GUC

China Continues to Enhance AI Chip Self-Sufficiency, but High-End AI Chip Development Remains Constrained, Says TrendForce

Retrieved on: 
Monday, December 11, 2023
Telecommunications, Software, Other Manufacturing, Hardware, Artificial Intelligence, Technology, Semiconductor, Manufacturing, Cloud, Entity List, LLM Communications, Acquisition, Research, DRAM, GUC, Acceleration, Commerce, Flash memory, Ecosystem, ASIC, SMIC, TSMC, CPU, NVIDIA, A100, H100, AMD, HPC, Partnership, Table, Ali Baba, EDA, AI, Baidu, HiSilicon, Video game, Huawei

This year, Baidu ordered over a thousand Ascend 910B chips from Huawei to build approximately 200 AI servers.

Key Points: 
  • This year, Baidu ordered over a thousand Ascend 910B chips from Huawei to build approximately 200 AI servers.
  • TrendForce conjectures that the next-generation Ascend 910B chip is likely manufactured using SMIC’s N+2 process.
  • There remains considerable potential for China to improve and establish a complete AI ecosystem.
  • Chinese CSPs like Baidu and Alibaba are actively investing in autonomous AI chip development.

proteanTecs to Showcase the Future of Health and Performance Monitoring at DAC and SEMICON West 2023

Retrieved on: 
Wednesday, July 5, 2023
Technology, Semiconductor, Other Technology, Health Technology, Professional Services, Software, Hardware, Health, Data Analytics, Momentum, Electronics, Convention, PDT, The Office, Multimedia, Human back, Marketing, Future, PDF Solutions, Intel, Center for Advancing Electronics Dresden, Silicon, GUC, DAC, Nightclub, Video game, Microsoft, Cadence

DESIGN AUTOMATION CONFERENCE (DAC) and SEMICON WEST – proteanTecs, a global leader of deep data analytics for advanced electronics, will exhibit and speak at DAC and SEMICON West 2023.

Key Points: 
  • DESIGN AUTOMATION CONFERENCE (DAC) and SEMICON WEST – proteanTecs, a global leader of deep data analytics for advanced electronics, will exhibit and speak at DAC and SEMICON West 2023.
  • Attendees are invited to meet with proteanTecs’ experts at DAC booth #2449 from July 10-12, and SEMICON West booth #1834 from July 11-13.
  • View the full release here: https://www.businesswire.com/news/home/20230705203526/en/
    proteanTecs to showcase the future of health and performance monitoring at DAC and SEMICON West 2023.
  • (Graphic: Business Wire)
    proteanTecs’ DAC and SEMICON West booths will have collaborative demonstrations with partners Advantest, Teradyne, PDF Solutions and Global Unichip Corporation (GUC).

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Retrieved on: 
Wednesday, April 26, 2023
Networks, Semiconductor, Hardware, Electronic Design Automation, Technology, Cadence Design Systems, IP Group, PHY, CDNS, DSP, SerDes, HBM3, NRZ, IP, SOC, Intelligent system, CPU, HPC, TSMC, ADC, AI, GUC, Silicon, GPU, Video game, Medical device, Cadence, PAM4

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC).

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC).
  • The 112G-LR SerDes has been validated in the GUC CoWoS platform, demonstrating excellent performance and robustness in large-scale AI/HPC/networking chip conditions.
  • “The Cadence 112G-LR/ELR PAM4 SerDes IP portfolio has been widely adopted by customers to enable AI, HPC, networking and 5G SoC designs.
  • The 112G-LR SerDes IP is part of the broader Cadence IP portfolio and supports the company’s Intelligent System Design Strategy, enabling SoC design excellence.

proteanTecs to Showcase Interconnect Reliability Monitoring at the Chiplet Summit

Retrieved on: 
Thursday, January 19, 2023
Technology, Hardware, Semiconductor, Ecosystem, Marvell, Socs, Session, Cadence Design Systems, Silicon, Electronics, Consortium, Advanced Electronics Company Limited, GUC, Global Unichip Corporation, Multimedia, Video game, Medical device, Multi-chip module

Held from January 24-26 in San Jose, Chiplet Summit is the only event exclusively dedicated to the skyrocketing chiplet market, which is projected to reach $57 billion in revenue by 2035.

Key Points: 
  • Held from January 24-26 in San Jose, Chiplet Summit is the only event exclusively dedicated to the skyrocketing chiplet market, which is projected to reach $57 billion in revenue by 2035.
  • View the full release here: https://www.businesswire.com/news/home/20230119005856/en/
    proteanTecs to exhibit and present at the inaugural Chiplet Summit.
  • In collaboration with Global Unichip Corporation (GUC), proteanTecs unveiled a case study and silicon results from the use of proteanTecs’ interconnect monitoring solutions in GUC’s high bandwidth interfaces.
  • In proteanTecs’ Chiplet Summit booth (#34), technical experts will showcase the company’s interconnect monitoring solutions for die-to-die interfaces.

GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions

Retrieved on: 
Wednesday, January 18, 2023
Software, Technology, Hardware, Nanoroute, HPC, Cadence Design Systems, CDNS, AI, TSMC, Engineering, GUC, DRC, SOC, CPU, Intelligent system, PPA, Video game console, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Global Unichip Corp. (GUC) successfully delivered an advanced HPC design and a CPU design using Cadence® digital solutions.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Global Unichip Corp. (GUC) successfully delivered an advanced HPC design and a CPU design using Cadence® digital solutions.
  • The HPC design was created using the Cadence Innovus™ Implementation System on TSMC’s advanced N3 process and featured a 3.5 million instance count that reached clock speeds of up to 3.16GHz.
  • The CPU design was created using the AI-enabled Cadence Cerebrus™ Intelligent Chip Explorer and the digital full flow on the TSMC N5 process technology, delivering 8% reduced power and a 9% area improvement while significantly improving engineering productivity.
  • “GUC is a market leader providing advanced chip solutions for AI, HPC, 5G, industrial and other emerging applications,” said Dr. Louis Lin, senior vice president of Design Services at GUC.

PEZY Computing Selects proteanTecs to Monitor Die-to-Die Interconnects in Next-Generation Supercomputer Processors

Retrieved on: 
Tuesday, December 20, 2022
GameChanger, HBM3, GUC, Global Unichip Corporation, PHY, PEZY Computing, Multimedia, HPC, Electronics, D2D, Machine learning

HAIFA, Israel, Dec. 20, 2022 /PRNewswire/ -- proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that PEZY Computing has selected the company's 2.5D interconnect monitoring solution for interface validation, quality assurance and reliability monitoring. PEZY, a Japanese semiconductor manufacturer of advanced supercomputer processors, will use proteanTecs' solution to monitor the die-to-die (D2D) connectivity in their next-generation processors.

Key Points: 
  • PEZY, a Japanese semiconductor manufacturer of advanced supercomputer processors, will use proteanTecs' solution to monitor the die-to-die (D2D) connectivity in their next-generation processors.
  • "proteanTecs' solution enhances processors with unparalleled visibility," said Kei Ishii, VP Processor Engineering at PEZY Computing.
  • "PEZY's revolutionary supercomputer processors are on the leading edge of high performance computing and deliver world-class energy efficiency," said Keith Morton, CRO at proteanTecs.
  • Using proprietary manycore processor technology, PEZY's advanced processors empower supercomputing systems to achieve top computing performance and to deliver world-class energy efficiency.

proteanTecs Hosts Webinar with Yole Group and GUC on Chiplets, Heterogeneous Integration and 2.5D/ 3D Advanced Packaging

Retrieved on: 
Thursday, November 10, 2022
Ecosystem, IC, Communication, Taiwan Stock Exchange, CET, Ministry of Education (Malaysia), Data center, UCT, GUC, Adoption, Technology, Q&A, Electronics, Silicon, Multi-chip module, Module (mathematics), Multimedia, Solution, Machine learning, Hsinchu, HBM3, SOC, Acquisition, D2D, Architecture, Mobile phone, Retail

HAIFA, Israel, Nov. 10, 2022 /PRNewswire/ -- proteanTecs, a global leader of deep data analytics for advanced electronics, announced the company is hosting a webinar with Yole Group and Global Unichip Corporation (GUC) on "The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging." This 40-minute webinar will be held on Wednesday, Nov. 16 at 9 a.m. PST/ 12 p.m. EST/ 6:00 p.m. CET. To attend, register here.

Key Points: 
  • As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore's law, it has created new challenges.
  • This webinar will offer three unique perspectives on this growing ecosystem:
    Stefan Chitoraga, Technology and Market Analyst at Yole Intelligence, part of Yole Group, will present the latest market insights on the adoption of chiplets and heterogeneous integration and will address what is driving advanced packaging toward 2.5D and 3D solutions.
  • Attendees are encouraged to come prepared with questions related to the future of chiplets, heterogeneous integration and 2.5D and 3D packaging.
  • Yole Group also offers due diligence and supports companies through merger-acquisition operations with its division, Yole Finance.

GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring

Retrieved on: 
Wednesday, October 26, 2022
Hsinchu, Taiwan Stock Exchange, Data center, Electronics, HBM, ASIC, Global Unichip Corporation, Machine learning, Solution, IC, UCI, Multimedia, PHY, Multi-chip module, Ministry of Education (Malaysia), Consortium, SOC, Algorithm, Ecosystem, Silicon, CTO, Communication, UCT, GUC, Cryptocurrency, Video game console, Medical device, Mobile phone, D2D

HAIFA, Israel, Oct. 26, 2022 /PRNewswire/ -- proteanTecs, a global leader of deep data analytics for advanced electronics, announced the results of its collaboration with advanced ASIC provider, Global Unichip Corporation (GUC), are shared in a new white paper.

Key Points: 
  • The GUC and proteanTecs collaboration started with the reliability monitoring of high bandwidth memory (HBM) interfaces and has continued with GUC's second generation of its GLinkinterface, known as GLink 2.0.
  • GLink is a high bandwidth die-to-die (D2D) parallel interface that features industry-leading performance, including low latency and power efficiency.proteanTecs' interconnect monitoring solution was integratedinto the GLink test chip to provideGUC enhanced visibility in testing and characterizing the PHY and to enhance the end product with in-field performance and reliability monitoring.
  • "proteanTecs is the only company today offering comprehensive visibility into high bandwidth D2D interfaces," said Igor Elkanovich, CTO at GUC.
  • Based on Universal Chip Telemetry (UCT), the company provides system health and performance monitoring, from production to the field.

SiMa.ai Partners with GUC to Accelerate Time to Market for Industry’s First Purpose-Built Machine Learning Platform for the Embedded Edge

Retrieved on: 
Wednesday, September 7, 2022
Packaging, Semiconductor, Technology, Manufacturing, Other Technology, Software, Artificial Intelligence, Taiwan Stock Exchange, Machine learning, GUC, Senior, Hsin-Chu, Die a Legend, SOC, IC, IP, Global Unichip Corporation, Ministry of Education (Malaysia), 3D printing, Video game console

A critical design partner during the platform development, GUCs physical, package, test design services and manufacturing logistics allowed SiMa.ai to focus on machine learning IP development.

Key Points: 
  • A critical design partner during the platform development, GUCs physical, package, test design services and manufacturing logistics allowed SiMa.ai to focus on machine learning IP development.
  • SiMa.ai is bringing a revolutionary solution to the embedded edge market, said Dr. Louis Lin, Senior Vice President, Design Service, GUC.
  • We look forward to further supporting SiMa.ai as they continue to design innovative products for the embedded edge market.
  • SiMa.ai is a Machine Learning company delivering the industrys first software-centric, purpose-built MLSoC platform.

SiMa.ai Ships First Industry Leading Purpose-built Machine Learning SoC Platform to Customers for Embedded Edge Applications

Retrieved on: 
Tuesday, August 30, 2022
Hardware, Robotics, Technology, Artificial Intelligence, Software, Machine learning, TSMC, Research, Technology, CEO, Die a Legend, GUC, Efficiency, Video game console, Medical device

SiMa.ai , the machine learning company enabling effortless deployment and scaling at the embedded edge, today announced that it has begun shipping the industrys first purpose-built software-centric Machine Learning System-on-Chip platform for the embedded edge - the MLSoC.

Key Points: 
  • SiMa.ai , the machine learning company enabling effortless deployment and scaling at the embedded edge, today announced that it has begun shipping the industrys first purpose-built software-centric Machine Learning System-on-Chip platform for the embedded edge - the MLSoC.
  • The $1 trillion global embedded edge market is currently reliant on legacy technology that limits the pace of innovation.
  • SiMa.ai addresses these shortcomings with its disruptive purpose-built platform which enables Effortless ML deployment and scaling at the edge.
  • The SiMa.ai MLSoC Platform offers an unmatched user experience for customers looking to scale and future-proof without the steep learning curve.