Samsung Electronics Unveils Industry’s Highest-Capacity 12nm-Class 32Gb DDR5 DRAM, Ideal for the AI Era
This achievement comes after Samsung began mass production of its 12nm-class 16Gb DDR5 DRAM in May 2023.
- This achievement comes after Samsung began mass production of its 12nm-class 16Gb DDR5 DRAM in May 2023.
- View the full release here: https://www.businesswire.com/news/home/20230901665102/en/
Samsung Electronics Unveils Industry’s Highest-Capacity 12nm-Class 32Gb DDR5 DRAM, Ideal for the AI Era (Photo: Business Wire)
"With our 12nm-class 32Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1-terabyte (TB), allowing us to be ideally positioned to serve the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data,” said SangJoon Hwang, Executive Vice President of DRAM Product & Technology at Samsung Electronics. - With its 12nm-class 32Gb DDR5 DRAM as a foundation, Samsung plans to continue expanding its lineup of high-capacity DRAM to meet the current and future demands of the computing and IT industry.
- Mass production of the new 12nm-class 32Gb DDR5 DRAM is scheduled to begin by the end of this year.