Fan-out

Saras Micro Devices Appoints Industry Leader Ron Huemoeller to CEO

Retrieved on: 
Monday, January 9, 2023
Corporation, University, Small Business Saturday, Amkor Technology, Chang Rong Si Bridge, Fan-out, SMD, Applied Materials, Augsburg University, IEEE Electronics Packaging Society, Seymour Cray, Technology strategy, Flip chip, TMV, UTS Vicki Sara Building, IMAPS, University of Phoenix, Life, TSV, Printed circuit board, Management, Chemistry

ATLANTA, Jan. 09, 2023 (GLOBE NEWSWIRE) -- The Board of Directors of Saras Micro Devices (SMD), a provider of advanced power delivery solutions for high-performance semiconductor devices, is pleased to announce the appointment of Ron Huemoeller as Chief Executive Officer effective January 9, 2023.

Key Points: 
  • ATLANTA, Jan. 09, 2023 (GLOBE NEWSWIRE) -- The Board of Directors of Saras Micro Devices (SMD), a provider of advanced power delivery solutions for high-performance semiconductor devices, is pleased to announce the appointment of Ron Huemoeller as Chief Executive Officer effective January 9, 2023.
  • Huemoeller will assume responsibility for providing leadership, strategy, and technical direction to the talented SMD team in Atlanta, GA; Chandler, AZ; and Cupertino, CA.
  • Huemoeller’s more than 25 years of senior/executive management experience in semiconductor packaging and technology will enable him to position Saras for both short- and long-term success.
  • “It is a great pleasure to welcome Ron as the new CEO of Saras, to help define and bring SMD’s vision to life,” said Rama Alapati, SMD Executive Chairman.

Fastly Acquires Fanout to Unlock Real-Time App Development at the Edge

Retrieved on: 
Wednesday, March 30, 2022
Networks, Internet, Data Management, Technology, Software, Pinterest, Organization, FSLY, API, GitHub, Growth, NYSE, Super Mario, Computing, CEO, Software, WebSocket, Friction, Time, The New York Times, Internet, Engineering, Acquisition, Video game console, Public relations, Fastly, Fan-out

The integration of Fanout technology into Fastlys powerful network will help enable real-time app development at the edge with increased time-to-market, reduced friction, and unprecedented scale.

Key Points: 
  • The integration of Fanout technology into Fastlys powerful network will help enable real-time app development at the edge with increased time-to-market, reduced friction, and unprecedented scale.
  • Fanouts value to the Fastly platform is its revolutionary ability to:
    Deliver real-time development that is transport agnostic.
  • Fanout makes this happen without constraints on the number of connected clients and with true 1-to-many message fan-out.
  • For more information, check out Fastlys latest blog post, Fastly + Fanout: why real-time messaging and edge computing are an amazing combination .

Worldwide Fan-out Wafer Level Packaging Industry to 2024 - Increased Demand for Compactly Designed Electronics is Driving Growth - ResearchAndMarkets.com

Retrieved on: 
Friday, October 2, 2020
Technology, Semiconductor, Semiconductor device fabrication, Technology, Articles, Science and technology, Electronics manufacturing, Wafer-level packaging, Emerging technologies, Wafer, SEMI, Internet of things, Fan-out, ASE Group

The fan-out wafer level packaging market is poised to grow by $ 1.94 billion during 2020-2024 progressing at a CAGR of 16% during the forecast period.

Key Points: 
  • The fan-out wafer level packaging market is poised to grow by $ 1.94 billion during 2020-2024 progressing at a CAGR of 16% during the forecast period.
  • The report on the fan-out wafer level packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
  • The fan-out wafer level packaging market analysis includes technology segment an d geographic landscapes.
  • This study identifies the growing use of semiconductor ICs in IoT as one of the prime reasons driving the fan-out wafer level packaging market growth during the next few years.

Nepes Is Now Supplying a Highly Reliable Fan-Out Package to a Leading Wireless Chip Maker

Retrieved on: 
Thursday, January 16, 2020
Engineering, Semiconductor, Consumer electronics, Technology, Manufacturing, Mobile, Wireless, Hardware, Semiconductor device fabrication, Engineering, Technology, Inventions, Packaging, Semiconductor devices, Integrated circuit, Reliability, Fan-out, Packaging and labeling, CHiPs

Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, announces that it has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker.

Key Points: 
  • Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, announces that it has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker.
  • Fan-Out manufacturing is stabilized for mass production of the advanced package line recently acquired from Deca Technologies.
  • "High Reliability Fan-out Package," supplied by nepes, is a high-tech solution with more than 2 times BLR (Board Level Reliability) performance versus standard fan-out technologies by reducing physical stress on chips through sidewall protection structures.
  • Currently, only two companies, nepes included, can mass-produce this advanced package solution.

Differential Clock Buffers from Diodes Incorporated Meet Demand for Higher Design Margin in Terabit Communications

Retrieved on: 
Wednesday, June 26, 2019
Semiconductor, Technology, Telecommunications, Networks, Hardware, Logic gates, Clock signal, Fan-out, Digital electronics, Electronic engineering, Electronics, Electronic design, Radio electronics

Diodes Incorporated (Nasdaq: DIOD) today announced the PI6C59xxxxx series of differential clock buffers.

Key Points: 
  • Diodes Incorporated (Nasdaq: DIOD) today announced the PI6C59xxxxx series of differential clock buffers.
  • The PI6C59xxxxx series of differential clock buffers provides better signal margin while expanding the drive capability of all clock and data signals used in high-speed communications.
  • It covers a wide number of speeds and technologies, as well as combinations of input and output configurations.
  • The devices in the PI6C59xxxxx series have been designed to increase the fanout of clock sources and improve clock and/or data distribution in communication applications operating between 1.5GHz and 6GHz.