OIF

OIF Thought Leaders to Provide Updates on Co-Packaging, 400ZR, Electrical Data Rates and Transport SDN Projects at Global Conferences

Retrieved on: 
Monday, June 7, 2021
VoIP, Software, Mobile, Wireless, Networks, Internet, Hardware, Data management, Technology, Semiconductor, Security, Other Technology, Telecommunications, Fiber-optic communications, Telecommunications, Ethernet, OIF, Technology, Ciena, Computer networking, Optical Internetworking Forum, Digital electronics

Our members continue the path forward by sharing their expertise and OIF project updates at three global conferences this month, said Ian Betty, OIF Board President, Ciena.

Key Points: 
  • Our members continue the path forward by sharing their expertise and OIF project updates at three global conferences this month, said Ian Betty, OIF Board President, Ciena.
  • Electrical Data Rates Keep Pushing Forward: An OIF Update
    A panel of industry experts and OIF members will provide an update on OIFs CEI-112G and CEI-224G development work, including discussion and debate of 224G modulations.
  • This OFC-sponsored panel of industry experts will discuss the need for co-packaged optics (CPO) inside the data center.
  • OIF has been studying the co-packaging of ASICs with optical and electrical transceivers within its Co-Packaging Framework Project.

OIF Launches Co-Packaging Framework Implementation Agreement Project

Retrieved on: 
Tuesday, November 10, 2020
Mobile, Wireless, Technology, Semiconductor, Telecommunications, Software, Networks, Internet, Hardware, Electronic design automation, Data management, Computing, Fiber-optic communications, Interoperability, Product testing, Telecommunications engineering, OIF, Application-specific integrated circuit, Computer engineering, Electrical engineering, Optical Internetworking Forum

OIF , the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the start of the Co-Packaging Framework Implementation Agreement (IA) umbrella project.

Key Points: 
  • OIF , the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the start of the Co-Packaging Framework Implementation Agreement (IA) umbrella project.
  • The new project start approval took place during last weeks Q420 Technical and MA&E Committee meetings held virtually November 2-6, 2020.
  • The Co-Packaging Framework IA will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs.
  • With its member-driven focus, OIF is the ideal forum to facilitate industry conversation and drive interoperability of co-packaging with ASICs.

OIF to Lead “Co-Packaged Optics – Why, What and How” Live Webinar Event; Industry Experts to Provide Perspectives on Co-Packaged Optics Challenges and Opportunities

Retrieved on: 
Monday, September 21, 2020
Data management, Technology, Semiconductor, Other Technology, Telecommunications, Software, Networks, Internet, VoIP, Hardware, Electronic design automation, Articles, Telecommunications, Educational technology, Teleconferencing, Web conferencing, Companies, LightWave 3D, Cisco Systems, Optics, OIF

The free 2.5 hour webinar, hosted by OIF and Lightwave, will feature talks and discussion from industry-leading experts from: Cisco, Facebook, Intel, Juniper Networks, Microsoft, Ranovus, Senko Advanced Components and TE Connectivity.

Key Points: 
  • The free 2.5 hour webinar, hosted by OIF and Lightwave, will feature talks and discussion from industry-leading experts from: Cisco, Facebook, Intel, Juniper Networks, Microsoft, Ranovus, Senko Advanced Components and TE Connectivity.
  • This public OIF webinar presents a unique opportunity for industry and OIF members to explore and discuss key drivers as well as the important constraints (electrical, thermal, optical, etc.)
  • so we can be aligned on the solutions needed to move co-packaged optics interoperability forward.
  • Webinar presenters will review key drivers for co-packaged optics as well as the conventional alternatives and highlight applications where co-packaged optics can deliver unique benefits.

OIF Announces Participants in 2020 Joint Network Operator, Multi-vendor Transport SDN API Interoperability Demonstration

Retrieved on: 
Tuesday, June 16, 2020
Data management, Technology, Transport, Other Technology, Networks, Internet, Other Transport, Digital technology, Computing, Technology, Application programming interface, Technical communication, Interoperability, Web API, Software-defined networking, the 2020 OIF Transport SDN Application Programming Interface (API) Interoperability Demonstration, OIF

Leading the acceleration of the commercialization of transport SDN worldwide and transport network transformation for the 5G era, OIF today announced plans for its 2020 Transport SDN Application Programming Interface (API) interoperability demonstration.

Key Points: 
  • Leading the acceleration of the commercialization of transport SDN worldwide and transport network transformation for the 5G era, OIF today announced plans for its 2020 Transport SDN Application Programming Interface (API) interoperability demonstration.
  • Established open Transport SDN APIs can help network operators:
    The multi-vendor interoperability demonstration includes participating vendors ADVA, Ciena, Cisco Systems, Infinera and Nokia.
  • OIFs facilitation of this thorough test of specifications and interoperability of open transport SDN APIs will highlight the tools necessary to create an open manageable, flexible network.
  • The 2020 Transport SDN Application Programming Interface (API) interoperability demonstration builds on OIFs previous transport API requirements and interoperability demonstrations which substantiated T-API as the northbound interface (NBI) of choice, establishing a foundation for open, programmable networks that allow network operators to efficiently deliver dynamic multi-domain connectivity services to the market.

OIF Announces 224 Gbps Project Preview, Election Results, Upcoming Webinars and Integrated Packet Optical SDN Implementation Agreement at Q2 Virtual Meeting

Retrieved on: 
Thursday, June 4, 2020
Technology, Semiconductor, Telecommunications, Software, Networks, Internet, Hardware, Electronic design automation, Data management, OIF, Fiber-optic communications, Network protocols, Ethernet, Optical Internetworking Forum

OIF s Q2 2020 Technical and MA&E Committees Meeting, held virtually May 11-15, resulted in a preview of a proposed 224 Gbps project, election results, upcoming webinar announcements and the release of the Integrated Packet Optical SDN Implementation Agreement (IA).

Key Points: 
  • OIF s Q2 2020 Technical and MA&E Committees Meeting, held virtually May 11-15, resulted in a preview of a proposed 224 Gbps project, election results, upcoming webinar announcements and the release of the Integrated Packet Optical SDN Implementation Agreement (IA).
  • In its continued efforts to meet industry needs, OIF previewed a proposed project start to address data rates around 224 Gbps.
  • OIFs Integrated Packet Optical SDN IA brings meaningful use cases, architecture and technical requirements for cooperation between IP and Optical layers via SDN, said Junjie Li, China Telecom and OIF Network Operator Working Group Chair.
  • Operators look to OIF as a place to address industry gaps and achieve maximum benefit for their optical networks.

OIF Thought Leaders Offer CEI-112G Project Update at DesignCon 2020

Retrieved on: 
Tuesday, January 14, 2020
Electronic design automation, Data management, Semiconductor, Technology, Other Technology, Internet, Hardware, Fiber-optic communications, Broadcom Corporation, OIF, Ethernet, Network protocols, Computer networking, Computing, Digital technology, Optical Internetworking Forum, Digital electronics

Panel speakers include: Nathan Tracy of TE Connectivity and OIF President; Cathy Liu of Broadcom Inc. and OIF Board Member; Steve Sekel of Keysight Technologies and OIF Physical and Link Layer Interoperability Working Group Chair; Ed Frlan of Semtech and OIF Technical Committee Chair; Gary Nicholl of Cisco and OIF Board Member and Mike Li of Intel Corporation and OIF Board Member.

Key Points: 
  • Panel speakers include: Nathan Tracy of TE Connectivity and OIF President; Cathy Liu of Broadcom Inc. and OIF Board Member; Steve Sekel of Keysight Technologies and OIF Physical and Link Layer Interoperability Working Group Chair; Ed Frlan of Semtech and OIF Technical Committee Chair; Gary Nicholl of Cisco and OIF Board Member and Mike Li of Intel Corporation and OIF Board Member.
  • Electrical interfaces at 112 Gbps are critical for faster, more efficient and cost-effective networks and data centers, said Tracy.
  • This panel discussion will provide the opportunity for an engaging industry debate on the issues surrounding OIFs CEI-112G projects and the architectures they will enable.
  • OIF is where the optical networking industrys interoperability work gets done.

OIF’s Optical Masterclass Series at NGON to Include Updates on 400ZR, Common Electrical I/O, Flex Ethernet & SDN Projects

Retrieved on: 
Wednesday, May 8, 2019
Technology, Data management, Hardware, Internet, Networks, Software, Telecommunications, Semiconductor, Mobile, Wireless, Manufacturing, Engineering, Fiber-optic communications, Ethernet, Telecommunications, Optical Internetworking Forum, FlexE, Computer networking, Technology, Digital electronics, Optical module, Common Electrical I/O, Optical networking, OIF

At NGON , May 21-23, 2019, OIF experts will kick off the Optical Masterclass Series with a comprehensive update on its 400ZR, Common Electrical I/O (CEI)-112, Flex Ethernet (FlexE) and Software Defined Networking (SDN) projects.

Key Points: 
  • At NGON , May 21-23, 2019, OIF experts will kick off the Optical Masterclass Series with a comprehensive update on its 400ZR, Common Electrical I/O (CEI)-112, Flex Ethernet (FlexE) and Software Defined Networking (SDN) projects.
  • The Optical Masterclass Series The Optical Internetworking Forum session is being held Tuesday, May 21, 2019 from 08:00 - 10:00.
  • Brown and Karl Gass, OIF Physical & Link Layer Working Group Vice Chair, Optical, will discuss how OIF is assuring interoperability in open, agile, next-generation optical networks and provide updates on crucial industry projects.
  • OIFs 400ZR project is critical in facilitating the reduction of cost and complexity for high bandwidth data center interconnects and promoting interoperability among optical module manufacturers.

OIF Marks 20 Years of Leadership in Optical Network Interoperability; Launches New Logo

Retrieved on: 
Tuesday, February 26, 2019
Technology, Data management, Electronic design automation, Internet, Networks, Software, Telecommunications, Fiber-optic communications, Computing, Optical Internetworking Forum, Technology, OIF, Interoperability, Network protocols

For more information on OIFs work in these areas, visit the Hot Topics section of the website here .

Key Points: 
  • For more information on OIFs work in these areas, visit the Hot Topics section of the website here .
  • The benefits of OIF are immeasurable but obvious OIF interoperability work improves network efficiency and performance, expands markets and sets the stage to enable new capabilities based on open, disaggregated networks, said Jimmy Yu, vice president, DellOro Group.
  • In recognition of 20 years of accomplishments and continued market impact, OIF refreshed its logo to reflect its timeless, no-nonsense, authoritative role in the industry.
  • Optical Internetworking Forum (OIF) is where the optical networking industrys interoperability work gets done.

OIF Members to Demonstrate Interoperability of Industry’s Hottest Technologies at OFC 2019

Retrieved on: 
Wednesday, February 20, 2019
Technology, Hardware, Internet, Networks, Software, Telecommunications, Other Technology, Fiber-optic communications, Telecommunications, Digital technology, Computing, Optical Internetworking Forum, FlexE, Common Electrical I/O, Interoperability, Optical networking, OIF, Ciena

Demonstrating how interoperability works get done, 13 OIF member companies will participate in live interoperability demos of the industrys hottest technologies 400ZR, Common Electrical I/O (CEI)-112G and Flex Ethernet (FlexE) at OFC 2019 in San Diego, March 5-7, 2019.

Key Points: 
  • Demonstrating how interoperability works get done, 13 OIF member companies will participate in live interoperability demos of the industrys hottest technologies 400ZR, Common Electrical I/O (CEI)-112G and Flex Ethernet (FlexE) at OFC 2019 in San Diego, March 5-7, 2019.
  • 400ZR, CEI-112G and FlexE are critical technologies in our industry so its no surprise these are the interoperability specifications our members are most focused on for OFC, said Steve Sekel of Keysight and OIFs Physical and Link Layer Interoperability Working Group Chair.
  • The live demos will demonstrate critical insight into how key technologies interoperate within the industrys ecosystem.
  • Speakers include: Victor Lopez, Telefnica gCTIO; Lyndon Ong, OIF MA&E Co-Chair - Networking, Ciena and Jonathan Sadler, OIF Networking Interoperability WG Chair, Infinera
    Optical Internetworking Forum (OIF) is where the optical networking industrys interoperability work gets done.