MOSFETs

Insights on the Silicon on Insulator Global Market to 2027 - Opportunity Analysis and Industry Forecasts - ResearchAndMarkets.com

Retrieved on: 
Wednesday, April 14, 2021

This technology is compatible with presently used fabrication process in the industry without retooling or extra equipment of existing factory.

Key Points: 
  • This technology is compatible with presently used fabrication process in the industry without retooling or extra equipment of existing factory.
  • Silicon on insulator catches lot of attention in the design of high-performance circuits.
  • However, the self-heating effects in SOI-based devices act as restraints to the growth of the silicon on insulator market.
  • Moreover, the market players faced challenges in procuring the raw material and delivering the finished goods with the interrupted supply chain.\n'

OmniVision Automotive Image Sensors Compatible with NVIDIA DRIVE Platform, Including Driver Monitoring Imagers for NVIDIA DRIVE Hyperion

Retrieved on: 
Monday, April 12, 2021

The company also unveiled the first group of OmniVision automotive image sensor families compatible with the modular NVIDIA DRIVE AGX\xe2\x84\xa2 AI computing platform for self-driving vehicles.\nOmniVision created drivers and camera modules using its OX08B40 image sensor for front-view automotive applications, including ADAS and Level 3+ autonomous systems.

Key Points: 
  • The company also unveiled the first group of OmniVision automotive image sensor families compatible with the modular NVIDIA DRIVE AGX\xe2\x84\xa2 AI computing platform for self-driving vehicles.\nOmniVision created drivers and camera modules using its OX08B40 image sensor for front-view automotive applications, including ADAS and Level 3+ autonomous systems.
  • Likewise, drivers and camera modules are now available for its OX03F10 and OX03C10 viewing camera image sensors , allowing the development of surround view systems (SVSs), rearview cameras (RVCs) and e-mirror camera monitoring systems with NVIDIA DRIVE.
  • Regardless of the application, OmniVision offers platform software drivers for its image sensors, as well as complete camera modules that customers can easily connect to the NVIDIA DRIVE platform for immediate evaluation.
  • The new 5MP image sensor maintains OmniVision\xe2\x80\x99s record as the only provider of automotive global shutter-image sensors, while increasing the resolution to 5MP.

Electrostatic Chucks (ESC) Market is estimated to expand at a CAGR of 5.5% over the forecast period of 2021-2031

Retrieved on: 
Thursday, April 8, 2021

Growing demand for semiconductor etching is expected to drive market growth substantially through the forecast period of 2021-2031.

Key Points: 
  • Growing demand for semiconductor etching is expected to drive market growth substantially through the forecast period of 2021-2031.
  • The global electrostatic chucks market is estimated to expand at a CAGR of 5.5% over the forecast period of 2021-2031.
  • Currently, the United States is the most demanding market for electrostatic chucks due to presence semiconductor manufacturing companies in the country.
  • This is estimated to fuel the growth of the market for ESCs over the forecast period (2021 to 2031).

Electrostatic Chucks (ESC) Market is estimated to expand at a CAGR of 5.5% over the forecast period of 2021-2031

Retrieved on: 
Thursday, April 8, 2021

Growing demand for semiconductor etching is expected to drive market growth substantially through the forecast period of 2021-2031.

Key Points: 
  • Growing demand for semiconductor etching is expected to drive market growth substantially through the forecast period of 2021-2031.
  • The global electrostatic chucks market is estimated to expand at a CAGR of 5.5% over the forecast period of 2021-2031.
  • Currently, the United States is the most demanding market for electrostatic chucks due to presence semiconductor manufacturing companies in the country.
  • This is estimated to fuel the growth of the market for ESCs over the forecast period (2021 to 2031).

ActLight photodiode technology approved by leading semiconductor foundry and ready for volume production

Retrieved on: 
Thursday, April 8, 2021

LAUSANNE, Switzerland, April 8, 2021 /PRNewswire/ --ActLight, the Swiss technology firm known for its best-in-class signal-to-noise ratio photodiodes,announced today that its IP portfolio has been approved by a leading global semiconductor foundry.

Key Points: 
  • LAUSANNE, Switzerland, April 8, 2021 /PRNewswire/ --ActLight, the Swiss technology firm known for its best-in-class signal-to-noise ratio photodiodes,announced today that its IP portfolio has been approved by a leading global semiconductor foundry.
  • The innovative photodiode technology is now offered to the market through the foundry's official website.
  • The IP based on CMOS 0.18um geometry is now offered globally and ready for volume, high quality productions.
  • ActLight SA, the start-up company founded in 2011 and basedin Switzerland, focuses on the field of photonics by developing a new type of photodetector, the Dynamic PhotoDiode.

ActLight photodiode technology approved by leading semiconductor foundry and ready for volume production

Retrieved on: 
Thursday, April 8, 2021

LAUSANNE, Switzerland, April 8, 2021 /PRNewswire/ --ActLight, the Swiss technology firm known for its best-in-class signal-to-noise ratio photodiodes,announced today that its IP portfolio has been approved by a leading global semiconductor foundry.

Key Points: 
  • LAUSANNE, Switzerland, April 8, 2021 /PRNewswire/ --ActLight, the Swiss technology firm known for its best-in-class signal-to-noise ratio photodiodes,announced today that its IP portfolio has been approved by a leading global semiconductor foundry.
  • The innovative photodiode technology is now offered to the market through the foundry's official website.
  • The IP based on CMOS 0.18um geometry is now offered globally and ready for volume, high quality productions.
  • ActLight SA, the start-up company founded in 2011 and basedin Switzerland, focuses on the field of photonics by developing a new type of photodetector, the Dynamic PhotoDiode.

Global Silicon on Insulator Market (2020 to 2025) - Insights, COVID-19 Impact, Competition and Forecasts - ResearchAndMarkets.com

Retrieved on: 
Thursday, April 1, 2021

The report analyses the Silicon on Insulator Market by Technology (SIMOX, BESOI, Smart Cut, Others).

Key Points: 
  • The report analyses the Silicon on Insulator Market by Technology (SIMOX, BESOI, Smart Cut, Others).
  • The report analyses the Silicon on Insulator Market by Application (Consumer Electronics, Automotive, Entertainment and Gaming, Others).
  • Global Silicon on Insulator Market Segmentation - By Wafer Type, By Technology, By Application
    5.1 Competitive Scenario of Silicon on Insulator Market: By Wafer Type
    5.2 Competitive Scenario of Silicon on Insulator Market: By Technology
    5.3 Competitive Scenario of Silicon on Insulator Market: By Application
    6.
  • Global Silicon on Insulator Market: Regional Analysis
    6.1 Competitive Scenario of Silicon on Insulator Market: By Region
    7.

Odyssey Semiconductor Technologies, Inc. (OTCQB: ODII) Raises $5 Million to Further Develop and Commercialize GaN Power Devices for Electric Vehicles and Solar Energy

Retrieved on: 
Thursday, April 1, 2021

"We welcome the new shareholders to Odyssey Semiconductor and their support in enabling more efficient and compact power conversion for applications such as electric vehicles," said Alex Behfar, Chairman and CEO of Odyssey Semiconductor.

Key Points: 
  • "We welcome the new shareholders to Odyssey Semiconductor and their support in enabling more efficient and compact power conversion for applications such as electric vehicles," said Alex Behfar, Chairman and CEO of Odyssey Semiconductor.
  • "With the entire world focused on the adoption of clean energy and electric power, we're excited about the advancements our technology can bring to the industry."
  • Vertically-conducting GaN-based power devices outperform other devices fabricated using silicon (Si) and silicon carbide (SiC), but they have proven difficult to fabricate using standard methods.
  • The Odyssey team has vast experience supporting diverse semiconductor applications, including power devices, integrated optoelectronics, chemical sensing, and spectroscopy.

Axcelis Announces Multiple Shipments Of Purion High Energy Systems To Leading CMOS Image Sensor Manufacturers

Retrieved on: 
Wednesday, March 31, 2021

BEVERLY, Mass., March 31, 2021 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it has shipped multiple Purion VXE high energy systems to leading CMOS image sensor manufacturers.

Key Points: 
  • BEVERLY, Mass., March 31, 2021 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it has shipped multiple Purion VXE high energy systems to leading CMOS image sensor manufacturers.
  • The Purion VXE is an extended energy range solution for the industry leading Purion XE high energy implanter.
  • The image sensor manufacturing process is very implant intensive, and with our expertise and knowledge in this area, our expanded Purion high energy product family is poised for further growth."
  • These shipments, combined with our recent Purion VXE evaluation closure and Purion XEmax evaluation shipments, enhance our leadership position in this market.

QP Technologies™ Expands Interposer Design Capabilities

Retrieved on: 
Monday, March 29, 2021

ESCONDIDO, Calif., March 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the companys substrate design services announced last year.

Key Points: 
  • ESCONDIDO, Calif., March 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the companys substrate design services announced last year.
  • QP Technologies can develop an interposer-based prototype that enables the customer to avoid the time and expense of recreating the test hardware.
  • QP Technologies provides flexible interposer design alternatives for adapting existing packages to redistribute flip-chip connections to wire bonds or shorten bond wire lengths.
  • Escondido, Calif.-based QP Technologies (formerly Quik-Pak), a division of Promex Industries , provides wafer preparation, IC packaging and assembly, and substrate design and fabrication services in its 20,000-square-foot ISO 9001:2015/ISO-13485:2016-certified, ITAR-registered facility.