKA Develops Active Brazing Filler Metal/Copper Composite Material for Power Devices
(Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which operates the TANAKA Precious Metals manufacturing business, developed an active brazing filler metal/copper composite material for power devices that can reduce processing times.
- (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which operates the TANAKA Precious Metals manufacturing business, developed an active brazing filler metal/copper composite material for power devices that can reduce processing times.
- The new product is a composite (cladding) of copper (Cu) material with active brazing filler metal on one side.
- - The brazing filler thickness can be 10 um (micrometers) or less, which means that compared to earlier active brazing filler metal, silver bullion costs can be reduced by half or more and the brazing filler thermal resistance is halved.
- AgCuSnTi alloys can be dispersed more finely than SnTi alloys and support manufacturing and supply of product with thin brazing filler.