Baraja announces availability of integrated components for new-to-world Doppler RMCW Spectrum-Scan™ LiDAR
PALO ALTO, Calif., Nov. 29, 2023 /PRNewswire/ -- Baraja , creator of the breakthrough Spectrum-Scan™ LiDAR technology, announces the availability of A-Samples of all the integrated components necessary to build a new-to-world Doppler RMCW Spectrum-Scan™ LiDAR for automotive integration.
- PALO ALTO, Calif., Nov. 29, 2023 /PRNewswire/ -- Baraja , creator of the breakthrough Spectrum-Scan™ LiDAR technology, announces the availability of A-Samples of all the integrated components necessary to build a new-to-world Doppler RMCW Spectrum-Scan™ LiDAR for automotive integration.
- "Multiple heterogeneous sub-systems are contained in a LiDAR, this would require each sub-system's integration via completely different classes of chips and using different processes.
- The Bidirectional Optical Sub-Assembly (BOSA) integrates 3 types of chips in an automotive-grade, hermetically sealed and temperature controlled enclosure (3x3.5cm).
- These chips are: the laser chip (InP), the homodyne receiver chip (silicon photonics) and the TIA chips (silicon).