Thermally conductive pad

Global Thermal Interface Materials Market for 5G (2021 to 2026) - Featuring Laird Technologies, Henkel and Panasonic Among Others - ResearchAndMarkets.com

Retrieved on: 
Thursday, April 8, 2021
Technology, Other Manufacturing, Manufacturing, Telecommunications, Science and technology, Technology, Mobile telecommunications, Materials, Internet of things, 5G, Technology forecasting, Heat transfer, Thermal interface material, Graphite, Thermally conductive pad

The "Global Thermal Interface Materials Market for 5G: Focus on Various Kinds of Thermal Interface Materials (Thermal Pads, Gels, Greases, Phase Change Materials, Taps, Graphite Sheets, and Gap Fillers) and Their Application Segments (2021-2026)" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Thermal Interface Materials Market for 5G: Focus on Various Kinds of Thermal Interface Materials (Thermal Pads, Gels, Greases, Phase Change Materials, Taps, Graphite Sheets, and Gap Fillers) and Their Application Segments (2021-2026)" report has been added to ResearchAndMarkets.com's offering.
  • The global thermal interface materials market for 5G accounted for $434.5 million in terms of value in 2020 and is expected to reach $908.9 million by 2026.
  • The report constitutes an in-depth study of the global thermal interface materials market for 5G, including a thorough analysis of the market across different applications.
  • Countries Focusing on Roll-Out of 5G Technology, Emphasizing on Growth of 5G Deployments
    Key Questions Answered in this Report:
    What are the underlying structures resulting in the emerging trends within the global thermal interface materials market for 5G market?

ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage

Retrieved on: 
Monday, March 29, 2021
Computer storage devices, Computer data storage, Computer buses, Passive fire protection, Non-volatile memory, Solid-state drive, NVM Express, Thermally conductive pad, Thermal management, U.2, Heat sink, Low-density parity-check code

The customizable ATP Thermal Management Solution includes copper foil and fin-type heatsink options for N600Si / N600Sc M.2 2280 modules with up to 3.84 TB and controller thermal pad for N600Si U.2 SSDs with up to 8 TB capacities.

Key Points: 
  • The customizable ATP Thermal Management Solution includes copper foil and fin-type heatsink options for N600Si / N600Sc M.2 2280 modules with up to 3.84 TB and controller thermal pad for N600Si U.2 SSDs with up to 8 TB capacities.
  • Both come with advanced Power Loss Protection (PLP), Low Density Parity Check (LDPC) ECC algorithm, RAID engine support, and end-to-end data path protection.
  • Most SSDs are equipped with a thermal throttling mechanism, which cools the device by reducing the clock speed when a certain temperature is reached.
  • By combining both hardware and firmware solutions, ATP NVMe SSDs with the customizable Thermal Management Solution delivers higher sustained write performance compared with standard thermal throttling, which causes performance to drop drastically.

Remark Holdings' Family of AI Thermal Solutions Helping to Reopen Global Businesses

Retrieved on: 
Thursday, April 30, 2020
Articles, Technology, Emerging technologies, Artificial intelligence, Computational neuroscience, Cybernetics, Thermally conductive pad, Mentor Graphics, Academic disciplines

LAS VEGAS, April 30, 2020 /PRNewswire/ --Remark Holdings, Inc. (NASDAQ: MARK ), a diversified global technology company with leading artificial intelligence ("AI") solutions and digital media properties, today announced that it began shipping and deploying products from its family of AI thermal solutions, including Thermal Kits, Thermal Pads, and Thermal Helmets, in the United States and Japan.

Key Points: 
  • LAS VEGAS, April 30, 2020 /PRNewswire/ --Remark Holdings, Inc. (NASDAQ: MARK ), a diversified global technology company with leading artificial intelligence ("AI") solutions and digital media properties, today announced that it began shipping and deploying products from its family of AI thermal solutions, including Thermal Kits, Thermal Pads, and Thermal Helmets, in the United States and Japan.
  • "We designed our family of thermal detection products to meet the specific needs of our customers," added Mr. Tao.
  • Thermal Helmets and Thermal Kiosks are proven solutions for use at large live entertainment events including sport stadiums and music concerts venues.
  • Remark Holdings, Inc. (NASDAQ: MARK ) delivers an integrated suite of AI solutions that enable businesses and organizations to solve problems, reduce risk and deliver positive outcomes.

Thermal Interface Materials Market Size Worth $3.33 Billion By 2025: Grand View Research, Inc.

Retrieved on: 
Wednesday, February 19, 2020
Heat transfer, Materials science, Thermal interface material, Mentor Graphics, Thermally conductive pad, Chemistry, Physics

SAN FRANCISCO, Feb. 19, 2020 /PRNewswire/ -- The global thermal interface materials market size is expected to reach USD 3.33 billion by 2025, as per a new report by Grand View Research Inc., registering a CAGR of 10.8% over the forecast period.

Key Points: 
  • SAN FRANCISCO, Feb. 19, 2020 /PRNewswire/ -- The global thermal interface materials market size is expected to reach USD 3.33 billion by 2025, as per a new report by Grand View Research Inc., registering a CAGR of 10.8% over the forecast period.
  • Increase in the investments towards the development of advanced thermal interface materials is expected to benefit the market growth.
  • However, rising awareness among consumers over the use of synthetically derived thermal interface materials such as thermal pads and phase change materials is projected to propel the market growth.
  • Grand View Research has segmented the global thermal interface materials market on the basis of product, application, and regions:
    Thermal Interface Materials Product Outlook (Revenue, USD Million; 2014 - 2025)

Thermal Interface Materials Market Size Worth $3.33 Billion By 2025: Grand View Research, Inc.

Retrieved on: 
Wednesday, February 19, 2020
Heat transfer, Materials science, Thermal interface material, Mentor Graphics, Thermally conductive pad, Chemistry, Physics

SAN FRANCISCO, Feb. 19, 2020 /PRNewswire/ -- The global thermal interface materials market size is expected to reach USD 3.33 billion by 2025, as per a new report by Grand View Research Inc., registering a CAGR of 10.8% over the forecast period.

Key Points: 
  • SAN FRANCISCO, Feb. 19, 2020 /PRNewswire/ -- The global thermal interface materials market size is expected to reach USD 3.33 billion by 2025, as per a new report by Grand View Research Inc., registering a CAGR of 10.8% over the forecast period.
  • Increase in the investments towards the development of advanced thermal interface materials is expected to benefit the market growth.
  • However, rising awareness among consumers over the use of synthetically derived thermal interface materials such as thermal pads and phase change materials is projected to propel the market growth.
  • Grand View Research has segmented the global thermal interface materials market on the basis of product, application, and regions:
    Thermal Interface Materials Product Outlook (Revenue, USD Million; 2014 - 2025)

IDTechEx on Thermal Interface Materials: Markets to Dramatically Transform and Double by 2025?

Retrieved on: 
Monday, December 2, 2019
Thermally conductive pad, Thermal interface material, Thermal relief, Chemistry

IDTechEx has recently studied TIM markets and technologies in detail: " Thermal Interface Materials 2020-2030: Forecasts, Technologies, Opportunities ".

Key Points: 
  • IDTechEx has recently studied TIM markets and technologies in detail: " Thermal Interface Materials 2020-2030: Forecasts, Technologies, Opportunities ".
  • In a typical mobile phone, for example, there are multiple thermal pads connecting the EMI shield lid, which covers multiple ICs, to the framework.
  • Thermal management is a key issue, which underpins efficient performance and is also safety-critical in order to prevent thermal runaway.
  • IDTechEx guides your strategic business decisions through its Research, Consultancy and Event products, helping you profit from emerging technologies.

Global Thermal Management Market Forecast to 2024: Rising Demand for Effective Thermal Management Solutions & Systems in Consumer Electronics

Retrieved on: 
Wednesday, August 7, 2019
Physical sciences, Chemistry, Passive fire protection, Natural sciences, Electronic design, Thermal management, Mentor Graphics, Thermally conductive pad, Lithium, Laptop

The Thermal Management Market is Expected to Grow from USD 11.1 Billion in 2019 to USD 16.2 Billion by 2024, at a CAGR of 8.0%

Key Points: 
  • The Thermal Management Market is Expected to Grow from USD 11.1 Billion in 2019 to USD 16.2 Billion by 2024, at a CAGR of 8.0%
    Major factors driving the thermal management market include the rising demand for effective thermal management solutions & systems in consumer electronics, increasing use of electronic devices in different end-use industries, and ongoing radical miniaturization of electronic devices.
  • Nonadhesive materials such as thermal pads, gap fillers, and grease are used widely in consumer electronics such as computers, laptops, and other handheld devices such as tablets.
  • Elastomeric pads were developed as an alternative to grease-based solutions used earlier for thermal management.
  • Moreover, increasing demand for effective thermal management solutions and systems from consumer electronics, automotive, defense, and healthcare sectors is also fueling the growth of the thermal management market in APAC.