Ranpak to Showcase Innovations in Automation Solutions and Sustainable Packaging at Upcoming PACK EXPO International
(Ranpak) (NYSE: PACK), a global leader of environmentally sustainable, paper-based packaging solutions for e-commerce and industrial supply chains, today announced its plan to showcase its latest innovations in automation solutions and sustainable packaging to customers, partners and media at PACK EXPO International 2022, taking place from October 23-26 in Chicago.
- (Ranpak) (NYSE: PACK), a global leader of environmentally sustainable, paper-based packaging solutions for e-commerce and industrial supply chains, today announced its plan to showcase its latest innovations in automation solutions and sustainable packaging to customers, partners and media at PACK EXPO International 2022, taking place from October 23-26 in Chicago.
- Ranpaks presence at the EXPO will highlight its strategic investments in innovative automated packaging solutions to help customers lower costs, make logistics easier, and support the global shift to sustainable packaging.
- Ranpak invites PACK EXPO International attendees to visit Booth #22051 in the West Building to experience the companys next-generation automation solutions and learn more about Ranpaks newly launched technology solutions including Void Fill, Cushioning, Wrapping, and Cold Chain.
- We are excited to make our return back to PACK EXPO to showcase our latest innovations in automation solutions and sustainable packaging, said Omar Asali, Chief Executive Officer of Ranpak.