OIF

Kandou Secures 2022 Supply Chain Capacity for USB4 Retimer Chips

Retrieved on: 
Thursday, January 20, 2022
Â, Efficiency, Technology, JEDEC, Innovation, OIF, Kantou, Cyprus, Life, GLOBE, PCB, Renewable energy, Video game console

LAUSANNE, Switzerland, Jan. 20, 2022 (GLOBE NEWSWIRE) -- Kandou today announced it has secured foundry capacity and backend IC packaging and testing services to meet all 2022 customer requirements for its Matterhorn USB-C multiprotocol retimer with USB4 support.

Key Points: 
  • LAUSANNE, Switzerland, Jan. 20, 2022 (GLOBE NEWSWIRE) -- Kandou today announced it has secured foundry capacity and backend IC packaging and testing services to meet all 2022 customer requirements for its Matterhorn USB-C multiprotocol retimer with USB4 support.
  • "We correctly anticipated strong demand for Matterhorn more than a year ago, notes Frank Lavety, Kandous general manager.
  • By engaging with our tier 1 supply chain early, we worked hard to secure capacity commitments needed to support our customers volume requirements through 2022.
  • The Matterhorn family of USB-C multiprotocol retimer solutions supports USB4, USB3.2, DisplayPort and Thunderbolt for host and device applications.

OIF to Present “Co-Packaging Standardization Progress” Webinar to Provide Updates on Overcoming Implementation Challenges to Enable Interoperability

Retrieved on: 
Tuesday, January 11, 2022
Software, Mobile, Wireless, Networks, Internet, Professional Services, Hardware, Data Management, Technology, Other Professional Services, Human Resources, Other Technology, Telecommunications, LightWave 3D, LinkedIn, Intel, PLL, Cisco Systems, Industry, Physical, TE Connectivity, Marketing, Introduction, Sumitomo Electric Industries, OIF, Education Committee, Risk management

OIF continues to drive discussion and work toward industry interoperability through an upcoming webinar, Co-Packaging Standardization Progress, being held on Wednesday, February 2, 2022, at 7:00am PST/9:00am CST/10:00am EST/3:00pm GMT.

Key Points: 
  • OIF continues to drive discussion and work toward industry interoperability through an upcoming webinar, Co-Packaging Standardization Progress, being held on Wednesday, February 2, 2022, at 7:00am PST/9:00am CST/10:00am EST/3:00pm GMT.
  • The free event, hosted by Lightwave, will feature presentations and discussions with industry-leading experts from global organizations: Cisco, Intel, Ranovus, Sumitomo Electric and TE Connectivity.
  • This webinar featuring industry-leading experts will explore the current state of standardization efforts and how we are tackling the challenges so that industry can engage this critical integration technology development.
  • This webinar will review the co-packaging standardization efforts in progress and identify implementation challenges for electrical channels, external lasers, optical connectivity, packaging, etc.

OIF Adopts Common Management Interface Specification (CMIS) Work Initiated by QSFP-DD Multi-Source Agreement

Retrieved on: 
Wednesday, January 5, 2022
Telecommunications, Software, Networks, Internet, Hardware, Data Management, Consumer Electronics, Technology, OIF, PLL, MSA, QSFP, Communication, Ownership, Cisco Systems, CMIS, LinkedIn, OSFP, TE Connectivity, Marketing, Ciena, Industry, Maintenance, Online shopping

This specification is targeted to systems manufacturers, system integrators and suppliers of CMIS compliant optical and copper modules.

Key Points: 
  • This specification is targeted to systems manufacturers, system integrators and suppliers of CMIS compliant optical and copper modules.
  • OIF is very well suited to maintain and extend the development of this effort and I look forward to seeing their progress.
  • Adopting CMIS from the QSFP-DD MSA, with the goal to build on and extend the specification is an ideal expansion of OIFs work, said Nathan Tracy, OIF VP of Marketing and TE Connectivity.
  • OIF is where the cloud gets its work done and extending CMIS is a giant step forward and an integral linkage to the other work that OIF members are doing to enable an interoperable ecosystem.

Kandou to Participate at 24th Annual Needham Virtual Growth Conference

Retrieved on: 
Tuesday, January 4, 2022
JEDEC, OIF, Technology, Efficiency, CEO, CFO, Solution, Innovation, Conference

Where: Available through the Needham Conference registration.

Key Points: 
  • Where: Available through the Needham Conference registration.
  • Kandou , an innovative leader in high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates, is revolutionizing wired connectivity with greater speed and efficiency.
  • Kandou has a strong IP portfolio that includes Chord signaling, adopted by the OIF and JEDEC standards organizations.
  • Kandou is a fabless semiconductor company founded in 2011 and headquartered in Lausanne, Switzerland, with offices in Europe, North America and Asia.

Assignar Selects Trevelino/Keller to Drive Awareness and Thought Leadership Position

Retrieved on: 
Tuesday, December 21, 2021
Software, Construction & Property, Public Relations, Investor Relations, Marketing, Data Management, Communications, Technology, Other Construction & Property, OIF, Construction, Tiger Global Management, Trevelino/Keller, Entrepreneurship, Environment, B2B, Public relations, Awareness, Health, CEO, Marketing, Government, Software, Human Development Innovation Fund, Safety, Wall, Partnership, Food, Timesheet, Renewable energy, Technology

Trevelino/Keller will work with Assignar to raise awareness among key target audiences and gain traction in the construction industry with its business and service offerings.

Key Points: 
  • Trevelino/Keller will work with Assignar to raise awareness among key target audiences and gain traction in the construction industry with its business and service offerings.
  • Assignar offers an easy-to-use operations platform for self-perform general and subcontractors on public and private infrastructure projects.
  • The platform streamlines operations and project scheduling as well as tracking crews, equipment, and quantities, while improving quality and safety.
  • This data can be visualized in Assignars customized reports, providing teams with analytics needed for decision-making and business growth.

Kandou Closes $75 Million in Series D Funding

Retrieved on: 
Thursday, December 16, 2021
LinkedIn, Memo Akten, Chief executive officer, Solution, Fiverr, Growth, Partner, Bessemer Venture Partners, Initial public offering, PagerDuty, Pinterest, Foundation, Silicon, CEO, Yelp, OIF, Leadership, Efficiency, IP, Innovation, GLOBE, DocuSign, Technology, JEDEC, Renewable energy, Security (finance), Twilio, Shopify

LAUSANNE, Switzerland, Dec. 16, 2021 (GLOBE NEWSWIRE) -- Kandou , an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series D round of funding, resulting in $75 million raised in the round.

Key Points: 
  • LAUSANNE, Switzerland, Dec. 16, 2021 (GLOBE NEWSWIRE) -- Kandou , an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series D round of funding, resulting in $75 million raised in the round.
  • The total investment in Kandou to date is $207.8 million from new and existing investors.
  • We thank Bessemer Venture Partners for their ongoing commitment to us and welcome new Kandou investors participating in this round.
  • Kandou is a fabless semiconductor company founded in 2011 and headquartered in Lausanne, Switzerland, with offices in Europe, North America and Asia.

Kandou Delivers USB-C Multiprotocol Retimer Product Family for USB4 Support

Retrieved on: 
Tuesday, December 14, 2021
TSMC, Tablet, PCB, Life, FinFET, USB, Adoption, Data-rate units, Kantou, Cyprus, Â, OIF, Efficiency, Innovation, GLOBE, USB4, DisplayPort, Technology, JEDEC, Video game console, Mobile phone, Thunderbolt

LAUSANNE, Switzerland, Dec. 14, 2021 (GLOBE NEWSWIRE) -- Kandou , an innovative leader in high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates, today announced volume production of its Matterhorn family of USB-C multiprotocol retimer solutions with USB4 support.

Key Points: 
  • LAUSANNE, Switzerland, Dec. 14, 2021 (GLOBE NEWSWIRE) -- Kandou , an innovative leader in high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates, today announced volume production of its Matterhorn family of USB-C multiprotocol retimer solutions with USB4 support.
  • Designed on TSMCs N16 advanced FinFET technology, Matterhorn is a USB Type-C 40 Gbps retimer supporting multiple protocols including USB4, USB3.2, DisplayPort and Thunderbolt.
  • We are proud to work hand-in-hand with Kandou todeliver a critical enabler product that will accelerate the adoption of USB4.
  • Kandou is a fabless semiconductor company founded in 2011 and headquartered in Lausanne, Switzerland, with offices in Europe, North America and Asia.

Zenoss Expands Monitoring and AIOps Capabilities for OpenStack Clouds

Retrieved on: 
Tuesday, November 30, 2021
Software, Technology, Networks, Data Management, Neutron, Cloud, Algorithm, Zenoss Core, Automation, NASA, Artificial Intelligence for IT Operations, Health, Microsoft, OIF, COVID-19, Nova, Machine learning, DevOps, Organization, Â, OpenStack, Inc., Video game console

Zenoss Inc., the leader in AI-driven full-stack monitoring, today announced it has released expanded monitoring capabilities for OpenStack , the most widely deployed open-source platform for building and managing private and public clouds.

Key Points: 
  • Zenoss Inc., the leader in AI-driven full-stack monitoring, today announced it has released expanded monitoring capabilities for OpenStack , the most widely deployed open-source platform for building and managing private and public clouds.
  • According to foundation statistics, more than 100 new OpenStack clouds have been deployed in the last 18 months, and the total number of cores under OpenStack control now exceeds 25 million.
  • Zenoss initially released monitoring and analytics capabilities for OpenStack in 2014 and has continuously expanded those capabilities to become the leading monitoring platform for OpenStack.
  • Zenoss provides full-stack monitoring and AIOps for public and private OpenStack clouds and the most popular OpenStack components, including Nova, Neutron, Cinder, Swift and more.

OIF Announces Board of Director Positions, Officers and Working Group Representatives

Retrieved on: 
Wednesday, November 17, 2021
Technology, Networks, Other Technology, Ciena, Physical, Officer, LinkedIn, Intel, Working Group, Industry, Board of directors, Board, OIF, Education Committee, Satellite navigation device, Industrial design, Management

OIF , where the optical networking industrys interoperability work gets done, today announced election results for its Board of Directors, Officers and Working Group representatives.

Key Points: 
  • OIF , where the optical networking industrys interoperability work gets done, today announced election results for its Board of Directors, Officers and Working Group representatives.
  • We congratulate our new and returning members serving on the Board of Directors and in other leadership positions and thank them for their continued commitment to further OIFs mission driving electrical, optical and control interoperability.
  • OIF is where the optical networking industrys interoperability work gets done.
  • Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com .

Broadcom Announces Industry’s First 100G/lane Optical PAM-4 DSP PHYs with Integrated TIA and Laser Driver

Retrieved on: 
Monday, November 8, 2021
Gemera, Efficiency, DSPS, Industry, G20, SAN, NASDAQ, CEO, Automation, Jesko, IEEE, Broadcom Inc., TIA, OIF, GLOBE, Optoelectronics, Solution, Molex, AVGO, DSP, Mobile phone, Video game console

Built on Broadcoms proven 112G PAM-4 DSP platforms, these highly integrated DSP PHYs provide superior performance with lower power enabling 7W 400G DR4/FR4 and sub 14W 800G DR8/2xFR4 optical modules.

Key Points: 
  • Built on Broadcoms proven 112G PAM-4 DSP platforms, these highly integrated DSP PHYs provide superior performance with lower power enabling 7W 400G DR4/FR4 and sub 14W 800G DR8/2xFR4 optical modules.
  • Broadcoms innovative and highly integrated optical DSPs drive industry leading optical module solutions that meet the roadmap needs of our hyperscale cloud customers.
  • Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.
  • Broadcom, the pulse logo, and Connecting everything are among the trademarks of Broadcom.