Mems

Windfall Bio Raises $28 Million Series A to Scale Methane Capture & Transformation Solution

Retrieved on: 
Monday, April 8, 2024
Technology, Manufacturing, Oil, Gas, Energy, Transport, Other Natural Resources, Environment, Other Technology, Sustainability, Agriculture, Natural Resources, Other Manufacturing, Logistics, Supply Chain Management, Climate Change, Tetra, Windfall, Health, Attention, Methane, Waste management, Tetra Laval, Mems, Nitrogen, Central Waqf Council, Sale, Climate, Carbon, Breakthrough Energy, Whole Foods Market, Atmosphere, Traction, Soil, Natural gas

Supporting its commercial pipeline, the new capital will enable Windfall to expand pilot deployments across methane intensive industries including agriculture, oil and gas, and waste management.

Key Points: 
  • Supporting its commercial pipeline, the new capital will enable Windfall to expand pilot deployments across methane intensive industries including agriculture, oil and gas, and waste management.
  • Windfall will also invest resources to continue building out its team, manufacturing capacity and supply chain to meet growing global customer demand for methane mitigation solutions.
  • Uniquely, Windfall’s approach can rapidly scale globally across large industries to meaningfully reduce methane emissions,” said Mark Cupta, Managing Director at Prelude Ventures.
  • The Series A funding brings the company’s total fundraising amount to $37 million and further validates the need and promise for its methane mitigation solution across multiple industries.

Global Wafer Cleaning Equipment Industry Report 2024-2029 with Analyst Recommendations for Key Stakeholder - Offer Customizable and Flexible Wafer Cleaning Solutions and Diversify Market Presence

Retrieved on: 
Wednesday, March 13, 2024
Logic, Mems, SCREEN Holdings, Growth, Sport, Environment, Health, Porter's five forces analysis, Memory, SWOT, Wafer, Sensor, Olympic Games, FPD, Lam Research, Tokyo Electron, Telecommunications, Machine learning, USD, CIS, Silicon

The Global Wafer Cleaning Equipment market showcased growth at a CAGR of 6.13% during 2019-2022.

Key Points: 
  • The Global Wafer Cleaning Equipment market showcased growth at a CAGR of 6.13% during 2019-2022.
  • The report analyses the Wafer Cleaning Equipment Market By Equipment Type (Single Wafer Spray System, Single Wafer Cryogenic System, Batch Spray Cleaning System, Batch Immersion Cleaning System, Scrubber)
    The report analyses the Wafer Cleaning Equipment Market By Wafer Size (
  • The report analyses the Wafer Cleaning Equipment Market By Application (Mems, Memory, CIS (CMOS Image Sensor), Logic, Other Applications).
  • Also, the attractiveness of the market has been presented by region, By Equipment Type, by Wafer Size & by Application.

Windfall Bio’s Methane-to-Value Solution Named to Fast Company’s Third Annual List of the Next Big Things in Tech

Retrieved on: 
Tuesday, November 28, 2023
Technology, Other Natural Resources, Transport, Agriculture, Other Technology, Natural Resources, Software, Networks, Logistics, Supply Chain Management, Internet, Hardware, Atmosphere, Food, Farmer, Nutrient, Mems, Methane, Soil, Nitrogen, Organization, Fertilizer

Windfall Bio’s methane-to-value solution was honored as a winner in the Food and Agriculture category.

Key Points: 
  • Windfall Bio’s methane-to-value solution was honored as a winner in the Food and Agriculture category.
  • Windfall’s solution captures and transforms climate-harming methane into a valuable agricultural asset.
  • We are thrilled to honor the organizations that are making them a reality.”
    Click here to see the final list.
  • The Winter 2023/2024 issue of Fast Company is available online now and will hit newsstands on December 5.

Global 3D TSV Devices Strategic Market Report 2023-2030: Ongoing Proliferation of Cloud-Based Applications to Encourage Adoption of 3D TSV Devices

Retrieved on: 
Monday, October 9, 2023
Cloud, COVID-19, Information Communications Technology education in the Philippines, MEMS, Real, Communication, Developed country, Comparison, DRAM, Osat, Transformation, ASE Group, Development, Defense, Broadcom Inc., TSV, Growth, Disruption, IO, Consumer electronics, Information and communications technology, Amkor Technology, Mems, VS, Access, Memory, Total cost, Industrial internet of things, IDMS, Information, Tablet, Electronic, Global Investment in American Jobs Act of 2013, Mobile phone, Pet industry, Video game, Cryptocurrency, Semiconductor, Geography, Electronics

DUBLIN, Oct. 9, 2023 /PRNewswire/ -- The "3D TSV Devices - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Oct. 9, 2023 /PRNewswire/ -- The "3D TSV Devices - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering.
  • The global market for 3D TSV Devices estimated at US$5.9 Billion in the year 2022, is projected to reach a revised size of US$27.7 Billion by 2030, growing at a CAGR of 21.3% over the analysis period 2022-2030.
  • Memory, one of the segments analyzed in the report, is projected to record 20.7% CAGR and reach US$8 Billion by the end of the analysis period.
  • The 3D TSV Devices market in the U.S. is estimated at US$954.3 Million in the year 2022.

Global 3D TSV Devices Market to Reach $12.7 Billion by 2026

Retrieved on: 
Tuesday, March 1, 2022
Cloud computing, Intel, ICT, Intelligence, COVID-19, Joint, Forecasting, Mems, Solution, Research, Information, TSMC, Growth, NCP, LAB, Silicon, Electronics, Adoption, SAN, CAGR, Information and communications technology, Broadcom Inc., Car, SIP, Players, TSV, GIA, United Microelectronics Corporation, MEMS, Information Communications Technology education in the Philippines, ICS, Computer, Internet, CIS, CSPS, Consumer electronics, Geography, Memory, Marketing, Technology, Copper, Video game, Asia-Pacific, Others

SAN FRANCISCO, March 1, 2022 /PRNewswire/ --A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D TSV Devices - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, March 1, 2022 /PRNewswire/ --A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D TSV Devices - Global Market Trajectory & Analytics" .
  • Amid the COVID-19 crisis, the global market for 3D TSV Devices estimated at US$5.9 Billion in the year 2022, is projected to reach a revised size of US$12.7 Billion by 2026, growing at a CAGR of 20.5% over the analysis period.
  • This segment currently accounts for a 22.2% share of the global 3D TSV Devices market.
  • The U.S. Market is Estimated at $954.2 Million in 2022, While China is Forecast to Reach $3.4 Billion by 2026
    The 3D TSV Devices market in the U.S. is estimated at US$954.2 Million in the year 2022.

Global 3D TSV Devices Market Report 2021-2026 - COVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor Leaders Secure New Lease of Life

Retrieved on: 
Tuesday, November 9, 2021
ICS, Computer, Adoption, Copper, SIP, Joint, CAGR, Information Communications Technology education in the Philippines, Technology, CSPS, Growth, Car, ICT, LAB, TSV, Mems, Electronics, Information, Cloud computing, NCP, Silicon, Pet, 3D printing, Printed circuit board, Video game console

DUBLIN, Nov. 9, 2021 /PRNewswire/ -- The "3D TSV Devices - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Nov. 9, 2021 /PRNewswire/ -- The "3D TSV Devices - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.
  • This segment currently accounts for a 22.2% share of the global 3D TSV Devices market.
  • Three-Dimensional (3D) Through-Silicon-Via (TSV) technology is steadily gaining image as the highly-advanced semiconductor packaging model that dramatically improves chip performance and functionality.
  • In Latin America, the 3D TSV market is gaining from the rising demand for various electronic products.

Global 3D TSV Devices Market Report 2021: Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of Value Chain Modularity - ResearchAndMarkets.com

Retrieved on: 
Monday, November 8, 2021
Technology, Hardware, Semiconductor, ICS, Computer, Adoption, Copper, SIP, Joint, CAGR, Information Communications Technology education in the Philippines, Technology, CSPS, Growth, Car, ICT, LAB, TSV, Mems, Electronics, Information, Cloud computing, NCP, Silicon, Pet, 3D printing, Printed circuit board, Video game console

The "3D TSV Devices - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "3D TSV Devices - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.
  • This segment currently accounts for a 22.2% share of the global 3D TSV Devices market.
  • Three-Dimensional (3D) Through-Silicon-Via (TSV) technology is steadily gaining image as the highly-advanced semiconductor packaging model that dramatically improves chip performance and functionality.
  • In Latin America, the 3D TSV market is gaining from the rising demand for various electronic products.

Global 3D TSV Devices Market to Reach $12.7 Billion by 2026

Retrieved on: 
Tuesday, August 17, 2021
Mems, LAB, United Microelectronics Corporation, Research, Broadcom Inc., Cloud computing, Intelligence, Players, Intel, CAGR, Forecasting, ICS, MEMS, NCP, Consumer electronics, Internet, CSPS, Technology, Adoption, Silicon, Memory, Information, Growth, Electronics, Copper, SAN, Computer, TSV, Information and communications technology, SIP, GIA, ICT, Joint, Geography, Marketing, Car, TSMC, Information Communications Technology education in the Philippines, COVID-19, Video game, Pet

SAN FRANCISCO, Aug. 17, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D TSV Devices - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, Aug. 17, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D TSV Devices - Global Market Trajectory & Analytics" .
  • Amid the COVID-19 crisis, the global market for 3D TSV Devices estimated at US$4.2 Billion in the year 2020, is projected to reach a revised size of US$12.7 Billion by 2026, growing at a CAGR of 20.5% over the analysis period.
  • This segment currently accounts for a 22.2% share of the global 3D TSV Devices market.
  • The U.S. Market is Estimated at $808.8 Million in 2021, While China is Forecast to Reach $3.4 Billion by 2026
    The 3D TSV Devices market in the U.S. is estimated at US$808.8 Million in the year 2021.

SiTime MEMS Timing Solution to Support Raytheon’s Precision Guidance System

Retrieved on: 
Tuesday, June 8, 2021
Aerospace, Hardware, Manufacturing, Technology, Software, Engineering, Academic disciplines, Articles, Microelectromechanical system oscillator, Oscillators, Microtechnology, Microelectromechanical systems, Mems, Reliability engineering, Precision-guided munition

SiTime Corporation (NASDAQ: SITM), a market leader in MEMS timing, today announced that Raytheon Technologies, an aerospace and defense company, has chosen the SiTime Endura MEMS oscillators for their precision guidance systems.

Key Points: 
  • SiTime Corporation (NASDAQ: SITM), a market leader in MEMS timing, today announced that Raytheon Technologies, an aerospace and defense company, has chosen the SiTime Endura MEMS oscillators for their precision guidance systems.
  • Advanced precision guidance systems operate in extreme temperatures and are exposed to high levels of g-forces, shock, and vibration.
  • Unique SiTime MEMS technology delivers unmatched reliability for timing devices that operate in the presence of extreme mechanical stressors.
  • The SiTime family of Endura MEMS TCXOs provides an extremely stable timing source in harsh conditions, one that allows systems to perform better.

Zebra Analytix Receives NIH Grant for Rapid Breath Detection of Hazardous Substance Exposure

Retrieved on: 
Tuesday, March 16, 2021
Small Business Administration, Small Business Innovation Research, Mems, National Institutes of Health, Articles

FAYETTEVILLE, Ark., March 16, 2021 /PRNewswire-PRWeb/ --Zebra Analytix, Inc.a VIC Technology Venture Development portfolio companyannounced today that it has been awarded a National Institutes of Health (NIH) Small Business Innovation Research (SBIR) grant to apply its revolutionary miniaturized analytical technology to monitoring breath for indicators of exposure to hazardous substances.

Key Points: 
  • FAYETTEVILLE, Ark., March 16, 2021 /PRNewswire-PRWeb/ --Zebra Analytix, Inc.a VIC Technology Venture Development portfolio companyannounced today that it has been awarded a National Institutes of Health (NIH) Small Business Innovation Research (SBIR) grant to apply its revolutionary miniaturized analytical technology to monitoring breath for indicators of exposure to hazardous substances.
  • The modular configuration of the Zebra technology facilitates unlimited versatility via interchangeable pre-concentrators, separation columns and detectors, permitting the end-user to fine-tune the system for their specific needs.
  • This research is supported by the National Institute of Environment Health Sciences of the National Institutes of Health under Award Number 1R43ES032752-01 titled "Micro Breath Biomarker Analyzer."
  • Zebra Analytix was established to develop and commercialize miniature gas chromatography (GC) systems based on microelectromechanical systems (MEMS) innovation.