IDTechEx Discusses AiP Market Dynamics: Drivers and Challenges in 5G and 6G
BOSTON, April 3, 2024 /PRNewswire/ -- Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.
- More discussion regarding AiP technology can be found in IDTechEx's report, " Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets ".
- Overview of AiP for 5G and 6G market and challenges:
The AiP market is directly linked with the 5G mmWave and future 6G markets, as AiP is expected to be utilized in all 5G mmWave-based stations and 5G-enabled electronics like smartphones. - IDTechEx's market report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", delves into AiP technologies for 5G mmWave and 6G, focusing on various substrate types and packaging methods.
- 10-year granular market forecast of:
To find out more about the IDTechEx report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", please visit www.IDTechEx.com/AiP .