AOS

Starco Brands Announces Fourth Quarter and Full Year 2023 Results and Business Update

Retrieved on: 
Wednesday, April 3, 2024
Online Retail, Cosmetics, Retail, Consumer, Wine & Spirits, Millennials, Food, Beverage, AOS, Total Wine & More, Sobeys, Depreciation, UNFI, Caramel, Marketing, Powder, Amazon, Partnership, Safeway, Ice, Acquisition, Kroger, Adjustment, AMC, GAAP, Museum, Administration, Soylent, Vanilla, Growth, Production board, Amazon (company), Albertsons, GV (company), NNDB, Video game

Reported net revenue for the fourth quarter of 2023 was $18.9 million, compared to $4.0 million in the fourth quarter of 2022.

Key Points: 
  • Reported net revenue for the fourth quarter of 2023 was $18.9 million, compared to $4.0 million in the fourth quarter of 2022.
  • Compensation expense was $10.6 million in the fourth quarter of 2023, compared to $0.8 million in the fourth quarter of 2022.
  • Professional fees were $1.7 million in the fourth quarter of 2023, compared to $0.8 million in the fourth quarter of 2022.
  • Adjusted EBITDA was approximately $2.1 million for the fourth quarter of 2023, compared to $1.5 million for the fourth quarter of 2022.

Alpha and Omega Semiconductor Announces XSPairFET™ Buck-Boost MOSFET for Higher Power USB PD 3.1 EPR Applications

Retrieved on: 
Tuesday, March 26, 2024
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Other Technology, Telecommunications, Hardware, ICS, EPR, AOS, PD, USB, PCB, MOSFET, Buck–boost transformer, Multimedia, Video game

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced its AONZ66412 XSPairFET™ MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications.

Key Points: 
  • Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced its AONZ66412 XSPairFET™ MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications.
  • The USB PD 3.1 EPR increases the USB-C maximum power up to 240W.
  • These benefits make the AONZ66412 ideal for buck-boost converters in Type-C USB 3.1 EPR applications, including notebook, USB hub, and power bank designs.
  • AONZ66412 has been tested to achieve 97% efficiency @1MHz in typical USB PD 3.1 EPR conditions of 28V input, 17.6V output, and 8A load conditions.

A. O. Smith to Hold First Quarter Conference Call on April 25, 2024

Retrieved on: 
Wednesday, April 3, 2024
A. O. Smith, Conference, Eastern Time Zone, AOS

MILWAUKEE, April 3, 2024 /PRNewswire/ -- A. O. Smith Corporation (NYSE: AOS) will release its first quarter 2024 financial results before the market opens on Thursday, April 25, and has scheduled an investor conference call to follow at 10:00 a.m. (Eastern Time).

Key Points: 
  • MILWAUKEE, April 3, 2024 /PRNewswire/ -- A. O. Smith Corporation (NYSE: AOS) will release its first quarter 2024 financial results before the market opens on Thursday, April 25, and has scheduled an investor conference call to follow at 10:00 a.m. (Eastern Time).
  • The call can be heard live on the company's website, www.aosmith.com .
  • An audio replay of the call will be available on the company's website after the live event.
  • To access the archived audio replay, go to the "Investors" page and select the "First Quarter Conference Call" link.

A. O. Smith Appoints Stephen Shafer President and Chief Operating Officer

Retrieved on: 
Monday, March 18, 2024
3M, A. O. Smith, McKinsey & Company, Growth, AOS, Ford Motor Company, Harvard Business School, MBA, Safety, Automotive industry, Engineering, Management

MILWAUKEE, March 18, 2024 /PRNewswire/ -- Global water technology company A. O. Smith Corporation ("the Company") (NYSE: AOS) announced today the appointment of Stephen Shafer as president and chief operating officer, effective March 18, 2024.

Key Points: 
  • MILWAUKEE, March 18, 2024 /PRNewswire/ -- Global water technology company A. O. Smith Corporation ("the Company") (NYSE: AOS) announced today the appointment of Stephen Shafer as president and chief operating officer, effective March 18, 2024.
  • In this role, Shafer will lead the company's global business units, including operations, engineering and IT.
  • Shafer is an accomplished business leader with deep global experience in manufacturing and leading highly innovative businesses.
  • Shafer earned his MBA from Harvard Business School and his Bachelor of Science degree in Industrial Engineering from Northwestern University.

At APEC 2024, Alpha and Omega Semiconductor to Display and Demo its Industry-Leading Power Management Solutions

Retrieved on: 
Thursday, February 22, 2024
Batteries, Hardware, EV, Electric Vehicles, Automotive, Consumer Electronics, Technology, Semiconductor, Other Technology, MOSFET, DC-DC, Intel, Silicon carbide, Mega, NVIDIA, Socs, AEC, APEC, Swap (finance), AOS, ICS, CPU, PC, Conference, BMS, Solar inverter, Universal, AMD, EMI, BLDC, RC, Kyōto Station, Electronics

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules will showcase its complete line of advanced power management solutions at the Applied Power Electronics Conference (APEC).

Key Points: 
  • Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules will showcase its complete line of advanced power management solutions at the Applied Power Electronics Conference (APEC).
  • The new products are designed to meet key power management challenges in several key application areas and markets AOS focuses on.
  • When paired with AOS’ industry-leading power stages, AOS controllers offer a complete Vcore solution to power next-generation chipset-based SoCs.
  • Motor Drives: AOS introduces a new range of 60V and 100V drivers for power tools, outdoor garden equipment, and e-mobility applications.

Alpha and Omega Semiconductor Announces Application-Specific EZBuck™ Regulator to Power Intel Meteor Lake and Arrow Lake Platforms

Retrieved on: 
Thursday, February 22, 2024
Semiconductor, Other Energy, Apps, Applications, Technology, Other Technology, Energy, Hardware, SCP, OVP, Intel, Multimedia, Silicon, AOS, ICS, Platform, PCB, Telescopic sight

The AOZ22559QI and AOZ22539QI Constant On-Time Buck Converters are offered in a QFN 4 x 4 package, which is the industry’s most compact footprint and is designed to support VCCPRIM_VNNAON rails in Intel Meteor Lake and Arrow Lake platforms.

Key Points: 
  • The AOZ22559QI and AOZ22539QI Constant On-Time Buck Converters are offered in a QFN 4 x 4 package, which is the industry’s most compact footprint and is designed to support VCCPRIM_VNNAON rails in Intel Meteor Lake and Arrow Lake platforms.
  • View the full release here: https://www.businesswire.com/news/home/20240222206409/en/
    AOZ22559QI and AOZ22539QI Constant On-Time Buck Converters Provide Highest Power Density Solution for Intel Meteor Lake and Arrow Lake CPU VCCPRIM_VNNAON Rails (Graphic: Business Wire)
    Intel’s Meteor Lake and Arrow Lake platforms require VCCPRIM_VNNAON rails with high currents, whereas supporting power implementations typically require either a controller with external discrete power FETs or a converter with a large package.
  • The AOZ22559QI and AOZ22539QI include features specifically designed to meet the specifications of the Intel Meteor Lake and Arrow Lake platforms.
  • “The AOZ22559QI and AOZ22539QI offer designers an easy-to-use high-current solution for VCCPRIM_VNNAON rails, providing optimal power support for the Intel Meteor Lake and Arrow Lake platforms.

Alpha and Omega Semiconductor Launches 3-Phase Driver IC, Increasing Battery Life of Cordless Power Tools and E-Mobility

Retrieved on: 
Tuesday, February 20, 2024
Semiconductor, Hardware, Batteries, Consumer Electronics, Technology, MOSFET, PB, Multimedia, Temperature, AOS, ICS, QFN, BOM, BLDC, PCB, Brushless DC electric motor, Electric motor

Available in a compact, 4mm x 4mm QFN-28L package, the highly integrated AOZ32063MQV is a 3-phase driver IC that offers superior driving ability, programmable deadtime, and sleep mode support.

Key Points: 
  • Available in a compact, 4mm x 4mm QFN-28L package, the highly integrated AOZ32063MQV is a 3-phase driver IC that offers superior driving ability, programmable deadtime, and sleep mode support.
  • These capabilities deliver high motor operation efficiency and low standby power consumption that can help greatly increase the battery life of cordless power tools and e-mobility applications.
  • The AOZ32063MQV is also an optimal driver IC solution for 3-phase Brushless DC (BLDC) motor drives.
  • AOS products are offered in packages with Pb-free plating and are compliant with RoHS standards.

Aetheros Delivers Remote SIM Provisioning for AMI 2.0 Rollout

Retrieved on: 
Monday, February 26, 2024
OMA, Name, Electrospray, Aclara Biosciences, LTE, AMI, Multimedia, ESIM, SIM, AOS, Internet of things, Public utility, Linux, OneM2M, Electricity, AT&T, Telecommunications, Mobile phone

SAUSALITO, Calif., Feb. 26, 2024 /PRNewswire/ -- Aetheros, a leading provider of IoT networking software and hardware products, today announced that it has added GSMA Remote SIM Provisioning support to its flagship software product AetherOS (AOS). Utilities customers can now provision their smart grid eSIMs for the fast, reliable and secure AT&T nationwide network.

Key Points: 
  • In North America, AetherOS is available on the Aclara I-210+c and kV2c Gen 5 smart meters.
  • Utilities need secure, reliable and resilient wireless connectivity to deliver new services to customers and connect to their customers' smart meters.
  • With remote SIM provisioning, utility companies have the power of choice and flexibility to deploy AMI 2.0 on public, private or hybrid networks.
  • ­­­­­Aetheros, AetherOS, AOS, Aetheros Edison names, logos and slogans, and all other names, logos and slogans identifying Aetheros' products and services the registered trademarks or service marks of Aetheros Inc. All other names, logos, and slogans belong to their respective owners.

Alpha and Omega Semiconductor Reports Financial Results for the Fiscal Second Quarter of 2024 Ended December 31, 2023

Retrieved on: 
Tuesday, February 6, 2024
Technology, Hardware, Semiconductor, Consumer Electronics, AOS, Government, Lunar New Year, BOM, Calendar, GAAP, AI, Video game

Financial Results for Fiscal Q2 Ended December 31, 2023

Key Points: 
  • Financial Results for Fiscal Q2 Ended December 31, 2023
    Revenue was $165.3 million, a decrease of 8.5% from the prior quarter and a decrease of 12.4% from the same quarter last year.
  • Non-GAAP gross margin was 28.0%, down from 28.8% in the prior quarter and down from 29.5% in the same quarter last year.
  • Non-GAAP operating expenses were $37.9 million, down from $40.8 million from last quarter and up from $32.8 million in the same quarter last year.
  • AOS plans to hold an investor teleconference and live webcast to discuss the financial results for the fiscal second quarter ended December 31, 2023 today, February 6, 2024 at 2:00 p.m. PT / 5:00 p.m.

Alpha and Omega Semiconductor Announces Innovatively Designed Double-Sided Cooling DFN 5x6 Package

Retrieved on: 
Wednesday, January 24, 2024
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Other Technology, Telecommunications, Hardware, AOS, PCB, Temperature, MOSFET, Multimedia, Peter H. Wilson, DFN, FOM, Power, ICS, Printed circuit board

Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.

Key Points: 
  • Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.
  • AOS’ new top and bottom cooling DFN 5x6 package is designed to achieve the highest heat transfer between the exposed top contact and heat sink due to its large surface contact area construction.
  • The top exposed DFN 5x6 package of the AONA66916 shares the same 5mm x 6mm footprint as AOS’ standard DFN 5x6 package, eliminating the need to modify existing PCB layouts.
  • “Cooling the power MOSFET in high power design can be challenging, and AOS has successfully addressed this essential issue with our advanced top exposed package design.