TI

DIGITIMES Asia: Why TSMC may have different strategies in Japan and Arizona? Q&A with former TSMC General Counsel Richard Thurston

Retrieved on: 
Tuesday, February 27, 2024
IDM, Well, CHIPS, Online, Senior, Investment, Culture, Government, TSMC, METI, Apple, Angstrom, Workforce, CMOS, Fujitsu, Joint venture, Principal, TI, Renesas Electronics, AMD, Federal, Suggestion, State, Interview, SSMC, Multimedia, Foot, General counsel, Bleeding, Attitude, Research, Sony, Chartered Semiconductor Manufacturing, Friends, IBM, Samsung, Texas Instruments, Communication, MediaTek, UMC, MOTIE, Politics, Semiconductor

Based on your experience in Japan and your work at TSMC, why is semiconductor manufacturing so successful in this part of Asia?

Key Points: 
  • Based on your experience in Japan and your work at TSMC, why is semiconductor manufacturing so successful in this part of Asia?
  • In Japan, pure-play foundries have not yet been successful, and making this business model work in Japan will be challenging.
  • Therefore, I've been in a unique position to observe the successful development of the semiconductor industry in these Asian countries.
  • Online Forum - TSMC Sparks Semiconductor Renaissance in Japan:
    Delve into "TSMC Sparks Semiconductor Renaissance in Japan" at our GeoWatch Webinar.

Rice University President Reginald DesRoches to join TI board of directors

Retrieved on: 
Tuesday, February 20, 2024
School, Rice University, Education, Georgia Tech, Biophysical environment, TI, University, Rice, Structural engineering, Mechanical engineering, Organization, Texas Instruments, Management

DALLAS, Feb. 20, 2024 /PRNewswire/ -- Texas Instruments Incorporated (TI) (Nasdaq: TXN) today announced that Reginald DesRoches, president of Rice University, has been elected to TI's board of directors, effective March 1.

Key Points: 
  • DALLAS, Feb. 20, 2024 /PRNewswire/ -- Texas Instruments Incorporated (TI) (Nasdaq: TXN) today announced that Reginald DesRoches, president of Rice University, has been elected to TI's board of directors, effective March 1.
  • "We're pleased to welcome Reggie to our board," said Rich Templeton, TI's chairman of the board.
  • He has been the president of Rice University in Houston, Texas, since 2022 and a professor of engineering since 2017.
  • Prior to his role as president, he was Rice's Howard Hughes Provost and the William and Stephanie Sick Dean of Engineering.

New portfolios from TI push the limits of power design further, help engineers achieve industry-leading power density

Retrieved on: 
Tuesday, February 20, 2024
Bias, Entertainment center, Silicon, APEC, TI, Texas Instruments, Conference, Gallium nitride, EMI, CISPR, Electric motor

DALLAS, Feb. 20, 2024 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today introduced two new power conversion device portfolios to help engineers achieve more power in smaller spaces, providing the highest power density at a lower cost. TI's new 100V integrated gallium nitride (GaN) power stages feature thermally enhanced dual-side cooled package technology to simplify thermal designs and achieve the highest power density in mid-voltage applications at more than 1.5kW/in3. TI's new 1.5W isolated DC/DC modules with integrated transformers are the industry's smallest and most power-dense, helping engineers shrink the isolated bias power-supply size in automotive and industrial systems by over 89%. Devices from both portfolios will be on display at this year's Applied Power Electronics Conference (APEC), Feb. 25-29 in Long Beach, California.

Key Points: 
  • DALLAS, Feb. 20, 2024 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today introduced two new power conversion device portfolios to help engineers achieve more power in smaller spaces, providing the highest power density at a lower cost.
  • "For power-supply designers, delivering more power in limited spaces will always be a critical design challenge," said Kannan Soundarapandian, general manager of High Voltage Power at TI.
  • We're excited to continue to push the limits of power management by offering innovations that help engineers deliver the highest power density, efficiency and thermal performance."
  • Wednesday, Feb. 28 at 12 p.m. Pacific time: TI General Manager of Industrial Power Design Services Robert Taylor will present an industry session, "To Power Density and Beyond: Breaking Through Barriers to Achieve the Highest Power Density."

China Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report 2023 Featuring 11 Automotive Power Supply Providers and 7 Automotive Power Supply Chip Suppliers

Retrieved on: 
Thursday, February 15, 2024
Stellar, C2000, DC-DC, Research, MOSFET, Infineon Technologies, Silicon, ECU, Temperature, ICS, TI, BYD, OBC, VCU, XPeng P7, PDU, Communication, BOM, Integrated circuit, PFC, Silicon carbide, MCU, Component, Geely, Huawei, Jaguar Land Rover, SAIC Volkswagen, Software, EMI, Hyundai

DUBLIN, Feb. 15, 2024 /PRNewswire/ -- The "Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Feb. 15, 2024 /PRNewswire/ -- The "Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.
  • The integration trend of automotive power supply is clear, and OBCs, DC/DC converters and PDUs are further integrated with electric drive and ECU.
  • Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023 highlights the following:
    Automotive power supply (technology trends, market size, products & solutions, etc.
  • 1.5 Automotive Power Supply Cost, Price and Supply Chain
    5 Research on Vehicle Power Supply Chain (Chips, Components)
    5.2 Key Technology of Vehicle Power Supply: MCU
    5.3 Key Technology of Automotive Power Supply: Power Chip
    5.4 Key Technology of Automotive Power Supply: Isolation Chip
    5.5 Key Technology of Automotive Power Supply: silicon carbide
    5.6 Key Technology of Automotive Power Supply: relay
    6.1 Shenzhen VMAX New Energy Co., Ltd.
    6.6 Tiecheng Information Technology Co., Ltd.
    6.7 Zhuhai Enpower Electric Co., Ltd.
    6.9 Shanghai Huawei Digital Energy Technology Co., Ltd.

Hitek Systems Introduces Agilex® 7 SoC FPGA-Based Radio Development Platform

Retrieved on: 
Thursday, February 15, 2024
Workload, LTE, Intel, Mobile, TI, DDR4, RAN, Radio, IEEE 1588, Documentation, System, Mobile World Congress, Esom, 3GPP, Memory, Radio access network, Kyōto Station, FMC, Ecosystem, SOC, RF, IEEE, DPD, Video game

GERMANTOWN, Md., Feb. 15, 2024 /PRNewswire-PRWeb/ -- Hitek Systems today introduced a new Hitek eSOM7C development platform designed to ease the design and deployment of Intel-based Open Radio Access Network (RAN) architectures (O-RAN) for LTE, 5G and other wireless communications systems, while increasing system interoperability and performance.

Key Points: 
  • Hitek Systems today introduced a new Hitek eSOM7C development platform designed to ease the design and deployment of Intel-based Open Radio Access Network (RAN) architectures (O-RAN) for LTE, 5G and other wireless communications systems, while increasing system interoperability and performance.
  • GERMANTOWN, Md., Feb. 15, 2024 /PRNewswire-PRWeb/ -- Hitek Systems today introduced a new Hitek eSOM7C development platform designed to ease the design and deployment of Intel-based Open Radio Access Network (RAN) architectures (O-RAN) for LTE, 5G and other wireless communications systems, while increasing system interoperability and performance.
  • The new ESOM7C development platform incorporates TI's AFE7769D into Hitek's Intel Agilex® 7 SoC FPGA embedded system on module (eSOM7C) development platform to provide efficient conversion of baseband data into RF signals for single-, dual- and even tri-band wireless systems.
  • "Hitek Systems created the new development platform to help streamline system integration and interoperability to enable more adaptable flexible radio access networks, while enhancing any system integrator's choices, capabilities and time to market" said Tariq Muhammad, President Hitek Systems.

China Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report 2023 - Chinese Chips are Promising in the Evolution from Physical Integration to System Integration - ResearchAndMarkets.com

Retrieved on: 
Thursday, February 15, 2024
Vehicle Technology, Automotive, Other Automotive, General Automotive, EV, Electric Vehicles, Autonomous Driving, Vehicles, Alternative Vehicles, Fuels, Stellar, C2000, DC-DC, Research, MOSFET, Infineon Technologies, Silicon, ECU, Temperature, ICS, TI, BYD, OBC, VCU, XPeng P7, PDU, Communication, BOM, Integrated circuit, PFC, Silicon carbide, MCU, Component, Geely, Huawei, Jaguar Land Rover, SAIC Volkswagen, Software, EMI, Hyundai

The "Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.
  • The integration trend of automotive power supply is clear, and OBCs, DC/DC converters and PDUs are further integrated with electric drive and ECU.
  • Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023 highlights the following:
    Automotive power supply (technology trends, market size, products & solutions, etc.
  • 1.5 Automotive Power Supply Cost, Price and Supply Chain
    5 Research on Vehicle Power Supply Chain (Chips, Components)
    5.2 Key Technology of Vehicle Power Supply: MCU
    5.3 Key Technology of Automotive Power Supply: Power Chip
    5.4 Key Technology of Automotive Power Supply: Isolation Chip
    5.5 Key Technology of Automotive Power Supply: silicon carbide
    5.6 Key Technology of Automotive Power Supply: relay
    6.1 Shenzhen VMAX New Energy Co., Ltd.
    6.6 Tiecheng Information Technology Co., Ltd.
    6.7 Zhuhai Enpower Electric Co., Ltd.
    6.9 Shanghai Huawei Digital Energy Technology Co., Ltd.

TI CEO Haviv Ilan to speak at Morgan Stanley investor conference

Retrieved on: 
Wednesday, February 14, 2024
Growth, Texas Instruments, TI, Conference, Cryptocurrency

DALLAS, Feb. 14, 2024 /PRNewswire/ -- Texas Instruments Incorporated (TI) (Nasdaq: TXN) President and Chief Executive Officer Haviv Ilan will speak at the Morgan Stanley Technology, Media & Telecom Conference in San Francisco on Wednesday, March 6, at 9:30 a.m. Pacific time.

Key Points: 
  • DALLAS, Feb. 14, 2024 /PRNewswire/ -- Texas Instruments Incorporated (TI) (Nasdaq: TXN) President and Chief Executive Officer Haviv Ilan will speak at the Morgan Stanley Technology, Media & Telecom Conference in San Francisco on Wednesday, March 6, at 9:30 a.m. Pacific time.
  • Ilan will field questions from analysts and investors, as well as discuss TI's business outlook and its strategy to address key markets for its analog and embedded processing technologies and how these capabilities position the company for growth.
  • The audio webcast for the conference can be accessed live through the Investor Relations section ( www.ti.com/ir ) of TI's website.
  • An archived replay will be available on the website after his remarks.

ThreatConnect Celebrates Business Growth and Product Innovation in 2023

Retrieved on: 
Monday, February 12, 2024
Momentum, Cyber risk quantification, CRQ, Social media, AI, Intelligence, Research, GRC, Risk management, ATL, OSINT, Generative, Documentum, Growth, TI, Risk, Synthetic media, Trellix, Safety, MITRE, Risk assessment, Organization, CDM, Privacy, CAL, NLP, Framework, Workflow, Natural language, Natural language processing

ARLINGTON, Va., Feb. 12, 2024 /PRNewswire-PRWeb/ -- New and Expanded Customer Relationships, Market Leading Product Releases, and Industry Recognition Drive Momentum for 2024.

Key Points: 
  • We delivered on ambitious product innovation plans, brought on new enterprise customers, and expanded relationships with others.
  • "We delivered on ambitious product innovation plans, brought on numerous new enterprise customers, and expanded relationships with many others.
  • ThreatConnect showed substantial new customer growth in both its threat intelligence operations and cyber risk quantification businesses A particular highlight was the growth in the cyber risk quantification (CRQ) market, where the business doubled.
  • Coming off the momentum of 2023, ThreatConnect is once again poised for growth in 2024 by continuing to provide enterprise customers with leading threat intelligence and risk quantification solutions.

MEK HERO Powered by ZOTAC GAMING Unveils New GeForce RTX™ 40 SUPER Series Gaming Desktop PCs with 3-years of Warranty Coverage for the Graphics Card Component

Retrieved on: 
Wednesday, February 7, 2024
DDR5, GeForce, Gamer, Gold, Research, CUDA, AMD, CPU, NVIDIA, TI, Super Series, GDDR5, SSD, ZOTAC, Ryzen, DLSS, SUPER, MEK, AM5, GDDR6X, Graphics card, NVM Express, PC, M.2 SSD, TB, Video game

IRWINDALE, Calif., Feb. 7, 2024 /PRNewswire-PRWeb/ -- ZOTAC USA Inc., a leading manufacturer of innovative gaming hardware solutions, is thrilled to announce the market launch of three new MEK HERO pre-built Gaming PCs: the MEK HERO A7647S, A7647STI, and A7748S built using the latest ZOTAC GAMING GeForce RTX™ 4070 SUPER Twin Edge OC, ZOTAC GAMING GeForce RTX™ 4070 Ti SUPER Trinity OC White Edition, and ZOTAC GAMING GeForce RTX™ 4080 SUPER Trinity Black Edition Graphic Cards. These are teamed up with AMD Ryzen 5 7600 and Ryzen 7 7700X processors, offering stunning 4K graphics for unprecedented gaming performance with AI-accelerated DLSS 3.5 and Real-Time Ray Tracing, bringing gamers an immersive gaming experience. This new series of MEK HERO offers 3 years of warranty coverage, specifically for the included ZOTAC GAMING GeForce RTX™ 40 SUPER Series Graphics Card component.

Key Points: 
  • This new series of MEK HERO offers 3 years of warranty coverage, specifically for the included ZOTAC GAMING GeForce RTX™ 40 SUPER Series Graphics Card component.
  • Crafted for optimal performance, durability, and an unmatched experience, MEK HERO Gaming PCs with GeForce RTX™ 40 SUPER Series Graphics Cards are tailored to meet the demands of hardcore gamers and content creators alike.
  • The MEK HERO A7748S is a powerhouse gaming PC that features the cutting-edge ZOTAC GAMING GeForce RTX™ 4080 SUPER Trinity Black Edition Graphics Card.
  • (Explore more about ZOTAC warranty: click here)
    MEK HERO Gaming PCs with GeForce RTX™ 40 SUPER Series are available now on Amazon, Newegg, and The ZOTAC STORE.

Texas Instruments prices $3.0 billion of investment grade notes

Retrieved on: 
Tuesday, February 6, 2024
EDGAR, Security (finance), Capital market, Texas Instruments, News, Mizuho Securities, TI, Attention, Prospectus, BofA Securities, Broadridge Financial Solutions, Sale, Mizuho Securities USA

DALLAS, Feb. 5, 2024 /PRNewswire/ -- Texas Instruments Incorporated (TI) (Nasdaq: TXN) today announced the pricing of five series of senior unsecured notes for an aggregate principal amount of $3.0 billion.

Key Points: 
  • DALLAS, Feb. 5, 2024 /PRNewswire/ -- Texas Instruments Incorporated (TI) (Nasdaq: TXN) today announced the pricing of five series of senior unsecured notes for an aggregate principal amount of $3.0 billion.
  • The notes consist of the following:
    $650 million of 4.600% senior unsecured notes due February 8, 2027;
    $650 million of 4.600% senior unsecured notes due February 8, 2029;
    $600 million of 4.850% senior unsecured notes due February 8, 2034;
    $750 million of 5.150% senior unsecured notes due February 8, 2054; and
    $350 million of 5.050% senior unsecured notes due May 18, 2063.
  • The 5.050% notes due 2063 will be a further issuance of, and form a single series with, the $1.2 billion aggregate principal amount of the existing 5.050% notes due 2063 issued by TI on May 18, 2023.
  • Each of the 4.600% notes due 2027, the 4.600% notes due 2029, the 4.850% notes due 2034 and the 5.150% notes due 2054 will be a new issuance.