Chemence Launches KURA-LOW™ Adhesive Technology Chemistry Platform Driving Paradigm Shift for Consumer Electronic Device Assembly Processes
Performance Materials research scientists are committed to solving next generation bonding challenges for Electronics Device Assembly .
- Performance Materials research scientists are committed to solving next generation bonding challenges for Electronics Device Assembly .
- This corporate commitment to being a solution provider for the industry has led to the development of a new chemistry platform, KURA-LOW™ available in some KRYLEX adhesive formulations manufactured by Chemence, Inc.
- View the full release here: https://www.businesswire.com/news/home/20230918666988/en/
KRYLEX KURA-LOW adhesive technology available in formulations like KD7009. - Existing competitive adhesive systems typically require ‘high’ process temperatures or must be supplied in a two-component format which brings additional limitations to device assembly and reliability.