Moore's law

Researchers Help Keep Pace with Moore’s Law by Exploring a New Material Class

Retrieved on: 
Thursday, March 18, 2021
MOSFETs, Technology, Science and technology, Moore's law, Inventions, Integrated circuit

That was more than 50 years ago, and surprisingly his prediction, now called Moores Law , came true.

Key Points: 
  • That was more than 50 years ago, and surprisingly his prediction, now called Moores Law , came true.
  • The team is applying this new material class to try to meet the requirements of miniaturizing transistors on a dense chip, Dichtel said.
  • We are already exploring this new class of materials for many applications, for instance, chemical sensing.
  • As we continue exploring, we are likely to find even more traits unique to these new materials, Evans said.

Global Semiconductor Silicon Wafer Market 2020-2024 | Emergence of Compact Consumer Electronic Devices to Boost Market Growth | Technavio

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Wednesday, November 4, 2020
Technology, Semiconductor, Chemistry, Physical sciences, Natural sciences, Semiconductor device fabrication, Wafer, MOSFETs, Silicon, SEMI, Self-aligned gate, Moore's law

The growing adoption of wireless computing devices will be one of the significant factors that will propel the semiconductor silicon wafer market growth during 2020-2024.

Key Points: 
  • The growing adoption of wireless computing devices will be one of the significant factors that will propel the semiconductor silicon wafer market growth during 2020-2024.
  • Therefore, the semiconductor silicon wafer market share growth by the consumer electronics segment will be significant during the forecast period.
  • To help clients improve their market position, this semiconductor silicon wafer market forecast report provides a detailed analysis of the market leaders.
  • As the business impact of COVID-19 spreads, the semiconductor silicon wafer market 2020-2024 is expected to have Negative and Inferior growth.

Applied Materials and BE Semiconductor Industries to Accelerate Chip Integration Technology for the Semiconductor Industry

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Thursday, October 22, 2020
Semiconductor device fabrication, MOSFETs, Electronics industry, Packaging, Semiconductor devices, Technology, Integrated circuits, Amat, Moore's law, Applied Materials, Three-dimensional integrated circuit, Materials science

To accelerate this trend, Applied and Besi have formed a joint development program and are establishing a Center of Excellence focused on next-generation chip-to-chip bonding technology.

Key Points: 
  • To accelerate this trend, Applied and Besi have formed a joint development program and are establishing a Center of Excellence focused on next-generation chip-to-chip bonding technology.
  • Challenges in conventional Moores Law scaling are straining the economics and pace of the semiconductor industrys roadmap, said Nirmalya Maity, Corporate Vice President of Advanced Packaging at Applied Materials.
  • Applied looks forward to working with Besi to co-optimize our equipment offerings and accelerate advanced heterogeneous integration technology for our customers.
  • Applied Materials, Inc.(Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

Applied Materials and BE Semiconductor Industries to Accelerate Chip Integration Technology for the Semiconductor Industry

Retrieved on: 
Thursday, October 22, 2020
Semiconductor device fabrication, MOSFETs, Electronics industry, Packaging, Semiconductor devices, Technology, Integrated circuits, Amat, Moore's law, Applied Materials, Three-dimensional integrated circuit, Materials science

To accelerate this trend, Applied and Besi have formed a joint development program and are establishing a Center of Excellence focused on next-generation chip-to-chip bonding technology.

Key Points: 
  • To accelerate this trend, Applied and Besi have formed a joint development program and are establishing a Center of Excellence focused on next-generation chip-to-chip bonding technology.
  • Challenges in conventional Moores Law scaling are straining the economics and pace of the semiconductor industrys roadmap, said Nirmalya Maity, Corporate Vice President of Advanced Packaging at Applied Materials.
  • Applied looks forward to working with Besi to co-optimize our equipment offerings and accelerate advanced heterogeneous integration technology for our customers.
  • Applied Materials, Inc.(Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

U.S. Semiconductor and Solar Cell Manufacturing Market Analytics, Extensive Financial Benchmarks, Metrics and Revenue Forecast 2020-2026 - ResearchAndMarkets.com

Retrieved on: 
Monday, August 24, 2020
Technology, Hardware, Science and technology, Inventions, Technology, Digital electronics, Semiconductor devices, Integrated circuit, Light-emitting diode, Internet of things, International Electron Devices Meeting, Moore's law

This report features vital industry-specific data including metrics, benchmarks, historic numbers, growth rates and forecasts that will save countless hours of research.

Key Points: 
  • This report features vital industry-specific data including metrics, benchmarks, historic numbers, growth rates and forecasts that will save countless hours of research.
  • Semiconductor and Solar Cell Manufacturing, Including Chips, Memory, LEDs, Transistors and Integrated Circuits, Artificial Intelligence (AI), & Internet of Things (IoT) Industry (U.S.) to reach $69,658 million by 2026.
  • Semiconductor and Solar Cell Manufacturing, Including Chips, Memory, LEDs, Transistors and Integrated Circuits, Artificial Intelligence (AI), & Internet of Things (IoT) Industry, including Average EBITDA, Operating Ratios and Sales per Employee.
  • 5) Benchmarking this industry to all U.S. industries

Global Semiconductor Memory Market 2020-2026: Includes Profiles of Key Players IBM, Infineon Technologies, NXP Semiconductors, Samsung Electronics, Intel, Fujitsu, Texas Instruments and Others - ResearchAndMarkets.com

Retrieved on: 
Wednesday, August 19, 2020
Technology, Semiconductor, Companies, Industries, Computing, MOSFETs, Digital electronics, Computer memory, Semiconductor memory, Samsung Electronics, Intel, Samsung, Toshiba, Moore's law

The Global Semiconductor Memory Market size is expected to reach $127.3 billion by 2026, rising at a market growth of 7.5% CAGR during the forecast period.

Key Points: 
  • The Global Semiconductor Memory Market size is expected to reach $127.3 billion by 2026, rising at a market growth of 7.5% CAGR during the forecast period.
  • The rising demand for high-capacity and low-power memory is growing rapidly as modern advanced portable electronic devices boost overall performance with their reduced size.
  • With the growing proliferation of electronic devices and the need for associated capacity, there is, as predicted, a huge demand for semiconductor memory.
  • Based on the Analysis presented in the Cardinal matrix, Texas Instruments, Inc., Toshiba Corporation, IBM Corporation, Samsung Electronics Co., Ltd., and Intel Corporation are the forerunners in the Semiconductor Memory Market.

Alchip Technology Rolls Out High Performance Computing Packaging Capability

Retrieved on: 
Tuesday, May 19, 2020
Electronic engineering, Technology, Electronics, Hardware acceleration, Fabless semiconductor companies, Integrated circuits, MOSFETs, TSMC, System on a chip, Multi-chip module, Application-specific integrated circuit, Moore's law

MILPITAS, Calif., May 19, 2020 /PRNewswire/ --Alchip Technologies, Limited, the high-performance computing ASIC leader, rolled out its Chip-on-Wafer-on-Substrate (CoWoS) packaging capability.

Key Points: 
  • MILPITAS, Calif., May 19, 2020 /PRNewswire/ --Alchip Technologies, Limited, the high-performance computing ASIC leader, rolled out its Chip-on-Wafer-on-Substrate (CoWoS) packaging capability.
  • CoWoS packaging, developed first by TSMC, is critical to successful deployment of today's High-Performance Computing (HPC) ASICs.
  • Today's CoWoS chiplet sets include high performance system-on-a-chip (SoC) and a high-performance memory (HBM) block.
  • According to Alchip Technologies' President and CEO, Johnny Shen, "Packaging is the new 'Moore's Law' for powerful high-performance computing challenges.

The Decline of Moore’s Law and the Rise of the Hardware Accelerator

Rules of thumb, MOSFETs, Futurology, Moore's law, Central processing unit, Knowledge, Time, Computing

Moore's Law created an industry expectation for increasing performance but all good things must come to an end.

Key Points: 
  • Moore's Law created an industry expectation for increasing performance but all good things must come to an end.
  • Clearly, a new approach to the data center infrastructure challenges of an increasingly dynamic and online world is needed one that picks up where Moores Law is leaving off.
  • Specialized processors are changing the face of computing and allowing the innovative spirit of Moores Law to live on, Nagle continued.
  • The decline of Moore's Law should be seen as the dawn of a new age."

FormFactor Introduces the Altius™ Vertical MEMS Probe Card for Advanced Packaging Technologies

Retrieved on: 
Tuesday, February 18, 2020
Semiconductor device fabrication, Materials science, Articles, Probe card, Technology, MOSFETs, Microelectromechanical systems, Moore's law

LIVERMORE, Calif., Feb. 18, 2020 (GLOBE NEWSWIRE) -- To address the wafer test challenges of 2.5/3D advanced packaging technologies, FormFactor, Inc. (NASDAQ:FORM), a leading semiconductor test and measurement supplier, today introduced the Altius vertical MEMS probe card.

Key Points: 
  • LIVERMORE, Calif., Feb. 18, 2020 (GLOBE NEWSWIRE) -- To address the wafer test challenges of 2.5/3D advanced packaging technologies, FormFactor, Inc. (NASDAQ:FORM), a leading semiconductor test and measurement supplier, today introduced the Altius vertical MEMS probe card.
  • Adoption of advanced packaging is accelerating as the benefit of the classic Moores Law transistor shrink diminishes.
  • According to Yole Dveloppement, the overall advanced packaging market will grow at an 8% CAGR, reaching almost US$44 billion in 2024*.
  • The Altius probe card, with its scalable MEMS probe technology, helps accelerate our customers yield improvement on these new manufacturing processes while meeting their aggressive pitch reduction roadmaps.

Hybrid Bonding Patent Landscape Analysis - After Entering the Cmos Image Sensor (CIS) Market in 2016, Hybrid Bonding Technology Has Started to be Investigated by Other Industries - ResearchAndMarkets.com

Retrieved on: 
Wednesday, November 20, 2019
Technology, Hardware, Electronic engineering, Integrated circuits, Electronics, Digital electronics, Technology, Image sensors, Electronic design, MOSFETs, Moore's law, CMOS, Die, Active pixel sensor

The digital electronics market requires a higher density semiconductor memory chip to cater to recently released central processing unit (CPU) components.

Key Points: 
  • The digital electronics market requires a higher density semiconductor memory chip to cater to recently released central processing unit (CPU) components.
  • To answer the growing demand and overcome Moore's law's limits, multiple die stacking has been suggested as a solution.
  • After entering the CMOS Image Sensor (CIS) market in 2016, hybrid bonding technology has started to be investigated by other industries, such as memory.
  • Understanding the IP landscape is becoming key to evaluate the risks and opportunities that go with the development and use of hybrid bonding technology.