Hardware acceleration

Nations Technologies Selects QuickLogic's ArcticPro eFPGA to Power its Next Generation Low Power IoT SoC

Retrieved on: 
Wednesday, September 4, 2019

Nations Technologies selected QuickLogic's ArcticPro eFPGA technology due to its ease of implementation, ultra-low power consumption and to maximize the addressable market for its new SoC design.

Key Points: 
  • Nations Technologies selected QuickLogic's ArcticPro eFPGA technology due to its ease of implementation, ultra-low power consumption and to maximize the addressable market for its new SoC design.
  • The inherent flexibility of ArcticPro eFPGA enables unique post-manufacturing design flexibility that significantly expands the applications and use cases for SoCs.
  • ArcticPro eFPGA also provides Nations Technologies with a degree of "future proofing" by making it possible for the SoC to support new functions as the IoT market and customer requirements evolves.
  • "The IoT market is large and fragmented," said Jay Liang, VP of engineering at Nations Technologies.

Global Artificial Intelligence (AI) Chip Market Set to Record a CAGR of 45.2% Between 2019 & 2025 - ASIC Segment Anticipated to Overtake the GPU Type in the Near Future, in Terms of Revenue

Retrieved on: 
Wednesday, August 28, 2019

The current market is quantitatively analyzed from 2018 to 2025 to highlight the financial competency of the AI chip market.

Key Points: 
  • The current market is quantitatively analyzed from 2018 to 2025 to highlight the financial competency of the AI chip market.
  • The global artificial intelligence chip market size was valued at $6,638 million in 2018, and is projected to reach $91,185.1 million by 2025, growing at a CAGR of 45.2% from 2019 to 2025.
  • However, the ASIC segment is anticipated to overtake the GPU type in the near future, in terms of revenue.
  • By industry vertical, the BFSI segment dominated the global artificial intelligence chip market in 2018.

QuickLogic and Retune DSP Partner to Provide Best-in-Class Low Power Voice Control Solutions

Retrieved on: 
Tuesday, August 27, 2019

SAN JOSE, Calif., Aug. 27, 2019 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, today announced that it has partnered with Retune DSP, a leading provider of digital signal processing solutions for voice control and communication, to provide a fully integrated solution for low cost voice control systems.

Key Points: 
  • SAN JOSE, Calif., Aug. 27, 2019 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, today announced that it has partnered with Retune DSP, a leading provider of digital signal processing solutions for voice control and communication, to provide a fully integrated solution for low cost voice control systems.
  • "The voice processing capabilities and integrated programmable logic, processor and DSP engine of the QuickLogic EOS SoC platform made it a great solution for our VoiceSpot Wake Word Engine," said Ulrik Kjems, CEO of Retune DSP.
  • The Retune DSP VoiceSpot wake word engine solution running on QuickLogic's EOS S3 Voice and Sensor Processing Platform is available now.
  • Retune DSP is a world-wide leader in DSP Software Solutions for Voice Control and Voice Communications.

Global FPGA Industry

Retrieved on: 
Monday, August 26, 2019

US FPGA Market Share (in %) by Company: 2019 & 2025

Key Points: 
  • US FPGA Market Share (in %) by Company: 2019 & 2025
    Latent Demand Forecasts in US$ Million by Vertical: 2018 to
    Breakdown in the United States by Vertical: 2019 VS 2025
    Quantitative Demand Analysis in US$ Million by Vertical: 2018
    Programmable Gate Array (FPGA) in US$ Million by Vertical: 2018
    Shift in Japan by Vertical: 2019 VS 2025
    (FPGA) in US$ Million by Vertical: 2018 to 2025
    Demand Scenario in US$ Million by Region/Country: 2018-2025
    Addressable Market Opportunity in US$ Million by Vertical:
    Demand Analysis in France in US$ Million by Vertical: 2018-2025
    Distribution in Germany by Vertical: 2019 VS 2025
    (FPGA) in US$ Million by Vertical: 2018 to 2025
    Shift in the United Kingdom by Vertical: 2019 VS 2025
    Addressable Market Opportunity in US$ Million by Vertical:
    Market Share Analysis by Vertical: 2019 VS 2025
    Demand Analysis in Asia-Pacific in US$ Million by Vertical:
    Market Quantitative Demand Analysis in US$ Million by Vertical:
    Market Share Analysis by Vertical: 2019 VS 2025

Efinix® and Centron Technology Partner to Extend Distribution of Efinix’s Trion® FPGA Silicon Platform in Korea

Retrieved on: 
Wednesday, August 21, 2019

SANTA CLARA, Calif. and SEOUL, South Korea, Aug. 20, 2019 (GLOBE NEWSWIRE) -- Efinix , an innovator in programmable product platforms and technologies, and Centron Technology , a design consulting and manufacturer of Electronics Engineering Systems, today announced a partnership to distribute Efinixs Trion FPGA silicon platform in Korea.

Key Points: 
  • SANTA CLARA, Calif. and SEOUL, South Korea, Aug. 20, 2019 (GLOBE NEWSWIRE) -- Efinix , an innovator in programmable product platforms and technologies, and Centron Technology , a design consulting and manufacturer of Electronics Engineering Systems, today announced a partnership to distribute Efinixs Trion FPGA silicon platform in Korea.
  • Korea and its innovation represent a significant opportunity and Centron Technologys market presence and experience will play a pivotal role in delivering our Trion FPGA silicon platform to customers driving the future of edge AI computing.
  • The response and adoption to Efinixs FPGA technology is powerful and impressive, said Ken D. Lee, CEO and general manager of Centron Technology.
  • Efinix, an innovator in programmable products, drives the future of edge AI computing with its Trion FPGA platform.

NEW H3C Selects Lattice Semiconductor FPGA For New Server Platform

Retrieved on: 
Wednesday, August 21, 2019

Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced that NEW H3C has selected the Lattice MachXO3 FPGA to provide system control logic and I/O extension capabilities for the latest NEW H3C server platform.

Key Points: 
  • Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced that NEW H3C has selected the Lattice MachXO3 FPGA to provide system control logic and I/O extension capabilities for the latest NEW H3C server platform.
  • NEW H3C uses the MachXO3 FPGA on their single, dual, quadruple and 8-socket CPU boards for server, storage, and networking systems.
  • For years, Lattice Semiconductor has been a leading provider of programmable logic solutions for use in server applications, said Andy Zhu, Senior CEG Manager, NEW H3C.
  • Lattice Semiconductor Corporation, Lattice Semiconductor (& design) and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

SEAKR Announces Canada Patent For Advanced ASIC RF Processing Technology For Satellite Applications

Retrieved on: 
Monday, August 12, 2019

CENTENNIAL, Colo., Aug. 12, 2019 /PRNewswire/ --SEAKR Engineering, Inc. (SEAKR) is pleased to announce it has been granted a Canadian patent for an advanced RF processing Application Specific Integrated Circuit (ASIC) technology.

Key Points: 
  • CENTENNIAL, Colo., Aug. 12, 2019 /PRNewswire/ --SEAKR Engineering, Inc. (SEAKR) is pleased to announce it has been granted a Canadian patent for an advanced RF processing Application Specific Integrated Circuit (ASIC) technology.
  • SEAKR's Canadian patent CA 2,953,837 "Integrated Mixed-Signal ASIC with Analog Digital Converter (ADC), Digital Analog Converter (DAC) and Digital Signal Processing (DSP)" marks the firm's 4th patent received globally for its advanced ASIC technology targeted at integrated RF processing for satellite applications1.
  • This patented technology enables high-performance RF processing in satellite applications with reduced size, weight and power (SWaP) to support new missions not previously feasible with discrete designs.
  • tuning and decimation), high-speedSereializer/DeSerilizer (SerDes) inter-chip communications, and including Single Event Upset (SEU) mitigation techniques.SEAKR's RF ASIC technology replaces conventional up/down convert RF electronics with highly integrated RF and digital processing.

Emerging Trends, Drivers and Challenges in the Artificial Intelligence (AI) Market 2019-2023 | Technavio

Retrieved on: 
Monday, August 12, 2019

Related Reports on Technology Hardware, Storage & Peripherals are:

Key Points: 
  • Related Reports on Technology Hardware, Storage & Peripherals are:
    Artificial Intelligence (AI) Market in Retail Sector Global Artificial Intelligence (AI) Market in Retail Sector by application (sales and marketing, in-store, planning, procurement, and production; and logistics management) and geography (APAC, Europe, MEA, North America, and South America).
  • Artificial intelligence (AI) Chips Market Global Artificial intelligence (AI) Chips Market by product (GPUs, ASICs, CPUs, and FPGAs) and geography (the Americas, APAC, and EMEA).
  • Technavio is a leading global technology research and advisory company.
  • Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

TopLine Warns: Loss of Vendor Could Compromise US Defense Industry

Retrieved on: 
Tuesday, August 6, 2019

IRVINE, Calif., Aug. 6, 2019 /PRNewswire/ --TopLine Corporation, a producer of specialized electroniccomponents is raising concerns over potential industry delays to deliver critical defense components, specifically Field Programmable Gate Array (FPGA).

Key Points: 
  • IRVINE, Calif., Aug. 6, 2019 /PRNewswire/ --TopLine Corporation, a producer of specialized electroniccomponents is raising concerns over potential industry delays to deliver critical defense components, specifically Field Programmable Gate Array (FPGA).
  • "Production of FPGA components used in defense and aerospace applications are typically farmed-out to subcontractors," observes TopLine CEO Martin Hart.
  • "Customers in the defense and aerospace industry should be nervous since they rely on a monopoly subcontractor with the ability to raise prices at will because no competition exists.
  • So far, two FPGA makers have taken action to broaden their vendor base for these critical services.

Avery Design Systems Announces SimAccel FPGA Accelerator

Retrieved on: 
Friday, August 2, 2019

Avery Design Systems Inc., an innovator in functional verification productivity solutions, today announced availability of the SimAccel FPGA-based accelerator to achieve 100-1000X speed up over simulation-based verification.

Key Points: 
  • Avery Design Systems Inc., an innovator in functional verification productivity solutions, today announced availability of the SimAccel FPGA-based accelerator to achieve 100-1000X speed up over simulation-based verification.
  • SimAccel provides co-emulation, hardware-software co-verification leveraging our existing VIPs and testsuites and our new synthesizable, retargetable FPGA-based Accelerator System IP (ASIP) and Accelerated VIPs (AVIP).
  • Using design IP from Mobiveil and off the shelf FPGA prototype systems such as from Xilinx and PRO DESIGN provides the advanced hardware platforms necessary to implement multi-FPGA systems.
  • The company has established numerous Avery Design VIP partner program affiliations with leading IP suppliers.