Coherent Accelerator Processor Interface

Kitchen & Associates Rebrands as "Thriven Design"

Retrieved on: 
Wednesday, October 26, 2022
AP, Life, Growth, Housing, Public relations, LEED, Multimedia, Social media, AIA, Environment, Coherent Accelerator Processor Interface, Leadership, Interior design

COLLINGSWOOD, N.J., Oct. 26, 2022 /PRNewswire/ -- Kitchen & Associates (K&A), a leading multidisciplinary design firm, today announced its official rebrand to "Thriven Design." The rebrand exemplifies the organization's continued focus on client service and impact-driven design, and includes the new name, visual brand identity, and state-of-the-art website.

Key Points: 
  • COLLINGSWOOD, N.J., Oct. 26, 2022 /PRNewswire/ -- Kitchen & Associates (K&A), a leading multidisciplinary design firm, today announced its official rebrand to "Thriven Design."
  • Kitchen & Associates (K&A), a leading multidisciplinary design firm, announced its official rebrand to Thriven Design.
  • The new name is a nod to the firm's legacy of creating places where people thrive and its commitment to serving others and enacting positive change.
  • Since its founding by architect and urban planner Benjamin Kitchen, the firm has been a pioneer in socially responsible and environmentally conscious work.

Microchip Introduces New CXL™ Smart Memory Controllers for Data Center Computing Enabling Modern CPUs to Optimize Application Workloads

Retrieved on: 
Tuesday, August 2, 2022
RAS, Maine Learning Technology Initiative, CXL, Trusted Platform Module, CPU, DDR4, Microchip Technology, Cadence, DRAM, Machine learning, Solution, HPC, SMART, Total cost, Ecosystem, Integrated circuit, XMM, Cloud computing, DDR, Central processing unit, Graphics processing unit, Technology, Memory, Samsung, Growth, AI, G, GLOBE, Transfer (computing), Memory module, Innovation, Industry, UCI race classifications, VP, XMMS, Availability, Socs, Family, SMC, SK, Total cost of ownership, DDR5, JEDEC, 2.0, Coherent Accelerator Processor Interface, MCHP, TCO, AMD, Artificial intelligence, Risk, GUI, Adoption, System, Efficiency, SOC, Compute Express Link, Samsung Electronics, Intel, Video game console, Computer data storage, Online shopping, Mobile phone, Lenovo, Ownership, U.S.A, Serviceability

This solution delivers more memory bandwidth per core, more memory capacity per core, and lowers the overall total cost of ownership in the data center by allowing modern CPUs to optimize application workloads.

Key Points: 
  • This solution delivers more memory bandwidth per core, more memory capacity per core, and lowers the overall total cost of ownership in the data center by allowing modern CPUs to optimize application workloads.
  • Typical CXL attached memory modules include 512 GB of memory or more, providing an effective mechanism to increase the memory bandwidth available to processing cores.
  • Microchip is excited to introduce our first CXL-based serial memory controller device to the market, said Pete Hazen, corporate vice president of Microchips Data Center Solutions business unit.
  • Data center application workloads require future memory products that can deliver the same high-performance bandwidth, low latency and reliability of todays parallel-DDR based memory products.

CXL Consortium and OpenCAPI Consortium Sign Letter of Intent to Transfer OpenCAPI Specifications to CXL

Retrieved on: 
Monday, August 1, 2022
GLOBE, Industry, CXL, Coherent Accelerator Processor Interface, OCC, Architecture, Economics, OMI, Memory, Acceleration, Compute Express Link, Video game console, Computer data storage, Bank

To address the need for an open architecture to allow full industry participation, the OpenCAPI Consortium (OCC) was founded in 2016.

Key Points: 
  • To address the need for an open architecture to allow full industry participation, the OpenCAPI Consortium (OCC) was founded in 2016.
  • Continuing this spirit, we announce that OCC and CXL are entering an agreement, which if approved and agreed upon by all parties, would transfer the OpenCAPI and OMI specifications and OpenCAPI Consortium assets to the CXL Consortium.
  • Bob Szabo, OpenCAPI Consortium President
    "We are excited about this opportunity to focus the industry on specifications residing under one organization moving forward.
  • Siamak Tavallaei, CXL Consortium President
    The OpenCAPI Consortium is a not-for-profit organization formed in 2016 and is an open forum to manage the OpenCAPI specifications.

Tritium Welcomes Rob Topol, Former Intel Executive with More Than 20 Years’ Experience, as Next Chief Financial Officer

Retrieved on: 
Wednesday, July 27, 2022
CFO, University, GLOBE, Cloud computing, U.S. Securities and Exchange Commission, Main Street, Behavioural sciences, EV, Electronics, Research, VP, Bachelor, Software, DC, Private Securities Litigation Reform Act, TIA, General manager, NASDAQ, Brigham Young University, Business administration, Master of Business Administration, DCFC, Internet, Technology, Coherent Accelerator Processor Interface, Company, Device, Wireless, Communication, Nasdaq, Telecommunications Industry Association, International, Nextgen, GPU, Growth, Intel, Management, Lithium, Risk management, Tritium

Mr. Topol has extensive experience as an executive at Intel, where he served as a finance leader and business executive for more than 20 years.

Key Points: 
  • Mr. Topol has extensive experience as an executive at Intel, where he served as a finance leader and business executive for more than 20 years.
  • Mr. Topol drove more than $4 billion of savings in capital investment through supply chain optimization, dual source for equipment, and contract manufacturing.
  • He brings a wealth of financial expertise in electronics manufacturing and supply chain, from the highly relevant semiconductor industry.
  • Rob has more than 20 years of senior leadership experience working in a US listed company with a global footprint.

SMART Modular Announces the SMART Kestral PCIe Optane Memory Add-in-Card to Enable Memory Expansion and Acceleration

Retrieved on: 
Thursday, May 19, 2022
Technology, Hardware, Semiconductor, Data Management, Risk, CXL, Engineering, CPU, TB, Machine learning, DDR4, Multimedia, Acceleration, SGH, AIC, Failure, 3D XPoint, Algorithm, Coherent Accelerator Processor Interface, Semantics, SMART, DRAM, DDR, Intel, Artificial intelligence, Kestrel, Video game console, Computer data storage

SMART Modular Technologies, Inc. (SMART) , a division of SGH (Nasdaq: SGH ) and a global leader in memory solutions, solid-state drives, and hybrid storage products announces its new SMART Kestral PCIe Optane Memory Add-in-Card (AIC) which is able to add up to 2TB of Optane Memory expansion on a PCIe-Gen4-x16 or PCIe-Gen3-x16 interface independent of the motherboard CPU.

Key Points: 
  • SMART Modular Technologies, Inc. (SMART) , a division of SGH (Nasdaq: SGH ) and a global leader in memory solutions, solid-state drives, and hybrid storage products announces its new SMART Kestral PCIe Optane Memory Add-in-Card (AIC) which is able to add up to 2TB of Optane Memory expansion on a PCIe-Gen4-x16 or PCIe-Gen3-x16 interface independent of the motherboard CPU.
  • View the full release here: https://www.businesswire.com/news/home/20220518006168/en/
    SMART Modular Technologies' Kestral PCIe Optane Memory Add-in-Card (Photo: Business Wire)
    SMARTs Kestral memory AICs are ideal for hyperscale, data center, and other similar environments that run large memory applications and would benefit from memory acceleration or system acceleration through computational storage.
  • For more information on SMART Kestral Memory AIC, visit the product page and technical brief at smartm.com or contact sales team at [email protected] .
  • *The stylized S and SMART as well as SMART Modular Technologies are trademarks or registered trademarks of SMART Modular Technologies, Inc. All other trademarks and registered trademarks are the properties of their respective owners.

SMART Modular Announces the SMART Kestral PCIe Optane Memory Add-in-Card to Enable Memory Expansion and Acceleration

Retrieved on: 
Tuesday, April 12, 2022
Technology, Semiconductor, Security, Other Technology, Software, Networks, Internet, Hardware, Electronic Design Automation, Data Management, 3D XPoint, Coherent Accelerator Processor Interface, Acceleration, TB, CXL, Engineering, SGH, Semantics, Intel, Failure, SMART, Kestrel, Artificial intelligence, CPU, AIC, Machine learning, Algorithm, DDR4, Multimedia, DDR, Risk, DRAM, Video game console, Computer data storage

SMART Modular Technologies , Inc. (SMART), a division of SGH (Nasdaq: SGH ) and a global leader in memory solutions, solid-state drives, and hybrid storage products, announces its new SMART Kestral PCIe Optane Memory Add-in-Card (AIC), which is able to add up to 2TB of Optane Memory expansion on a PCIe-Gen4-x16 or PCIe-Gen3-x16 interface independent of the motherboard CPU.

Key Points: 
  • SMART Modular Technologies , Inc. (SMART), a division of SGH (Nasdaq: SGH ) and a global leader in memory solutions, solid-state drives, and hybrid storage products, announces its new SMART Kestral PCIe Optane Memory Add-in-Card (AIC), which is able to add up to 2TB of Optane Memory expansion on a PCIe-Gen4-x16 or PCIe-Gen3-x16 interface independent of the motherboard CPU.
  • View the full release here: https://www.businesswire.com/news/home/20220411005983/en/
    SMARTs Kestral memory Add-In Card is ideal for hyperscale, data centers, and other applications that run large memory applications and can benefit from memory acceleration.
  • (Photo: Business Wire)
    SMARTs Kestral memory AICs are ideal for hyperscale, data center, and other similar environments that run large memory applications, and would benefit from memory acceleration or system acceleration through computational storage.
  • For more information on SMART Kestral Memory AIC, visit the product page and technical brief at smartm.com or contact sales team at [email protected] .

Bemis Associates Announces Major Investment in Novoloop

Retrieved on: 
Tuesday, February 15, 2022
Creativity, Plastic, Carbon footprint, Adhesive, MA, Electronics, Carbon, Solution, TPU, Technology, Coherent Accelerator Processor Interface, Partnership, Longevity, Polyethylene, Renewable energy, Recycling

Bemis's investment in Novoloop is part of Novoloop's Series A financing.

Key Points: 
  • Bemis's investment in Novoloop is part of Novoloop's Series A financing.
  • Bemis's investment in Novoloop is part of Novoloop's Series A financing .
  • Novoloop has been a pioneer in the chemical transformation of plastic waste into high-performance chemicals and materials since 2015.
  • For more than 110 years, Bemis has collaborated with the world's leading brands to design, create and construct cool stuff.

RYU Apparel Sets Date for US Launch of Inaugural Catalogue Business

Retrieved on: 
Thursday, October 28, 2021
Universe, The Wall Street Journal, TSX Venture Exchange, Nordstrom, Tokyo Olympics, Harvard Business Review, OTCQB, NFL, Social media, COVID-19, Growth, Multimedia, FWB, News, Coherent Accelerator Processor Interface, Demand, Theodore Levitt, Retail

VANCOUVER, BC, Oct. 28, 2021 /PRNewswire/ - RYU Apparel Inc. (TSXV: RYU) (OTCQB: RYPPF) (FWB: RYAA) ("RYU" or the "Company"), acreator of award-winning urban athletic apparel, is pleased to announce the launch of its first-ever catalogue on November 8th 2021.

Key Points: 
  • VANCOUVER, BC, Oct. 28, 2021 /PRNewswire/ - RYU Apparel Inc. (TSXV: RYU) (OTCQB: RYPPF) (FWB: RYAA) ("RYU" or the "Company"), acreator of award-winning urban athletic apparel, is pleased to announce the launch of its first-ever catalogue on November 8th 2021.
  • To deliver on its next milestone, RYU has partnered with Premier Direct-to-Consumer Marketing Agency, CohereOne, to launch a nationwide direct marketing catalogue business.
  • Now, as a complement to its omni channel ecosystem, the integration of a catalogue business aims to drive new customer exposure while optimizing the existing customer experience.
  • According to the Harvard Business Review , catalogues are making a comeback, and consumer response rates have increased by 170%.

YADRO Joins the Open Invention Network Community

Retrieved on: 
Tuesday, October 26, 2021
IDC, OpenPOWER Foundation, Architecture, OSS, Industry, Open Invention Network, PCI-SIG, History, Google, NEC, Coherent Accelerator Processor Interface, Freedom, Patent, Marketing, OIN, Sony, CEO, Linux Foundation, Philips, Progeny Linux Systems, RISC-V, Solution, R, GLOBE, SUSE, IBM, Philosophy

DURHAM, N.C., Oct. 26, 2021 (GLOBE NEWSWIRE) -- Open Invention Network (OIN), the organization formed to safeguard open source software (OSS) and the largest patent non-aggression community in history, announced today that YADRO has joined as a community member.

Key Points: 
  • DURHAM, N.C., Oct. 26, 2021 (GLOBE NEWSWIRE) -- Open Invention Network (OIN), the organization formed to safeguard open source software (OSS) and the largest patent non-aggression community in history, announced today that YADRO has joined as a community member.
  • OSS is essential to modern on-premises, hybrid and cloud-based environments, said Keith Bergelt, CEO of Open Invention Network.
  • Open Invention Network (OIN) is the largest patent non-aggression community in history and supports freedom of action in Linux as a key element of open source software (OSS).
  • The OIN patent license and member cross-licenses are available royalty-free to any party that joins the OIN community.

Intel Editorial: Intel Advances Architecture for Data Center, HPC-AI and Client Computing

Retrieved on: 
Thursday, August 19, 2021
Semiconductor, Data Management, Technology, Other Technology, Software, Hardware, IDM, Architecture, Cypress Cove Family Aquatic Park, Life, SEC, Coherent Accelerator Processor Interface, Efficiency, Central processing unit, Intelligence, Alchemy, Intel, FPGA, DG2, XMX, Mount Evans, Software, Memory, Thread, Apple–Intel architecture, Heart, Newsroom, Xe, DirectX, CSPS, Skylake, Technology, Industry, Graphics processing unit, SOC, GPU, Silicon, AMX, Data-rate units, Nasdaq, Semiconductor, Name, Diversified Global Graphics Group, Machine learning, Ipu, CPU, FLOPS, OneAPI, HPG, Artificial intelligence, IPU, XESS-AM, INTC, Credit, Editorial, Multimedia, TFLOPS, Video game console, Computer data storage

View the full release here: https://www.businesswire.com/news/home/20210819005219/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20210819005219/en/
    Raja Koduri, Intel senior vice president and general manager of the Accelerated Computing Systems and Graphics Group, displays a wafer with Intel Arc high-performance discrete graphics hardware as part of a presentation during Intel Architecture Day 2021.
  • Alder Lake: Reinventing the multicore architecture, Alder Lake will be Intels first performance hybrid architecture with the new Intel Thread Director.
  • With an Intel IPU-based architecture, cloud service providers (CSPs) can maximize data center revenue by offloading infrastructure tasks from CPUs to IPUs.
  • Intel, the Intel logo and other Intel marks are trademarks of Intel Corporation or its subsidiaries.