ITRI Leads Global Semiconductor Collaboration for Heterogeneous Integration to Pioneer Pilot Production Solutions
To assist the industry in grasping the key to high-end semiconductor manufacturing and integration capabilities, the Heterogeneous Integrated Chiplet System Package ( Hi-CHIP ) Alliance brings together leading semiconductor companies from Taiwan and around the world to provide comprehensive services, spanning from packaging design, testing and verification, to pilot production.
- To assist the industry in grasping the key to high-end semiconductor manufacturing and integration capabilities, the Heterogeneous Integrated Chiplet System Package ( Hi-CHIP ) Alliance brings together leading semiconductor companies from Taiwan and around the world to provide comprehensive services, spanning from packaging design, testing and verification, to pilot production.
- Looking forward, the alliance is set to actively explore its global market potential.
- ITRI has been committed to developing manufacturing technologies and upgrading materials and equipment to enhance heterogeneous integration technologies.
- The objective is to nurture international partnerships, fuel technological advancements in equipment and materials, and propel the semiconductor industry to new horizons.