Plataine & NEPES Sign MoU to Jointly Develop and Market AI-Based Solutions for Semiconductor Manufacturing
TEL AVIV, Israel, April 20, 2023 /PRNewswire-PRWeb/ -- Plataine, a leading provider of advanced software solutions for manufacturing, and NEPES, a leading provider of semiconductor packaging solutions, have announced that they have signed a Memorandum of Understanding (MoU) to jointly develop and market AI-based solutions for the semiconductor manufacturing industry.
- TEL AVIV, Israel, April 20, 2023 /PRNewswire-PRWeb/ -- Plataine, a leading provider of advanced software solutions for manufacturing, and NEPES, a leading provider of semiconductor packaging solutions, have announced that they have signed a Memorandum of Understanding (MoU) to jointly develop and market AI-based solutions for the semiconductor manufacturing industry.
- Based on the MoU, the companies will work together to develop products and software solutions for intelligent automation and optimization for advanced manufacturing in the field of semiconductors.
- The products will combine Plataine's AI and IoT Based Total Production Optimization (TPO) software with NEPES' industry know-how and expertise.
- The Parties will also form a joint venture in the Republic of Korea that will market, distribute, and sell these solutions.