StratEdge High-performance Semiconductor Packages to be on Display at IMS2021, June 8-9, in Booth 1014
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Monday, June 7, 2021
StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).
Key Points:
- StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).
- These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and down-hole.
- Also join StratEdge for the Industry Talk series taking place on Monday, June 21, in the IMS virtual environment.
- StratEdge offers post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices.