Thermal relief

TE's new thermal bridge solution significantly improves thermal resistance over traditional technologies

Retrieved on: 
Thursday, December 5, 2019
Heat transfer, Thermodynamics, Thermal protection, Companies, Ethernet, Heat conduction, Small form-factor pluggable transceiver, TE Connectivity, Thermal bridge, Mentor Graphics, Thermal relief, Thermal resistance

HARRISBURG, Pa., Dec. 5, 2019 /PRNewswire/ -- TE Connectivity (TE), a world leader in innovative connectivity solutions for high-speed computing and networking applications, is introducing its thermal bridge technology that can provide up to two times better thermal resistance over traditional thermal technologies such as gap pads or thermal pads.

Key Points: 
  • HARRISBURG, Pa., Dec. 5, 2019 /PRNewswire/ -- TE Connectivity (TE), a world leader in innovative connectivity solutions for high-speed computing and networking applications, is introducing its thermal bridge technology that can provide up to two times better thermal resistance over traditional thermal technologies such as gap pads or thermal pads.
  • TE's thermal bridge solution offers superior thermal resistance, better reliability and durability, and allows for easier system serviceability than other comparable products on the market.
  • "TE is a leader in thermal innovation, and our new thermal bridge solution delivers a whole new level of performance with higher durability."
  • TE's thermal bridge solutions are currently available for sample in SFP+, QSFP28 and QSFP-DD form factors.

IDTechEx on Thermal Interface Materials: Markets to Dramatically Transform and Double by 2025?

Retrieved on: 
Monday, December 2, 2019
Thermally conductive pad, Thermal interface material, Thermal relief, Chemistry

IDTechEx has recently studied TIM markets and technologies in detail: " Thermal Interface Materials 2020-2030: Forecasts, Technologies, Opportunities ".

Key Points: 
  • IDTechEx has recently studied TIM markets and technologies in detail: " Thermal Interface Materials 2020-2030: Forecasts, Technologies, Opportunities ".
  • In a typical mobile phone, for example, there are multiple thermal pads connecting the EMI shield lid, which covers multiple ICs, to the framework.
  • Thermal management is a key issue, which underpins efficient performance and is also safety-critical in order to prevent thermal runaway.
  • IDTechEx guides your strategic business decisions through its Research, Consultancy and Event products, helping you profit from emerging technologies.