Santa Clara Convention Center

Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley

Retrieved on: 
Wednesday, March 20, 2024

SUNNYVALE, Calif., March 20, 2024 /PRNewswire/ -- Today Synopsys, Inc. (Nasdaq: SNPS) kicked off its annual flagship Synopsys User Group (SNUG) conference in Silicon Valley at the Santa Clara Convention Center with a keynote presentation by Synopsys president and CEO Sassine Ghazi. Ghazi discussed the unprecedented innovation opportunities and challenges that technology R&D teams face in this era of pervasive intelligence. He also announced new EDA and IP solutions aimed at maximizing the capabilities of the global technology engineering teams, from silicon to systems, that Synopsys serves.

Key Points: 
  • (Nasdaq: SNPS ) kicked off its annual flagship Synopsys User Group (SNUG) conference in Silicon Valley at the Santa Clara Convention Center with a keynote presentation by Synopsys president and CEO Sassine Ghazi.
  • He also announced new EDA and IP solutions aimed at maximizing the capabilities of the global technology engineering teams, from silicon to systems, that Synopsys serves.
  • The company plans to discuss its growing design IP business during this afternoon's investor meeting, which is co-located with SNUG Silicon Valley.
  • Happening March 20 and 21 in Santa Clara, Calif., SNUG Silicon Valley gathers the global Synopsys design community to discuss technology advancements, challenges, strategic collaborations, and business opportunities.

AI and Big Data Expo North America announces leading Speaker Lineup

Retrieved on: 
Thursday, March 7, 2024

AI and Big Data Expo North America announces new speakers!

Key Points: 
  • AI and Big Data Expo North America announces new speakers!
  • SANTA CLARA, CA, Mar 7, 2024 - (ACN Newswire) - The AI and Big Expo North America, the leading event for Enterprise AI, Machine Learning, Security, Ethical AI, Deep Learning, Data Ecosystems, and NLP, has announced a fresh cohort of distinguished speakers for its upcoming conference at the Santa Clara Convention Center on June 5-6, 2024.
  • In addition to the speakers, the AI and Big Data Expo North America will feature a series of presentations covering a diverse range of topics in AI and Big Data exploring the latest innovations, implementations and strategies across a range of industries.
  • Save up to $300 on your ticket and be part of the conversation shaping the future of AI and Big Data technologies.For more information and to secure your place at AI and Big Data Expo North America, please visit https://www.ai-expo.net/northamerica/.

Synopsys' Annual User Group Conference (SNUG) and Investor Day Kicks Off on March 20

Retrieved on: 
Monday, February 26, 2024

SUNNYVALE, Calif., Feb. 26, 2024 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) is hosting its annual flagship user group conference, SNUG Silicon Valley, March 20-21, 2024, at the Santa Clara Convention Center. The company's Investor Day will be co-located on the afternoon of March 20 and available via webcast.

Key Points: 
  • The company's Investor Day will be co-located on the afternoon of March 20 and available via webcast.
  • Synopsys to hold 2024 Investor Day: Synopsys will host a meeting with the investor community to review its financial objectives and long-term growth strategies on March 20, 2024.
  • WHERE: The Investor Day meeting will be held in hybrid format, in person at the Santa Clara Convention Center and online as a simultaneous webcast.
  • Investors and other interested parties may register for the webcast by visiting the events section on Synopsys' investor website .

Adeia Demonstrates Hybrid Bonding Technology During Chiplet Summit 2024

Retrieved on: 
Tuesday, February 6, 2024

SANTA CLARA, Calif., Feb. 06, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), the company whose patented innovations enhance billions of devices, today announced that it is showcasing its hybrid bonding technology at the Chiplet Summit on February 6 through 8, 2024, at the Santa Clara Convention Center.

Key Points: 
  • SANTA CLARA, Calif., Feb. 06, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), the company whose patented innovations enhance billions of devices, today announced that it is showcasing its hybrid bonding technology at the Chiplet Summit on February 6 through 8, 2024, at the Santa Clara Convention Center.
  • With an extensive and growing portfolio of intellectual property covering hybrid bonding, advanced process nodes and advanced packaging technologies, Adeia licenses and partners with leading semiconductor companies worldwide.
  • Adeia’s hybrid bonding technology is increasingly being adopted in sensors, memory chips and logic devices, enhancing performance and functionality while reducing size and cost,” added Laura Mirkarimi, senior vice president, engineering at Adeia.
  • To find demonstrations and presentations by Adeia during the Chiplet Summit, visit:
    Adeia Booth #317 – The Adeia team will showcase the latest innovations in hybrid bonding technology.

Credo Technology Group to Exhibit at Chiplet Summit 2024

Retrieved on: 
Tuesday, February 6, 2024

Credo Technology Group Holding Ltd (“Credo”) (Nasdaq: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver improved power efficiency as data rates and corresponding bandwidth requirements increase throughout the data infrastructure market, will be exhibiting in booth 316 at the Chiplet Summit Conference and Exhibition taking place February 6-8, at the Santa Clara Convention Center.

Key Points: 
  • Credo Technology Group Holding Ltd (“Credo”) (Nasdaq: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver improved power efficiency as data rates and corresponding bandwidth requirements increase throughout the data infrastructure market, will be exhibiting in booth 316 at the Chiplet Summit Conference and Exhibition taking place February 6-8, at the Santa Clara Convention Center.
  • The summit is an excellent platform for Credo representatives to discuss the company’s comprehensive family of chiplet and intellectual property (IP) solutions with the chiplet ecosystem.
  • Attendees are encouraged to visit booth 316 to receive briefings on all Credo’s chiplet offerings including the recent portfolio expansion of the 112G PAM4 SerDes IP family in the latest process technology.
  • Credo invites all Chiplet Summit attendees to visit booth 316 and attend our panel to learn more.

Sarcina Technology Demonstrates Packaging Capabilities at Chiplet Summit

Retrieved on: 
Tuesday, February 6, 2024

PALO ALTO, Calif., Feb. 6, 2024 /PRNewswire/ -- Sarcina Technology, a leading Application Specific Advanced Packaging (ASAP) Service, will roll out its WIPO service at Chiplet Summit. The company will be in Booth#410. Chiplet Summit runs February 6 through 8 at the Santa Clara Convention Center.

Key Points: 
  • PALO ALTO, Calif., Feb. 6, 2024 /PRNewswire/ -- Sarcina Technology, a leading Application Specific Advanced Packaging (ASAP) Service, will roll out its WIPO service at Chiplet Summit.
  • Chiplet Summit runs February 6 through 8 at the Santa Clara Convention Center.
  • WIPO stands for wafer-in, product-out and it eliminates the exorbitant costs of maintaining a hardware team for packaging, testing, and production.
  • The Chiplet Summit is being held February 6-8 at the Santa Clara Convention Center and covers the latest architectures, development platforms and methods, and applications.

FMS24 Call For Presentations Now Open

Retrieved on: 
Monday, February 5, 2024

SANTA CLARA, Calif., Feb. 5, 2024 /PRNewswire/ -- FMS: the Future of Memory and Storage, taking place August 6-8, 2024 at the Santa Clara Convention Center in California, has opened its call for presentations and panels. FMS: the Future of Memory and Storage, formerly Flash Memory Summit, has rebranded to include all storage technologies and applications. The premier global event for memory and storage, FMS24 will encompass the most important innovations in solid-state memory and storage technologies, architectures, and applications. Primary presentation categories at FMS24 now number 24, with numerous sub-categories covering a broad scope of technology topics. Opportunities to present include automotive, cold data, computational storage, CXL, design automation, aerospace to outer space data, and UCIe/chiplets topics.

Key Points: 
  • FMS: the Future of Memory and Storage, formerly Flash Memory Summit, has rebranded to include all storage technologies and applications.
  • The premier global event for memory and storage, FMS24 will encompass the most important innovations in solid-state memory and storage technologies, architectures, and applications.
  • Primary presentation categories at FMS24 now number 24, with numerous sub-categories covering a broad scope of technology topics.
  • "FMS24 is expanding to cover a broad spectrum of storage applications, both including and beyond flash memory," said Willie Nelson, FMS24 Program Chair.

Yole Group’s Latest Market Research Returns to Chiplet Summit

Retrieved on: 
Wednesday, January 31, 2024

Chiplet Summit announces Yole Group is returning as its market research partner for its second annual event.

Key Points: 
  • Chiplet Summit announces Yole Group is returning as its market research partner for its second annual event.
  • Yole Group will analyze the chiplet market and cover both short and long-term trends.
  • Analysts Tom Hackenberg and Ying-Wu Liu will present a “Market Research Update” in the leadoff plenary on “Chiplets: Where We Are Today”.
  • “Current market research is vital for chiplet designers,” said Chuck Sobey, Summit General Chair.

Alphawave Semi and Teledyne LeCroy Unveil PCIeⓇ 7.0 Signal Generation and Measurement

Retrieved on: 
Wednesday, January 31, 2024

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity for the world’s technology infrastructure, and Teledyne LeCroy , the worldwide leader in protocol test and measurement solutions, today announced the unveiling of PCI ExpressⓇ 7.0 signal generation, transmission, and measurement collaboration at DesignCon in Santa Clara, CA.

Key Points: 
  • Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity for the world’s technology infrastructure, and Teledyne LeCroy , the worldwide leader in protocol test and measurement solutions, today announced the unveiling of PCI ExpressⓇ 7.0 signal generation, transmission, and measurement collaboration at DesignCon in Santa Clara, CA.
  • View the full release here: https://www.businesswire.com/news/home/20240131077044/en/
    This launch is the culmination of Alphawave Semi and Teledyne LeCroy’s collaborative efforts, with results that push the boundaries of signal transmission and measurement technologies.
  • These results accelerate the deployment of PCIeⓇ 7.0 technology for data-intensive artificial intelligence (AI) workloads for hyperscaler and data infrastructure applications.
  • The technical presentation will showcase Alphawave Semi’s Input/Output Buffer Information Specification algorithmic modeling interface (IBIS-AMI).

Astera Labs Unveils PCI Express Cable Solutions that Accelerate Cloud and AI Infrastructure Deployments at Scale

Retrieved on: 
Tuesday, January 30, 2024

Astera Labs, the global leader in semiconductor-based connectivity solutions for cloud and AI infrastructure, today announced the sampling of its Aries PCIe® and CXL® Smart Cable Modules™ (SCM) which provide robust and long reach copper cabling connectivity for GPUs, CPUs, and memory in disaggregated cloud and AI infrastructure.

Key Points: 
  • Astera Labs, the global leader in semiconductor-based connectivity solutions for cloud and AI infrastructure, today announced the sampling of its Aries PCIe® and CXL® Smart Cable Modules™ (SCM) which provide robust and long reach copper cabling connectivity for GPUs, CPUs, and memory in disaggregated cloud and AI infrastructure.
  • Thad Omura, Chief Business Officer, Astera Labs, said, “Active PCIe/CXL cables have emerged as a critical connectivity solution for multi-rack GPU clusters and low-latency memory fabrics for AI infrastructure that has physically out-grown a single rack enclosure.
  • Astera Labs’ full portfolio of Aries SCMs will also include an Active Optical Cable (AOC) solution in the future.
  • Schedule to meet with Astera Labs experts and learn how its PCIe, Ethernet, and CXL solutions are enabling critical connectivity for cloud and AI infrastructure.