First PCI Express® 5.0 Mini Cool Edge IO™ (MCIO) Interposer
MILPITAS, Calif., Aug. 2, 2022 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of a PCI Express 5.0 Mini Cool Edge IO (MCIO) interposer that works in combination with Teledyne LeCroy's Summit™ family of PCI Express 5.0 protocol analyzers. The new interposer enables engineers to test products that incorporate card edge connectors or cabled connector assemblies that utilize the MCIO mechanical connector with PCIe 5.0, NVM Express® (NVMe) or Compute Express Link™ (CXL) technologies. The PCIe 5.0 MCIO Interposer joins the list of CrossSync™ PHY enabled interposers, allowing users to debug enhanced power management and link training equalization through correlated and time aligned physical and protocol layer views. No other solution gives this type of insight into link behavior.
- Test MCIO-based high-speed interfaces for PCIe, NVMe, or CXL up to 32GT/s
MILPITAS, Calif., Aug. 2, 2022 /PRNewswire/ --Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of a PCI Express 5.0 Mini Cool Edge IO (MCIO) interposer that works in combination with Teledyne LeCroy's Summit family of PCI Express 5.0 protocol analyzers. - The new interposer enables engineers to test products that incorporate card edge connectors or cabled connector assemblies that utilize the MCIO mechanical connector with PCIe 5.0, NVM Express (NVMe) or Compute Express Link (CXL) technologies.
- The Mini Cool Edge IO connector is a flexible, robust, and cost-effective connector and cable assembly that helps equipment designers offer flexibility, reduce overall space requirements, and extend the reach for high data rate signals.
- NVMe and NVM Express are registered trademarks and/or service marks of NVM Express, Inc. CXL and Compute Express Link are trademarks and/or service marks of the Compute Express Link Consortium, Inc.
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