System in a package

Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP

Retrieved on: 
Tuesday, August 10, 2021
Semiconductor, Hardware, Consumer Electronics, Other Technology, Technology, OSAT, Industry, Original equipment manufacturer, SIP, FR2, High-pass filter, Electronics, 3D, CAGR, Amkor Technology, IC, Technology, Solution, System in a package, EMI, FR1, LNA, SA, Nasdaq, Common, Yole, Growth, AIP, Semiconductor, Mobile phone, Printed circuit board, Cable television

Expanding on years of experience in delivering world-class, advanced System in Package (SiP) technology, Amkor was the first OSAT to offer DSMBGA and continues to pave the way for further breakthroughs.

Key Points: 
  • Expanding on years of experience in delivering world-class, advanced System in Package (SiP) technology, Amkor was the first OSAT to offer DSMBGA and continues to pave the way for further breakthroughs.
  • With our DSMBGA platform, weve established a preferred advanced packaging solution for this domain, said Giel Rutten, Amkor President and Chief Executive Officer.
  • Common RF front-end modules consist of an LNA (low noise amplifier), power amp, an RF switch, RF filters and duplexers.
  • Amkor continues to innovate in DSMBGA and other advanced SiP technologies to capture opportunities in the RF market.

Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows

Retrieved on: 
Tuesday, August 25, 2020
Integrated circuits, Packaging, Electronic engineering, Semiconductor device fabrication, Computing, Technology, MOSFETs, Three-dimensional integrated circuit, Synopsys, Interposer, Compiler, System in a package

Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based Chip-on-Wafer-on-Substrate (CoWoS-S) and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) designs.

Key Points: 
  • Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based Chip-on-Wafer-on-Substrate (CoWoS-S) and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) designs.
  • 3DIC Compiler provides packaging design solutions required by today's complex multi-die systems for applications like high-performance computing (HPC), automotive and mobile.
  • The Synopsys 3DIC Compiler solution provides a unified chip-package co-design and analysis environment for creating an optimal 2.5D/3D multi-die system in a package.
  • The solution includes features such as TSMC design macro support and auto-routing of high-density interposerbased interconnects using CoWoStechnology.