Major U.S. 300mm Chip Manufacturer Places Repeat Order for EAGLEi 300 FOUP Inspection Technology
COOPERSBURG, Pa., Sept. 14, 2023 /PRNewswire/ -- SHELLBACK Semiconductor Technology, a leader in capital equipment solutions to emerging semiconductor markets worldwide, announced today a follow-on EAGLEi 300 FOUP Inspection System order from a global 300mm chip manufacturer.
- COOPERSBURG, Pa., Sept. 14, 2023 /PRNewswire/ -- SHELLBACK Semiconductor Technology, a leader in capital equipment solutions to emerging semiconductor markets worldwide, announced today a follow-on EAGLEi 300 FOUP Inspection System order from a global 300mm chip manufacturer.
- This repeat order from a world-class electronics manufacturer for a 2nd US fab signifies another milestone for EAGLEi as the industry recognized leader in FOUP and carrier inspection technology.
- EAGLEi is recognized by global semiconductor fabs and worldwide carrier manufacturers as the most accurate carrier inspection system available today.
- EAGLEi 200 is available for 2" to 200mm wafer cassette & carrier inspection and EAGLEi 300 for automated 300mm FOUP and FOSB wafer carrier inspection.