nVent Launches nVent SCHROFF High Thermal Integrated Conduction Cooled Assembly
b"nVent Electric plc (NYSE:NVT) (\xe2\x80\x9cnVent\xe2\x80\x9d), a global leader in electrical connection and protection solutions, today launched a new High Thermal Integrated Conduction Cooled Assembly for the aerospace and defense industries.
- b"nVent Electric plc (NYSE:NVT) (\xe2\x80\x9cnVent\xe2\x80\x9d), a global leader in electrical connection and protection solutions, today launched a new High Thermal Integrated Conduction Cooled Assembly for the aerospace and defense industries.
- Designed for rugged conduction cooled assemblies (CCAs) in VPX systems, the High Thermal Integrated CCA design innovatively removes a thermal interface resulting in up to 40 percent improved module thermal resistance, depending on the configuration.
- The design integrates nVent SCHROFF\xe2\x80\x99s Calmark High Thermal Sawtooth Card-Lok design into the module frame, cost effectively optimizing size, weight and power (SWaP) requirements in military and aerospace systems.\n\xe2\x80\x9cFor customers facing thermal challenges in their VPX systems, leveraging the new High Thermal Integrated CCA technology can help them avoid a major module redesign,\xe2\x80\x9d says Amy Escobio, nVent global marketing director.
- \xe2\x80\x9cThis is because the integrated CCA design is available as a drop-in replacement for traditional VITA conduction cooled modules.\xe2\x80\x9d\nThe High Thermal Integrated CCA meets the latest VITA standards, is designed for high performance/mission critical applications and offers 2nd level maintenance options.