Dicing saw

Wafer Dicing Saws Market | Post COVID-19 Analysis | Technavio

Retrieved on: 
Monday, July 26, 2021
Semiconductor device fabrication, Dicing saw, Wafer dicing, Wafer, Saw, DICING, Marketplace, DICING, Human activities, Human behavior

The global wafer dicing saws market is expected to grow by USD 91.16 million during 2021-2025, according to Technavio's latest market report.

Key Points: 
  • The global wafer dicing saws market is expected to grow by USD 91.16 million during 2021-2025, according to Technavio's latest market report.
  • The wafer dicing saws market share growth by the pureplay foundriessegment has been significant and is expected to provide significant growth opportunities to market vendors.
  • Taiwan, South Korea (Republic of Korea), Japan, and Chinaare the key markets forwafer dicing saws market in APAC.
  • Advanced Dicing Technologies operates its business under segments- Dicing Saws, Dicing Blades, Peripheral Equipment, and Dicing Accessories.

Global Wafer Dicing Saws Market | Increasing Number of Mobile Devices to Boost the Market Growth | Technavio

Retrieved on: 
Monday, October 26, 2020
Semiconductor, Hardware, Manufacturing, Technology, Engineering, Business, Articles, Dicing saw, Wafer dicing, Wafer, Market research, Saw, Light-emitting diode

View the full release here: https://www.businesswire.com/news/home/20201026005624/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20201026005624/en/
    Technavio has announced its latest market research report titled Global Wafer Dicing Saws Market 2020-2024 (Graphic: Business Wire)
    The wafer dicing saws market is driven by the increase in the number of mobile devices, smart devices, and smart cards as one of the primary growth factors for this market.
  • APAC was the largest wafer dicing saws market in 2019, and the region will offer several growth opportunities to market vendors during the forecast period.
  • To help clients improve their market position, this wafer dicing saws market forecast report provides a detailed analysis of the market leaders.
  • As the business impact of COVID-19 spreads, the global wafer dicing saws market 2020-2024 is expected to have negative growth.

Wafer Dicing Saws Market 2020-2024: Forecasting Strategy to Undergo a Paradigm Shift From Crisis to New Normal During COVID-19 Pandemic | Technavio

Retrieved on: 
Thursday, September 24, 2020
Semiconductor, Manufacturing, Other Manufacturing, Steel, Technology, Semiconductor device fabrication, Dicing saw, Wafer, SEMI, Saw, DICING, Articles, Human activities

This wafer dicing saws market research report encompasses all possible factors expected to drive the market growth and create opportunities for all the stakeholders in the supply chain.

Key Points: 
  • This wafer dicing saws market research report encompasses all possible factors expected to drive the market growth and create opportunities for all the stakeholders in the supply chain.
  • View detailed wafer dicing saws market insights here: https://www.technavio.com/report/wafer dicing saws market-industry-analysis
    Pureplay foundries will hold the largest market share.
  • The increasing number of semiconductor devices that are required for data centers, Internet of Things (IoT), and self-driving cars will significantly drive wafer dicing saws market growth in this region over the forecast period.
  • Prominent Wafer Dicing Saws market players are: Advanced Dicing Technologies, DISCO Corp., Dynatex International, Loadpoint Ltd., and Tokyo Seimitsu Co. Ltd.
    With more companies navigating the pandemic gradually, this research analysis can be personalized to create a recovery path for the market participants.