Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging
TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.
- TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.
- The center will combine state-of-the-art advanced-packaging technology, equipment, processes, materials, expertise and training, fostering the development of new capabilities from proof of concept to pilot scale.
- In collaboration with Deca, ASU is committed to establishing onshore access to these advanced-packaging capabilities.
- The Gen 2 M-Series including Adaptive Patterning technology brings unprecedented scaling to higher densities for heterogeneous integration and chiplet applications.