Technologies

Leading Edge Equipment Technologies Completes $7.6 Million Series A Financing to Commercialize Revolutionary Semiconductor Manufacturing Technology

Retrieved on: 
Tuesday, October 27, 2020

Leading Edge Equipment Technologies, the maker of revolutionary silicon wafer manufacturing equipment for solar panels, announced today the closing of $7.6 million in Series A financing led by Prime Impact Fund .

Key Points: 
  • Leading Edge Equipment Technologies, the maker of revolutionary silicon wafer manufacturing equipment for solar panels, announced today the closing of $7.6 million in Series A financing led by Prime Impact Fund .
  • Were excited to work with Rick, Alison, Nathan, and the rest of the team to quickly commercialize this manufacturing technology.
  • Leading Edge empowers solar panel manufacturers with a new drop-in manufacturing technology that produces kerfless, single-crystal silicon wafers.
  • Leading Edge Equipment Technologies has developed a revolutionary crystal growth manufacturing technology that creates kerfless, single-crystal silicon wafers for solar panels.

1366 Technologies Showcases Modules Featuring 3D Direct Wafer® Products

Retrieved on: 
Wednesday, June 5, 2019

Today at the SNEC 2019 PV Power Expo, silicon wafer manufacturer 1366 Technologies Inc. (1366 Technologies or 1366) unveiled the first modules to feature the companys 3D wafers or thin wafers with thick borders.

Key Points: 
  • Today at the SNEC 2019 PV Power Expo, silicon wafer manufacturer 1366 Technologies Inc. (1366 Technologies or 1366) unveiled the first modules to feature the companys 3D wafers or thin wafers with thick borders.
  • View the full release here: https://www.businesswire.com/news/home/20190605005514/en/
    1366s high-performance, ultra-low-cost Direct Wafer products provide the base material for this Q CELLS Q.ANTUM DUO module.
  • (Photo: Business Wire)
    With an expected power rating of approximately 360 watts, these modules use 1366s high-performance, ultra-low-cost 3D Direct Wafer products as their base material.
  • Earlier this year, in response to the rapid wafer price decline, 1366 made a strategic decision to accelerate the timeline for the 3D wafer feature.