FOUP

Major U.S. 300mm Chip Manufacturer Places Repeat Order for EAGLEi 300 FOUP Inspection Technology

Retrieved on: 
Thursday, September 14, 2023

COOPERSBURG, Pa., Sept. 14, 2023 /PRNewswire/ -- SHELLBACK Semiconductor Technology, a leader in capital equipment solutions to emerging semiconductor markets worldwide, announced today a follow-on EAGLEi 300 FOUP Inspection System order from a global 300mm chip manufacturer.

Key Points: 
  • COOPERSBURG, Pa., Sept. 14, 2023 /PRNewswire/ -- SHELLBACK Semiconductor Technology, a leader in capital equipment solutions to emerging semiconductor markets worldwide, announced today a follow-on EAGLEi 300 FOUP Inspection System order from a global 300mm chip manufacturer.
  • This repeat order from a world-class electronics manufacturer for a 2nd US fab signifies another milestone for EAGLEi as the industry recognized leader in FOUP and carrier inspection technology.
  • EAGLEi is recognized by global semiconductor fabs and worldwide carrier manufacturers as the most accurate carrier inspection system available today.
  • EAGLEi 200 is available for 2" to 200mm wafer cassette & carrier inspection and EAGLEi 300 for automated 300mm FOUP and FOSB wafer carrier inspection.

Global FOUPs Market to Achieve Remarkable Growth, Projected at CAGR of 9.51% to Reach $79.54 Million by 2030 - ResearchAndMarkets.com

Retrieved on: 
Monday, September 11, 2023

Among the 'Application' segments, the 25 Pcs Wafer Carrying Capacity segment dominated the market share with over 45% in 2022.

Key Points: 
  • Among the 'Application' segments, the 25 Pcs Wafer Carrying Capacity segment dominated the market share with over 45% in 2022.
  • The FOUPs market spans North America, Europe, Asia Pacific, Middle East & Africa, and South America.
  • The FOUPs market is set to grow at a CAGR of 9.51% from 2023 to 2030.
  • What is the estimated growth rate of the global FOUPs market?

Major U.S. 300mm Chip Manufacturer Selects EAGLEi 300 FOUP Inspection Technology for Leading Edge Production

Retrieved on: 
Thursday, August 17, 2023

COOPERSBURG, Pa., Aug. 17, 2023 /PRNewswire/ -- SHELLBACK Semiconductor Technology, at the forefront of supplying capital equipment solutions to emerging semiconductor markets worldwide, announced today the sale of their popular EAGLEi 300 FOUP Inspection System to a major 300mm chip manufacturer in the US.

Key Points: 
  • COOPERSBURG, Pa., Aug. 17, 2023 /PRNewswire/ -- SHELLBACK Semiconductor Technology, at the forefront of supplying capital equipment solutions to emerging semiconductor markets worldwide, announced today the sale of their popular EAGLEi 300 FOUP Inspection System to a major 300mm chip manufacturer in the US.
  • The sale, to an industry-leading global electronics manufacturer, highlights the increasing demand for EAGLEi's advanced technology to ensure only carriers within tolerance enter production.
  • Well known as the most accurate carrier inspection system available today, EAGLEi is an obvious choice to improve fab yield."
  • EAGLEi 200 is available for 2" to 200mm wafer cassette & carrier inspection and EAGLEi 300 for automated 300mm FOUP and FOSB wafer carrier inspection.

Global FOUP/Cassette Manufacturers Place Multisystem EAGLEi 300 Wafer Carrier Inspection Tool Orders

Retrieved on: 
Wednesday, June 28, 2023

COOPERSBERG, Pa., June 28, 2023 /PRNewswire/ -- SHELLBACK Semiconductor Technology announced the receipt of multiple EAGLEi 300 Wafer Carrier Inspection system orders from several key FOUP & cassette manufacturers around the globe.

Key Points: 
  • COOPERSBERG, Pa., June 28, 2023 /PRNewswire/ -- SHELLBACK Semiconductor Technology announced the receipt of multiple EAGLEi 300 Wafer Carrier Inspection system orders from several key FOUP & cassette manufacturers around the globe.
  • These orders, along with recent EAGLEi 200 & 300 orders for fabs, highlight SHELLBACK's commitment to providing the industry's best carrier inspection systems designed with unparalleled accuracy.
  • EAGLEi is the most accurate carrier inspection system in the market, benefiting from our collaboration with carrier manufacturers and fabs.
  • EAGLEi 200 is available for 2" to 200mm wafer cassette & carrier inspection and EAGLEi 300 for automated 300mm FOUP and FOSB wafer carrier inspection.

Aehr Receives $13.7 Million in Follow-on Orders for FOX WaferPak™ Contactors for Volume Production Burn-in Test and Stabilization of Silicon Carbide MOSFETs for Electric Vehicles

Retrieved on: 
Friday, June 9, 2023

This customer is a leading Fortune 500 supplier of semiconductor devices with a significant customer base in the automotive semiconductor market.

Key Points: 
  • This customer is a leading Fortune 500 supplier of semiconductor devices with a significant customer base in the automotive semiconductor market.
  • These orders for a large number of WaferPaks include both current design capacity increases and several new designs that are expected to ramp to volume production after their customer qualification is completed.
  • As our customers win new designs from their customers, Aehr secures orders for new WaferPak Contactors to fulfill these new wins.
  • Over time, we expect to see our follow-on WaferPak business grow both in absolute dollars and as a percent of our overall revenue.

Entegris Breaks Ground for Manufacturing Center of Excellence in Colorado Springs

Retrieved on: 
Wednesday, June 7, 2023

Entegris, Inc. (NASDAQ: ENTG), a leading supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, today held a groundbreaking ceremony for its new manufacturing center of excellence in Colorado Springs, Colorado.

Key Points: 
  • Entegris, Inc. (NASDAQ: ENTG), a leading supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, today held a groundbreaking ceremony for its new manufacturing center of excellence in Colorado Springs, Colorado.
  • View the full release here: https://www.businesswire.com/news/home/20230607005363/en/
    Entegris to construct new manufacturing center of excellence in Colorado Springs, Colorado (Photo: Entegris)
    At the ceremony, Entegris President and Chief Executive Officer Bertrand Loy noted that the state-of-the-art facility in Colorado Springs will develop products critical to the manufacturing of semiconductors in the United States and around the world.
  • The new leading-edge manufacturing center will serve the semiconductor industry, which is expected to grow to $1 trillion by 2030.
  • “The start of construction of our new world-class facility in Colorado Springs represents an important milestone for Entegris,” Loy said.

Global Load Port Module Market to Expand at a CAGR of 8.1% by 2031| Growth Market Reports

Retrieved on: 
Thursday, June 8, 2023

Moreover, it provides crucial strategies that are helping market players to expand their market share.

Key Points: 
  • Moreover, it provides crucial strategies that are helping market players to expand their market share.
  • For Any Questions on This Report: https://growthmarketreports.com/enquiry-before-buying/5228
    Based on regions, the Load Port Module Market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa.
  • Based on Type, the market is segregated into 300mm load port module and 450mm load port module.
  • Segments - by Type (300mm Load Port Module, 450mm Load Port Module), Application (Small Semiconductor Company, Medium Semiconductor Company, Large Semiconductor Company), and Region (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa) - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast 2023 – 2031"
    Get Full Access to this Report: https://growthmarketreports.com/checkout/5228

Global Load Port Module Market to Expand at a CAGR of 8.1% by 2031| Growth Market Reports

Retrieved on: 
Thursday, June 8, 2023

Moreover, it provides crucial strategies that are helping market players to expand their market share.

Key Points: 
  • Moreover, it provides crucial strategies that are helping market players to expand their market share.
  • For Any Questions on This Report: https://growthmarketreports.com/enquiry-before-buying/5228
    Based on regions, the Load Port Module Market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa.
  • Based on Type, the market is segregated into 300mm load port module and 450mm load port module.
  • Segments - by Type (300mm Load Port Module, 450mm Load Port Module), Application (Small Semiconductor Company, Medium Semiconductor Company, Large Semiconductor Company), and Region (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa) - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast 2023 – 2031"
    Get Full Access to this Report: https://growthmarketreports.com/checkout/5228

FormFactor Introduces High Throughput Panel Metrology and Inspection System for Advanced Packaging

Retrieved on: 
Wednesday, May 31, 2023

LIVERMORE, Calif., May 31, 2023 (GLOBE NEWSWIRE) -- FormFactor, Inc. (NASDAQ:FORM), a leading semiconductor test and measurement supplier, today introduced the FRT MicroProf® PT, a new semiconductor metrology and inspection tool for rectangular panels up to 600mm containing 4-5X more dies compared to a 300mm wafer. With full automation and hybrid metrology capabilities, a single system can perform multiple types of 3D measurements and defect detection on the large format panels, supporting heterogenous integration of chiplets used in advanced package technologies such as fan-out panel-level packaging (FoPLP).

Key Points: 
  • With full automation and hybrid metrology capabilities, a single system can perform multiple types of 3D measurements and defect detection on the large format panels, supporting heterogenous integration of chiplets used in advanced package technologies such as fan-out panel-level packaging (FoPLP).
  • FoPLP and other advanced package techniques stack several semiconductor dies into a single heterogeneous package using connection elements such as microbumps, TSVs (through-silicon vias), and interposers.
  • Fully integrating into factory floor automation with SECS/GEM protocols, the tool can also deliver essential defect inspection data for process control and yield improvement.
  • The MicroProf PT is the latest addition to FormFactor’s Advanced Packaging metrology product family, complementing its established wafer-level packaging product, the MicroProf AP.

Aehr Receives Order for FOX-XP™ System for Production Wafer Level Burn-in of Next Generation Silicon Photonics Integrated Circuits

Retrieved on: 
Tuesday, May 9, 2023

FREMONT, Calif., May 09, 2023 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and production burn-in equipment, today announced it has received the first order for a new high-power configuration of its FOX-XP™ system for production wafer level burn-in of next generation silicon photonics integrated circuits (ICs) from a current major silicon photonics customer.

Key Points: 
  • FREMONT, Calif., May 09, 2023 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and production burn-in equipment, today announced it has received the first order for a new high-power configuration of its FOX-XP™ system for production wafer level burn-in of next generation silicon photonics integrated circuits (ICs) from a current major silicon photonics customer.
  • This FOX-XP multi-wafer test and burn-in system is configured to enable cost-effective production test of the next generation of silicon photonics ICs, which can require up to two to four times as much power for full wafer test, burn-in, and stabilization of the silicon photonics devices.
  • Shipment of this new higher-power configured FOX-XP is scheduled for the first quarter of 2024.
  • The system is also configured to allow direct docking to Aehr’s new fully automated FOX WaferPak Aligner and material handling system.