Semiconductor industry in Taiwan

Silane Market is Projected To Reach A Revised Size of USD 1746.4 Million By 2028, Growing At A CAGR of 3.2% | Valuates Reports

Retrieved on: 
Friday, January 6, 2023

Due to the COVID-19 pandemic and Russia-Ukraine War Influence, the global Silane market estimated at USD 1445.6 million in the year 2022, is projected to reach a revised size of USD 1746.4 million by 2028, growing at a CAGR of 3.2% during the forecast period 2022-2028.

Key Points: 
  • Due to the COVID-19 pandemic and Russia-Ukraine War Influence, the global Silane market estimated at USD 1445.6 million in the year 2022, is projected to reach a revised size of USD 1746.4 million by 2028, growing at a CAGR of 3.2% during the forecast period 2022-2028.
  • One of the primary factors favorably influencing the Silane market is rapid urbanization, which is coupled with the rising demand for consumer electronics.
  • It can be linked to the widespread use of silane in the production of semiconductors and the insulation of low-voltage cables in electronic equipment.
  • For the manufacture of elemental silicon in the photovoltaic and semiconductor industries, silane (SiH4) is a crucial precursor.

Silane Market is Projected To Reach A Revised Size of USD 1746.4 Million By 2028, Growing At A CAGR of 3.2% | Valuates Reports

Retrieved on: 
Friday, January 6, 2023

Due to the COVID-19 pandemic and Russia-Ukraine War Influence, the global Silane market estimated at USD 1445.6 million in the year 2022, is projected to reach a revised size of USD 1746.4 million by 2028, growing at a CAGR of 3.2% during the forecast period 2022-2028.

Key Points: 
  • Due to the COVID-19 pandemic and Russia-Ukraine War Influence, the global Silane market estimated at USD 1445.6 million in the year 2022, is projected to reach a revised size of USD 1746.4 million by 2028, growing at a CAGR of 3.2% during the forecast period 2022-2028.
  • One of the primary factors favorably influencing the Silane market is rapid urbanization, which is coupled with the rising demand for consumer electronics.
  • It can be linked to the widespread use of silane in the production of semiconductors and the insulation of low-voltage cables in electronic equipment.
  • For the manufacture of elemental silicon in the photovoltaic and semiconductor industries, silane (SiH4) is a crucial precursor.

Kinetic Technologies Adopts Diakopto's ParagonX™ Platform for High-Performance Power Management and Video/Audio Interface ICs

Retrieved on: 
Tuesday, January 25, 2022

Parasitics are unintended elements that degrade IC performance, precision, power efficiency, robustness, and reliability.

Key Points: 
  • Parasitics are unintended elements that degrade IC performance, precision, power efficiency, robustness, and reliability.
  • The power-performance-area (PPA) metric and time-to-market of modern ICs are now dominated by on-chip interconnects and layout parasitics.
  • "We are pleased to welcome Kinetic Technologies to our family of ParagonX users, and excited to see them using ParagonX for their cutting-edge power management and video/audio interface ICs," remarked Maxim Ershov, CEO and CTO of Diakopto.
  • Kinetic Technologies is a privately held company with R&D centers in Silicon Valley and Asia, along with operations and logistics based in Asia.

Applied Materials Introduces New Technologies and Capabilities for Accelerating the Semiconductor Industry’s Heterogeneous Integration Roadmap

Retrieved on: 
Wednesday, September 8, 2021

Heterogeneous integration brings new kinds of design and manufacturing flexibility to semiconductor and system companies by allowing chips of various technologies, functions and sizes to be integrated in one package.

Key Points: 
  • Heterogeneous integration brings new kinds of design and manufacturing flexibility to semiconductor and system companies by allowing chips of various technologies, functions and sizes to be integrated in one package.
  • Applieds industry-leading portfolio of advanced packaging solutions gives customers the broadest selection of enabling technologies for heterogenous integration, said Nirmalya Maity, Corporate Vice President of Advanced Packaging at Applied Materials.
  • Today, Applied is unveiling innovations in three areas critical to advanced packaging for heterogeneous integration: die-to-wafer hybrid bonding, wafer-to-wafer bonding and advanced substrates.
  • Semiconductor innovation is increasingly being fueled by 3D integration and engineered materials, which drives greater demand for wafer-to-wafer hybrid bonding.

Global Semiconductor and IC Packaging Materials Market to Reach $34.3 Billion by 2026

Retrieved on: 
Wednesday, June 30, 2021

SAN FRANCISCO, June 30, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Semiconductor and IC Packaging Materials - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, June 30, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Semiconductor and IC Packaging Materials - Global Market Trajectory & Analytics" .
  • Amid the COVID-19 crisis, the global market for Semiconductor and IC Packaging Materials estimated at US$25 Billion in the year 2020, is projected to reach a revised size of US$34.3 Billion by 2026, growing at a CAGR of 5.3% over the analysis period.
  • This segment currently accounts for a 18.6% share of the global Semiconductor and IC Packaging Materials market.
  • The U.S. Market is Estimated at $3.2 in 2021, While China is Forecast to Reach $8.7 Billion by 2026
    The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$3.2 Billion in the year 2021.

2020 Global Semiconductor Equipment Sales Surge 19% to Industry Record $71.2 Billion, SEMI Reports

Retrieved on: 
Tuesday, April 13, 2021

The data is now available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report .\nFor the first time, China claimed the largest market for new semiconductor equipment with sales growth of 39% to $18.72 billion.

Key Points: 
  • The data is now available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report .\nFor the first time, China claimed the largest market for new semiconductor equipment with sales growth of 39% to $18.72 billion.
  • Sales in Taiwan, the second-largest equipment market, remained flat in 2020 with sales of $17.15 billion after showing strong growth in 2019.
  • Receipts in North America decreased 20% in 2020 following three years of consecutive growth.\nGlobal sales of wafer processing equipment rose 19% in 2020, while other front-end segment sales grew 4%.
  • Assembly and packaging showed strong growth across all regions, resulting in a 34% market increase in 2020, while total test equipment sales increased 20%.\nCompiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry.

2020 Global Semiconductor Equipment Sales Surge 19% to Industry Record $71.2 Billion, SEMI Reports

Retrieved on: 
Tuesday, April 13, 2021

The data is now available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report .\nFor the first time, China claimed the largest market for new semiconductor equipment with sales growth of 39% to $18.72 billion.

Key Points: 
  • The data is now available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report .\nFor the first time, China claimed the largest market for new semiconductor equipment with sales growth of 39% to $18.72 billion.
  • Sales in Taiwan, the second-largest equipment market, remained flat in 2020 with sales of $17.15 billion after showing strong growth in 2019.
  • Receipts in North America decreased 20% in 2020 following three years of consecutive growth.\nGlobal sales of wafer processing equipment rose 19% in 2020, while other front-end segment sales grew 4%.
  • Assembly and packaging showed strong growth across all regions, resulting in a 34% market increase in 2020, while total test equipment sales increased 20%.\nCompiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry.