IDTechEx Discusses Advancing Integration in Antenna Packaging Technologies for 5G and 6G
Advancing into the sub-THz range, potentially within the spectrum of 6G, research is underway on new antenna packaging technologies aimed at integrating antennas directly onto RF components.
- Advancing into the sub-THz range, potentially within the spectrum of 6G, research is underway on new antenna packaging technologies aimed at integrating antennas directly onto RF components.
- Deep Dive into Beamforming Technologies Enabled by Phased Array Antenna for 5G mmWave:
Compare beamforming technologies of 5G sub-6 vs mmWave. - Antenna Integration Technologies for 5G mmWave:
Discuss antenna substrate technology, benchmarking, material requirements, and packaging for phased arrays. - Explore various antenna packaging technologies for 5G mmWave, including antenna on PCB and antenna in package (AiP), categorized by packaging technologies: Flip-chip vs fan-out.