Interconnect

Infinera to Showcase Advances in Optical Networking Solutions at OFC 2024

Retrieved on: 
Wednesday, March 20, 2024
OLS, ZR, Solution selling, Coherent Solutions, Convention, Network, Arista Networks, SAN, Interconnect, Optica, Shadow, AI, Marketing, DZS, Modularity, Product management, Expo Hall, Indium, Computer data storage

SAN JOSE, Calif., March 20, 2024 (GLOBE NEWSWIRE) -- Infinera (Nasdaq: INFN) announced today that it will showcase key elements of its multiyear vision and strategy for connecting the world in the terabit era at OFC 2024 , to be held March 26-28 in San Diego, California.

Key Points: 
  • SAN JOSE, Calif., March 20, 2024 (GLOBE NEWSWIRE) -- Infinera (Nasdaq: INFN) announced today that it will showcase key elements of its multiyear vision and strategy for connecting the world in the terabit era at OFC 2024 , to be held March 26-28 in San Diego, California.
  • Delivering the lowest cost and power per bit while dramatically increasing flexibility, Infinera solutions include groundbreaking innovations in coherent optics, the latest advances in networking technology, and a new suite of open automation tools to enable seamless and efficient multi-vendor operations.
  • ICE-X 800G Intelligent Coherent Pluggables – Infinera’s newest pluggable module is the industry’s first multi-vendor-interoperable, multi-haul ZR/ZR+ coherent solution.
  • The ICE-X 800G showcase will include an augmented reality tour of the technology, design elements, and key differentiators.

Marvell Demonstrates Industry's First 3nm Data Infrastructure Silicon

Retrieved on: 
Wednesday, April 19, 2023
Application-specific integrated circuit, PHY, Marvell, PCI Express, RDL, IP, TBPS, DSPS, PAM4, MRVL, TSMC, Marvell Technology, Interconnect, Silicon, AI, Redistribution layer, Printed circuit board, Semiconductor, Computer data storage, Video game, SerDes

The new building blocks are part of Marvell's continued execution of its strategy to develop a comprehensive silicon IP portfolio for designing chips that will radically increase the bandwidth, performance, and energy efficiency of next-generation data infrastructure.

Key Points: 
  • The new building blocks are part of Marvell's continued execution of its strategy to develop a comprehensive silicon IP portfolio for designing chips that will radically increase the bandwidth, performance, and energy efficiency of next-generation data infrastructure.
  • Marvell was also the first data infrastructure silicon supplier to respectively sample and commercially release the industry-leading 112G SerDes and has been a leader in data infrastructure products based on TSMC's 5nm process.
  • SerDes and parallel interconnects serve as high-speed pathways for exchanging data between chips or silicon components inside chiplets.
  • "We congratulate Marvell on the achievement of this important silicon development milestone in the industry's cutting-edge 3nm process technology," said Joachim Peerlings, general manager of Keysight's Communications Solutions Group.

Avicena Acquires microLED Fab Facility and Engineering Team From Nanosys

Retrieved on: 
Tuesday, October 18, 2022
Other Manufacturing, Mobile, Wireless, Technology, Semiconductor, Engineering, Aerospace, Software, Manufacturing, Networks, Hardware, CA, ASIC, Television, NVLink, Silicon, Xpu Há, PD, 2014 UCI Road World Championships, Multimedia, Investment, MicroLED, Partnership, HPC, Gallium nitride, CMOS, Acquisition, CEO, Bow, Interconnect, Artificial intelligence, Tablet, ICS, Video game console, Computer data storage, Avicenna, Nanosys

Avicena, the leader in high-performance microLED-based chip-to-chip interconnects, today announced that it has completed the acquisition of a microLED fabrication facility and associated engineering team from Nanosys.

Key Points: 
  • Avicena, the leader in high-performance microLED-based chip-to-chip interconnects, today announced that it has completed the acquisition of a microLED fabrication facility and associated engineering team from Nanosys.
  • Avicena had been using the Nanosys fab for the development of unique ultra-fast microLEDs.
  • The acquisition of the fab and associated engineering team significantly increases the development and manufacturing capabilities.
  • We thank the microLED fab team for their partnership in developing and manufacturing microLEDs as part of Nanosys and wish them well in their future with Avicena, said Jason Hartlove, President and CEO of Nanosys.

Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022

Retrieved on: 
Monday, September 19, 2022
Technology, Semiconductor, Engineering, Manufacturing, Software, Networks, Hardware, Other Science, Science, TBPS, MicroLED, Mountain View, California, Temperature, CMOS, ICS, 2013 UCI Road World Championships – Women's team time trial, ELS, NVLink, ECOC, PD, CEO, Technology, CA, Family, Application-specific integrated circuit, European Conference on Information Systems, Communes of Burundi, Gallium nitride, Conference, Interconnect, HPC, Multimedia, Bow, Xpu Há, Artificial intelligence, Computer data storage, Avicenna

Avicena, a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2022 in Basel, Switzerland ( https://www.ecocexhibition.com/ ).

Key Points: 
  • Avicena, a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2022 in Basel, Switzerland ( https://www.ecocexhibition.com/ ).
  • Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of XPUs, Smart NICs, hardware accelerators, and high-performance shared memory.
  • Ever growing Artificial Intelligence (AI)/Machine Learning (ML) and High-Performance Computing (HPC) workloads are driving the need for interconnects with ultra-high bandwidth density, ultra-low power consumption, and low latency.
  • We have already demonstrated LightBundleTM links running at less than 1pJ/bit, says Bardia Pezeshki, founder and CEO of Avicena, Here at ECOC 2022 we are demonstrating individual microLED links running at 14Gbps.

Molded Interconnect Device (MID) Market worth $2.7 billion by 2027 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, August 15, 2022
Knowledge, Television, Printing, Intelligence, SME, Consumer electronics, KYOCERA, 3D, LDS, MID, IOT, Telecommunication, USD, PCB, Efficiency, Amphenol, Communication, Plant, Research, GEM, Capacitor, Bachelor of Engineering, CAGR, Interconnect, Adapter, Region, TE, TE Connectivity, MIDS, Display device, Yazaki, Video game, Marketing, Application, Transformer, Inductor, Molex, Electronics, Geography, Terminal, Splice

CHICAGO, Aug. 15, 2022 /PRNewswire/ -- Molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027; it is expected to grow at a CAGR of 13.6% during the forecast period, according to a new report by MarketsandMarkets.

Key Points: 
  • CHICAGO, Aug. 15, 2022 /PRNewswire/ -- Molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027; it is expected to grow at a CAGR of 13.6% during the forecast period, according to a new report by MarketsandMarkets.
  • MIDs are used in LED lighting to make them cost-efficient and effective by placing interconnects and electronic components on a 3D plastic body.
  • The report profiles key players in the molded interconnect device (MID) market and analyzes their market shares.
  • MarketsandMarkets now coming up with 1,500 MicroQuadrants (Positioning top players across leaders, emerging companies, innovators, strategic players) annually in high growth emerging segments.

Molded Interconnect Device (MID) Market worth $2.7 billion by 2027 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, August 15, 2022
Knowledge, Television, Printing, Intelligence, SME, Consumer electronics, KYOCERA, 3D, LDS, MID, IOT, Telecommunication, USD, PCB, Efficiency, Amphenol, Communication, Plant, Research, GEM, Capacitor, Bachelor of Engineering, CAGR, Interconnect, Adapter, Region, TE, TE Connectivity, MIDS, Display device, Yazaki, Video game, Marketing, Application, Transformer, Inductor, Molex, Electronics, Geography, Terminal, Splice

CHICAGO, Aug. 15, 2022 /PRNewswire/ -- Molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027; it is expected to grow at a CAGR of 13.6% during the forecast period, according to a new report by MarketsandMarkets.

Key Points: 
  • CHICAGO, Aug. 15, 2022 /PRNewswire/ -- Molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027; it is expected to grow at a CAGR of 13.6% during the forecast period, according to a new report by MarketsandMarkets.
  • MIDs are used in LED lighting to make them cost-efficient and effective by placing interconnects and electronic components on a 3D plastic body.
  • The report profiles key players in the molded interconnect device (MID) market and analyzes their market shares.
  • MarketsandMarkets now coming up with 1,500 MicroQuadrants (Positioning top players across leaders, emerging companies, innovators, strategic players) annually in high growth emerging segments.

A $20.8 Billion Global Opportunity for Optical Interconnects by 2026 - New Research from StrategyR

Retrieved on: 
Monday, June 27, 2022
Research, Mellanox Technologies, Intelligence, Connected space, COVID-19, Marketing, Geography, Growth, Fujitsu Ltd. v. Netgear Inc., Forecasting, Broadcom Inc., GIA, SAN, North American power transmission grid, Interconnect, CAGR, Players, TE, Renewable energy, Pet, Others

SAN FRANCISCO, June 27, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Optical Interconnects - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, June 27, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Optical Interconnects - Global Market Trajectory & Analytics" .
  • Geographies:World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
  • Preview Registry
    Amid the COVID-19 crisis, the global market for Optical Interconnects estimated at US$7.7 Billion, is projected to reach a revised size of US$20.8 Billion by 2026, growing at a CAGR of 17.8% over the analysis period.
  • Global Industry Analysts, Inc., ( www.strategyr.com ) is a renowned market research publisher the world`s only influencer driven market research company.

HiWire Consortium Joins Forces with the Open Compute Project Foundation to Accelerate AEC Standardization

Retrieved on: 
Thursday, May 26, 2022
Technology, Networks, Hardware, Telecommunications, GPU, Credo, AEC, DDC, Solution, Community, OCP, Industry, AEC Bridgemaster, Facebook, Technology, Ecosystem, Interconnect, Group, Operation, Microsoft, Adoption, Wire, DDC-I, Composable disaggregated infrastructure, EDGE, Pharmaceutical industry, Uranium, Renewable energy, Distribution, Calendar

Open Compute Project Foundation (OCP) and the HiWire Consortium today jointly announced that the HiWire Consortium standardization efforts will be absorbed into a new Interconnects Sub-Project inside OCP led by Don Barnetson, Vice President for AEC Products at Credo.

Key Points: 
  • Open Compute Project Foundation (OCP) and the HiWire Consortium today jointly announced that the HiWire Consortium standardization efforts will be absorbed into a new Interconnects Sub-Project inside OCP led by Don Barnetson, Vice President for AEC Products at Credo.
  • The HiWire Consortium leads the inaugural effort to bring standardization to a new category of connectivity products Active Electrical Cables (AECs), said Sheng Huang, President of the HiWire Consortium.
  • As AECs move into the mainstream, we feel the broader umbrella of OCP will continue to accelerate standardization efforts and increase industry adoption.
  • The HiWire Consortium membership grew to 46 companies and the v1.0 HiWire AEC Specification was ratified in November, 2021.

Avicena Demonstrates Record-Breaking Ultra-Low-Energy Optical Chip-to-Chip Interconnect

Retrieved on: 
Monday, March 7, 2022
Technology, Networks, Hardware, Semiconductor, Marketing, PD, OFC, 2007 UCI ProTour, Interconnect, CMOS, MicroLED, Cost, TBPS, Multimedia, Xpu Há, Temperature, Artificial intelligence, Conference, CEO, HPC, NVLink, Optics, Application-specific integrated circuit, Technology, Gallium nitride, Silicon, Bow, ICS, Television, Electronic component, Computer data storage, Lumileds, Avicenna

Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of XPUs, hardware accelerators, and high-performance shared memory.

Key Points: 
  • Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of XPUs, hardware accelerators, and high-performance shared memory.
  • We have already demonstrated LightBundle links at less than 2pJ/bit using our LightBundle technology, says Bardia Pezeshki, founder and CEO of Avicena, and will soon demonstrate sub-1pJ/bit links.
  • Avicena is working with Lumileds, one of the worlds top GaN LED innovators, to rapidly ramp production of highly optimized microLED arrays.
  • A LightBundle interconnect uses hundreds of parallel optical lanes connecting microLED arrays to CMOS-compatible PD arrays over multi-core fiber to create low-cost multi-Tbps interconnects with a 10 meter reach.

Avicena Will Showcase Its Multi-Tbps LED-Based Optical Link for Chip-to-Chip Communication at ECOC 2021

Retrieved on: 
Monday, September 13, 2021
Electronic Design Automation, Semiconductor, Engineering, Technology, Manufacturing, Hardware, the Technology, Avicena, THE TECHNOLOGY, AVICENA

Avicena Tech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundle multi-Tbps LED-based chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2021 in Bordeaux, France ( https://www.ecocexhibition.com/ ).

Key Points: 
  • Avicena Tech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundle multi-Tbps LED-based chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2021 in Bordeaux, France ( https://www.ecocexhibition.com/ ).
  • LightBundle is purpose-built for multi-Tbps chip-to-chip interconnects in distributed computing, processor-to-memory disaggregation, and other advanced computing applications.
  • Because optical interconnects have low attenuation, they have long been the prime contender to replace electrical interconnects for inter-chip communications.
  • At 200 parallel lanes this extrapolates to an aggregate link bandwidth of 2Tbps with a bandwidth density of 10Tbps/mm2.