Footprint Compatible Packaged GaN Family Expands to 150 V for Flexible Design of High-Power Density Applications
View the full release here: https://www.businesswire.com/news/home/20221020005346/en/
- View the full release here: https://www.businesswire.com/news/home/20221020005346/en/
Footprint Compatible Packaged GaN Family Expands to 150 V for Flexible Design of High-Power Density Applications (Graphic: Business Wire)
The EPC2308 GaN FET offers a super small RDS(on), of just 4.9 mOhm typical, together with very small QG, QGD, and QOSS parameters for low conduction and switching losses. - The device features a thermally enhanced QFN package with footprint of just 3 mm x 5 mm, offering an extremely small solution size for the highest power density applications.
- The EPC2308 is footprint compatible with the previously released 100 V, 1.8 mOhm EPC2302 and the 100 V, 3.8 mOhm EPC2306 .
- The EPC2308 combines the advantages of 150 V GaN with an easy to assemble and thermally enhanced QFN package, said Alex Lidow, CEO and co-founder of EPC.